All The Claims

1. A method for adjusting the frequency of a local oscillator, comprising the steps of:
receiving a television signal;
determining a first value from said television signal; and
replacing a second value stored in a memory with said first value.
2. The method of claim 1 wherein the step of replacing said second value with said first value is performed only in response to said first value being different than said second value.
3. The method of claim 1 wherein the step of replacing said second value with said first value is performed only in response to said first value being greater than 15 parts per million different than said second value.
4. The method of claim 1 wherein the step of replacing said second value with said first value is performed only in response to said first value being greater than 0.0015% different than said second value.
5. The method of claim 1 wherein the step of determining a first value from said television signal comprises the steps of:
receiving a first data packet;
receiving a second data packet;
determining a difference between the information received in said first data packet and the information in said second data packet; and
determining said first value in response to said difference.
6. The method of claim 5 wherein the information received in said first data packet and said second data packet are time references.
7. An apparatus comprising:
a memory for storing a first oscillator parameter;
an input for receiving a television signal comprising time reference data; and
a processing means for determining a second oscillator parameter in response to said time reference data and storing said second oscillator parameter in said memory.
8. The apparatus of claim 7 wherein said processor replaces said first oscillator parameter with said second oscillator parameter in response to said second oscillator parameter being different than said first oscillator parameter.
9. The apparatus of claim 7 wherein said processor replaces said first oscillator parameter with said second oscillator parameter in response to when said second oscillator parameter being greater than 0.0015% different than said first oscillator parameter.
10. The apparatus of claim 7 wherein said processor replaces said first oscillator parameter with said second oscillator parameter in response to said second oscillator parameter being greater than 15 parts per million different than said first oscillator parameter.
11. The apparatus of claim 7 wherein said first oscillator parameter and said second oscillator parameter is a bit rate multiplier value.
12. A method for updating a digital video signal processor parameter comprising a processing means for:
extracting a first time stamp from a first data packet,
extracting a second time stamp from a second data packet;
determining the time interval between the first time stamp and the second time stamp;
calculating a video signal processor parