All The Claims

We claim:

1. A computer-based method for generating a Web service for use over a digital communications network, comprising:
identifying first and second service components adapted for providing a first and a second functionality for inclusion in a new Web service;
generating a description of the new Web service including a calling structure based on the first and second service components;
creating a transport structure for requests to and responses from the new Web service suited for data transfer over the communications network; and
advertising the new Web service on the communications network.
2. The method of claim 1, wherein the identifying of the service components includes locating available service components.
3. The method of claim 2, wherein the locating includes searching one or more devices linked to the communications network for callable methods.
4. The method of claim 2, wherein the locating is performed based on user-input location or identification information.
5. The method of claim 2, wherein the identifying includes reporting the available service components and receiving a user-input selection of the first and the second service components from the reported available service components.
6. The method of claim 5, wherein the user-input selection defines a relationship between the first and the second service components.
7. The method of claim 1, wherein the transport structure includes a SOAP message envelope.
8. The method of claim 1, wherein the advertising includes registering the new Web service with a Web services registry.
9. The method of claim 8, wherein the registry is a UDDI-based registry.
10. The method of claim 1, wherein the description includes WSDL formatted information.
11. The method of claim 1, wherein the identifying of the first and second components includes using a first service detector operable for detecting service components based on a first criteria to locate the first component and using a second service detector operable for detecting service components based on a second criteria differing from the first criteria to locate the second component.
12. The method of claim 11, further including displaying a set of service detectors including the first and the second service detectors and receiving a user-input selection of the first and the second service detectors from the set of service detectors.
13. A method for generating a Web service, comprising:
receiving an identification of an available service;
generating a description of invoking rules for the available service;
creating a transport structure for client messages to and from the available service over a communications network; and
publishing the available service as a Web service accessible over the communications network.
14. The method of claim 13, wherein the publishing includes registering the Web service with a Web service registry linked to the communications network.
15. The method of claim 14, wherein the Web service registry is a UDDI-based registry.
16. The method of claim 13, wherein the publishing includes advertising the Web service for access to the available service based on user-input criteria and based on the invoking rules.
17. The method of claim 13, the creating a transport structure includes adding transfer protocol headers to the client message based on the communications network.
18. The method of claim 13, wherein the transport structure comprises a SOAP message envelope.
19. The method of claim 13, further including receiving a technologies selection input and wherein the generating, creating, and publishing are performed based on the received technologies selection input.
20. A computer-based method for generating a Web service from existing services available on a computer system, comprising:
locating a first set of available services on the computer system using a first services searching technique;
locating a second set of available services on the computer system using a second services searching technique differing from the first services searching technique;
displaying the first and second sets of available services to a user;
receiving user input selection information indicating one of the available services to include in the Web service; and
generating a Web services framework for the indicated one of the available services to allow the indicated one of the available services to be used located and accessed by a client device using Web service standard communications over a digital communications network.
21. The method of claim 20, wherein the first or the second services searching technique includes querying a naming service.
22. The method of claim 20, wherein the first or the second services searching technique includes using a direct query method.
23. The method of claim 20, further including displaying to the user a set of services searching techniques and receiving input from the user indicating selection of the first and the second services searching techniques from the displayed set of services searching techniques.
24. The method of claim 20, further including receiving search criteria from the user and wherein at least one of the first and the second services searching techniques are performed based on the received search criteria.
25. An apparatus for generating a Web service for use over a digital communications network, comprising:
means for identifying first and second service components adapted for providing a first and a second functionality for inclusion in a new Web service;
means for generating a description of the new Web service including a calling structure based on the first and second service components;
means for creating a transport structure for requests to and responses from the new Web service suited for data transfer over the communications network; and
means for advertising the new Web service on the communications network.
26. The apparatus of claim 25, wherein the means for identifying the service components includes means for locating available service components.
27. The apparatus of claim 26, wherein the identifying means includes means for reporting the available service components and means for receiving a user-input selection of the first and the second service components from the reported available service components.
28. The apparatus of claim 25, wherein the advertising means includes means for registering the new Web service with a Web services registry.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A cushioned wedged insole kit for the treatment of osteoarthritis comprising;
at least one wedged slab having a wedged slab flat bottom and a wedged slab sloping top oriented in a non-parallel manner to the wedged slab flat bottom thereby defining a longitudinal upper edge along a maximum thickness of the wedged slab and a longitudinal lower edge along a minimum thickness of the wedged slab, wherein the sloping top is oriented at a first slab angle from the horizontal that is at least 2.5 degrees and no more than 10 degrees, wherein the wedged slab is formed at least in part of an elastic material that partially collapses under compressive force and rebounds when compressive force is removed;
at least one neutral slab having a neutral slab flat bottom and a neutral slab flat top oriented in a substantially parallel manner to the neutral slab flat bottom, thereby defining a constant neutral slab thickness that is substantially equal to the wedged slab minimum thickness, wherein the neutral slab is formed at least in part of an elastic material that partially collapses under compressive force and rebounds when compressive force is removed; and

at least one sizing chart that cooperates with the wedged slab sloping top and the neutral slab flat top to indicate the outline of at least one shoe size for at least one foot including a lateral shoe edge, wherein the sizing chart cooperates with the wedged slab so that (i) the lateral shoe edge may be in proximity to the wedged slab longitudinal upper edge to facilitate trimming of the wedged slab to create a lateral wedged insole, or (ii) the lateral shoe edge may be in proximity to the wedged slab longitudinal lower edge to facilitate trimming of the wedged slab to create a medial wedged insole.
2. The kit of claim 1, wherein the at least one sizing chart includes (A) a left foot sizing chart to indicate the outline of at least one left foot shoe size including a left foot lateral shoe edge, and (B) a right foot sizing chart to indicate the outline of at least one right foot shoe size including a right foot lateral shoe edge, wherein the left foot sizing chart and the right foot sizing chart cooperate with the wedged slab so that (i) the left foot lateral shoe edge may be in proximity to the wedged slab longitudinal upper edge to facilitate trimming of the wedged slab to create a left foot lateral wedged insole, (ii) the left foot lateral shoe edge may be in proximity to the wedged slab longitudinal lower edge to facilitate trimming of the wedged slab to create a left foot medial wedged insole, (iii) the right foot lateral shoe edge may be in proximity to the wedged slab longitudinal upper edge to facilitate trimming of the wedged slab to create a right foot lateral wedged insole, or (iv) the right foot lateral shoe edge may be in proximity to the wedged slab longitudinal lower edge to facilitate trimming of the wedged slab to create a right foot medial wedged insole.
3. The kit of claim 1, wherein the at least one sizing chart is cuttable and contains the outline of at least five shoe sizes.
4. The kit of claim 1, wherein the at least one wedged slab contains a plurality of encapsulated gas pockets to mimic the fatty globules of a human foot.
5. The kit of claim 4, wherein the plurality of gas pockets are closed cell pockets.
6. The kit of claim 1, wherein the wedged slab sloping top is oriented at a first slab angle from the horizontal that is at least 2.5 degrees and no more than 5 degrees.
7. The kit of claim 6, wherein the wedged slab maximum thickness is no more than 14 millimeters.
8. The kit of claim 7, wherein the wedged slab minimum thickness is at least 4 millimeters.
9. The kit of claim 1, wherein the wedged slab is viscoelastic and partially collapsible to absorb, dissipate and redirect forces and does not completely collapse into a flat configuration, and the sloping top remains oriented at a first slab angle from the horizontal that is within 20 percent of the initial uncollapsed orientation of the sloping top.
10. The kit of claim 9, wherein the wedged slab returns from a partially collapsed state to the original shape within 1 second of the removal of the compressive force.
11. The kit of claim 10, wherein the wedged slab returns from a partially collapsed state to the original shape within 500 milliseconds of the removal of the compressive force.
12. The kit of claim 1, wherein the wedged slab has length of at least 14 inches and a width of at least 4.25 inches.
13. The kit of claim 1, wherein the elastic material is ethylene vinyl acetate (EVA) foam.
14. The kit of claim 1, further including a second wedged slab having a second wedged slab flat bottom and a second wedged slab sloping top oriented in a non-parallel manner to the second wedged slab flat bottom thereby defining a second slab longitudinal upper edge along a second slab maximum thickness of the second wedged slab and a second slab longitudinal lower edge along a second slab minimum thickness of the second wedged slab, wherein the second wedged slab sloping top is oriented at an second slab angle from the horizontal that is no more than half of the first slab angle.
15. A cushioned wedged insole kit for the treatment of osteoarthritis comprising;
a first wedged slab having a first wedged slab flat bottom and a first wedged slab sloping top oriented in a non-parallel manner to the first wedged slab flat bottom thereby defining a first slab longitudinal upper edge along a maximum thickness of the first wedged slab and a first slab longitudinal lower edge along a minimum thickness of the first wedged slab, wherein the first slab sloping top is oriented at a first slab angle from the horizontal that is at least 2.5 degrees and no more than 10 degrees, wherein the first wedged slab is formed at least in part of an elastic material that partially collapses under compressive force and rebounds when compressive force is removed, and wherein the first wedged slab contains a plurality of encapsulated gas pockets to mimic the fatty globules of a human foot;
a second wedged slab having a second wedged slab flat bottom and a second wedged slab sloping top oriented in a non-parallel manner to the second wedged slab flat bottom thereby defining a second slab longitudinal upper edge along a second slab maximum thickness of the second wedged slab and a second slab longitudinal lower edge along a second slab minimum thickness of the second wedged slab, wherein the second wedged slab sloping top is oriented at an second slab angle from the horizontal that is no more than half of the first slab angle, and wherein the first wedged slab contains a plurality of encapsulated gas pockets to mimic the fatty globules of a human foot;
at least one neutral slab having a neutral slab flat bottom and a neutral slab flat top oriented in a substantially parallel manner to the neutral slab flat bottom, thereby defining a constant neutral slab thickness that is substantially equal to the wedged slab minimum thickness, wherein the neutral slab is formed at least in part of an elastic material that partially collapses under compressive force and rebounds when compressive force is removed; and
at least one sizing chart that cooperates with the first wedged slab sloping top, the second wedged slab sloping top, and the neutral slab flat top to indicate the outline of at least five shoe sizes for at least one foot including a lateral shoe edge, wherein the sizing chart cooperates with the first wedged slab so that (i) the lateral shoe edge may be in proximity to the first wedged slab longitudinal upper edge to facilitate trimming of the first wedged slab to create a first lateral wedged insole, or (ii) the lateral shoe edge may be in proximity to the first wedged slab longitudinal lower edge to facilitate trimming of the first wedged slab to create a first medial wedged insole, and the sizing chart cooperates with the second wedged slab so that (i) the lateral shoe edge may be in proximity to the second wedged slab longitudinal upper edge to facilitate trimming of the second wedged slab to create a second lateral wedged insole, or (ii) the lateral shoe edge may be in proximity to the second wedged slab longitudinal lower edge to facilitate trimming of the second wedged slab to create a second medial wedged insole.
16. The kit of claim 15, wherein the at least one sizing chart includes (A) a left foot sizing chart to indicate the outline of at least five left foot shoe sizes including a left foot lateral shoe edge, and (B) a right foot sizing chart to indicate the outline of at least five right foot shoe sizes including a right foot lateral shoe edge, wherein:
(I) the left foot sizing chart and the right foot sizing chart cooperate with the first wedged slab so that (i) the left foot lateral shoe edge may be in proximity to the first wedged slab longitudinal upper edge to facilitate trimming of the first wedged slab to create a first left foot lateral wedged insole, (ii) the left foot lateral shoe edge may be in proximity to the first wedged slab longitudinal lower edge to facilitate trimming of the first wedged slab to create a first foot to medial wedged insole, (iii) the right foot lateral shoe edge may be in proximity to the first wedged slab longitudinal upper edge to facilitate trimming of the first wedged slab to create a first right foot lateral wedged insole, or (iv) the right foot lateral shoe edge may be in proximity to the first wedged slab longitudinal lower edge to facilitate trimming of the first wedged slab to create a first right foot medial wedged insole; and
(II) the left foot sizing chart and the right foot sizing chart cooperate with the second wedged slab so that (i) the left foot lateral shoe edge may be in proximity to the second wedged slab longitudinal upper edge to facilitate trimming of the second wedged slab to create a second left foot lateral wedged insole, (ii) the left foot lateral shoe edge may be in proximity to the second wedged slab longitudinal lower edge to facilitate trimming of the second wedged slab to create a second foot medial wedged insole, (iii) the right foot lateral shoe edge may be in proximity to the second wedged slab longitudinal upper edge to facilitate trimming of the second wedged slab to create a second right foot lateral wedged insole, or (iv) the right foot lateral shoe edge may be in proximity to the second wedged slab longitudinal lower edge to facilitate trimming of the second wedged slab to create a second right foot medial wedged insole.
17. The kit of claim 15, wherein the at least one sizing chart is cuttable.
18. The kit of claim 15, wherein the first wedged slab sloping top is oriented at a first slab angle from the horizontal of substantially 5 degrees and the second wedged slab sloping top is oriented at a second slab angle from the horizontal of substantially 2.5 degrees.
19. The kit of claim 15, wherein the first wedged slab and the second wedged slab are partially collapsible to absorb, dissipate and redirect forces and do not completely collapse into a flat configuration, and the first wedged slab sloping top and the second wedged slab sloping top remain oriented at a first slab angle and a second slab angle from the horizontal that is within 20 percent of the initial uncollapsed orientation of the sloping top.
20. The kit of claim 19, wherein the elastic material is ethylene vinyl acetate (EVA) foam.

1. A device comprising:
a package component comprising a substrate;
a through-via penetrating through the substrate;
a conductive feature over a first surface of the package component and electrically coupled to the through-via;
a polymer comprising a first portion contacting a sidewall of the substrate, and a second portion overlapped by the package component; and
a first dielectric pattern comprising:
a first portion over and aligned to the polymer; and
a second portion over the substrate and vertically misaligned with the polymer.
2. The device of claim 1, wherein the first dielectric pattern comprises an additional polymer.
3. The device of claim 1, wherein the first dielectric pattern comprises a photo-sensitive material.
4. The device of claim 1 further comprising a device die bonded to the package component, with the device die and the first dielectric pattern being on opposite sides of the package component.
5. The device of claim 1, wherein the polymer forms a first ring encircling the substrate and contacting sidewalls of the substrate, wherein the first dielectric pattern comprises a second ring over and aligned to the first ring, and wherein the first ring and the second ring have outer edges aligned to each other.
6. The device of claim 1 further comprising:
a second dielectric pattern forming a ring covering edge portions of the conductive feature, wherein the first dielectric pattern and the second dielectric pattern are formed of a same dielectric material, coplanar with each other, and disconnected from each other; and
a Under-Bump-Metallurgy (UBM) over and in contact with a center portion of the conductive feature.
7. The device of claim 1, wherein the first dielectric pattern is in physical contact with the polymer.
8. A device comprising:
a first device die comprising:
a semiconductor substrate;
a through-via penetrating through the substrate; and
an interconnect structure over the semiconductor substrate;

a second device die underlying and bonded to the first device die;
a molding compound molding the first device die and the second device die therein, wherein the molding compound encircles the first device die and the second device die, and comprises:
a top surface coplanar with a top surface of the interconnect structure; and
a bottom surface coplanar with a bottom surface of the second device die; and

a polymer layer over the interconnect structure, with bottom surfaces of the polymer layer in contact with top surfaces of the molding compound and the interconnect structure.
9. The device of claim 8, wherein the polymer layer comprises a plurality of discrete portions and a ring portion encircling the plurality of discrete portions, and wherein the plurality of discrete portions and the ring portion are physically separated from each other.
10. The device of claim 9, wherein the ring portion has outer edges aligned to edges of the molding compound.
11. The device of claim 9 further comprising:
a plurality of Under-Bump-Metallurgies (UBMs) extending into the discrete portions; and
a plurality of solder regions over and contacting the plurality of UBMs.
12. The device of claim 8, wherein the polymer layer is formed of a photo-sensitive material.
13. The device of claim 8, wherein the molding compound comprises an additional portion overlapped by the first device die.
14. A device comprising:
a package component comprising a substrate, wherein the substrate comprises a front surface, and a back surface over the front surface;
a through-via penetrating through the substrate;
a die underlying and bonded to a front side of the package component;
a polymer encircling, and in physical contact with, sidewalls of the substrate and sidewalls of the die; and
an insulation layer over the substrate, wherein the insulation layer comprises a bottom surface contacting the back surface of the substrate, and a top surface substantially coplanar with a top surface of the polymer, and wherein the through-via penetrates through the insulation layer.
15. The device of claim 14, wherein sidewalls of the insulation layer are in physical contact with sidewalls of the polymer.
16. The device of claim 14, wherein the polymer comprises an outer sidewall forming a ring, wherein the outer sidewall comprises a first portion level with the substrate, and a second portion level with the die, and the first portion and the second portion of the outer sidewall are continuous and vertically aligned with each other.
17. The device of claim 14 further comprising:
a conductive feature over the back surface of the substrate and electrically coupled to the through-via;
a first dielectric pattern forming a ring covering edge portions of the conductive feature;
a Under-Bump-Metallurgy (UBM) over and in contact with a center portion of the conductive feature; and
a second dielectric pattern over and aligned to the polymer, wherein the first dielectric pattern and the second dielectric pattern are separated from each other, and wherein the first and the second dielectric patterns are formed of a same dielectric material.
18. The device of claim 17, wherein the first and the second dielectric patterns comprise a polymer.
19. The device of claim 17, wherein the first and the second dielectric patterns comprise a photo sensitive material.
20. The device of claim 17, wherein the second dielectric pattern forms a ring, with an outer edge of the ring aligned with respective outer edges of the polymer.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A switch device comprising:
a first depletion-mode transistor configured to pass an analog signal between a first node and a second node in a first state and to isolate the first node from the second node in a second state;
a control circuit coupled to a control node of the first depletion-mode transistor, the control circuit configured to isolate the control node from a first supply input in the first state and to couple the control node to the first supply input in the second state; and
a tracking circuit configured to couple the control node of the first depletion-mode transistor to the first node during the first state and to isolate the control node of the first depletion-mode transistor from the first node in the second state.
2. The switch device of claim 1, wherein the control circuit includes:
an inverter having an input coupled to the first supply input; and
an enhancement-mode transistor configured to receive an output of the inverter and to control the control node using the output of the inverter.
3. The switch device of claim 2, including a first voltage discriminator coupled to the first node;
wherein a first supply input of the inverter is configured to be coupled to ground;
wherein a second supply input of the inverter is configured to be coupled to an output of the first voltage discriminator; and
wherein the first voltage discriminator is configured to receive a plurality voltage levels and to provide, at the output of the first voltage discriminator, a voltage level substantially equal to the lowest of the plurality voltage levels.
4. The switch device of claim 3, wherein the plurality of voltage levels includes a voltage level of the first or second supply input.
5. The switch device of claim 3, wherein the plurality of voltage levels includes a voltage level of the first node.
6. The switch device of claim 3, including a second voltage discriminator coupled to the second node and the output of the first discriminator;
wherein the second voltage discriminator is configured to receive a second plurality voltage levels and to provide, at an output of the second voltage discriminator, a voltage level substantially equal to the lowest voltage level of the second plurality voltage levels; and
wherein the second plurality of voltage levels includes a voltage level of the first or second supply input and a voltage level of the second node.
7. The switch device of claim 1, wherein the tracking circuit includes a second depletion-mode transistor coupled to the control node of the first depletion-mode transistor, the second depletion-mode transistor configured to couple the control node of the first depletion-mode transistor to the first node in the first state and to isolate the control node of the first depletion-mode transistor from the first node in the second state.
8. The switch device of claim 7, further including a second supply input coupled to a control node of the second depletion-mode transistor;
wherein the first supply input and the second supply input are configured to receive a first voltage in the first state;
wherein the first supply input is configured to receive a second voltage in the second state;
wherein the second supply input is configured to receive a third voltage in the second state; and
wherein the third voltage is lower than the second voltage and the second voltage is lower than the first voltage.
9. The switch device of claim 1, wherein the tracking circuit includes a first tracking circuit configured to couple the first node to the control node of the first depletion-mode transistor in the first state and to isolate the first node from the control node of the first depletion-mode device in the second state;
wherein the first tracking circuit includes a PMOS transistor coupled in parallel with an NMOS transistor;
wherein a control node of the NMOS transistor is coupled to the first supply; and
wherein a control node of the PMOS transistor is coupled to the first node when a voltage level of the first node is lower than ground level in the first state.
10. The switch device of claim 9, wherein the tracking circuit includes a second tracking circuit configured to couple the second node to the control node of the first depletion-mode transistor in the first state, and to isolate the second node from the control node of the first depletion-mode device in the second state;
wherein the first tracking circuit includes a PMOS transistor coupled in parallel with an NMOS transistor;
wherein a control node of the NMOS transistor is coupled to the first supply; and
wherein a control node of the PMOS transistor is coupled to the first node when a voltage level of the first node is lower than ground level in the first state.
11. The switch device of claim 10, including a third voltage discriminator configured to provide an output to control the PMOS transistor of the first tracking circuit and the PMOS transistor of the second tracking circuit.
12. The switch device of claim 1, wherein a back gate of the first depletion-mode transistor is coupled to the control node of the first depletion-mode transistor.
13. A method comprising:
passing an analog signal between a first node and a second node using a first depletion-mode transistor in a first state;
isolating the first node from the second node in using the first depletion-mode transistor in a second state;
isolating a control node of the first depletion-mode transistor from a first supply input in the first state using a control circuit;
coupling the control node of the first depletion-mode transistor to the first supply input in the second state using the control circuit;
coupling the control node of the first depletion-mode transistor to the first node in the first state using a tracking circuit; and
isolating the control node of the first depletion-mode transistor from the first node in the second state using the tracking circuit.
14. The method of claim 13, wherein coupling the control node of the first depletion-mode transistor to the first node includes coupling the control node of the first depletion-mode transistor to the first node in the first state using a second depletion-mode transistor.
15. The method of claim 14, wherein isolating the first node from the second node includes coupling a negative voltage to the first supply input.
16. The method of claim 15, wherein isolating the first node from the second node includes coupling a second negative voltage to a control node of the second depletion-mode transistor.
17. The method of claim 13, wherein isolating a control node of the first depletion-mode transistor from a first supply input includes coupling a control node of an output transistor of the control node to a supply rail using an inverter, wherein the output transistor is coupled to the first supply input, the control node of the first depletion-mode transistor and an output of the inverter.
18. The method of claim 17, wherein coupling a control node of an output transistor of the control node to a supply rail using an inverter includes providing at the supply rail a lowest voltage using a voltage discriminator of voltages present at the first supply input, the first node and the second node.
19. The method of claim 13, wherein coupling the control node of the first depletion-mode transistor to the first node includes
coupling the control node of an NMOS transistor of a tracking circuit to the first supply input; and
coupling a control node of a PMOS transistor of the tracking circuit to the first node when a voltage level of the first node is lower than ground level in the first state.
20. The method of claim 13, including coupling a back gate of the first depletion-mode transistor to the control node of the first depletion-mode transistor.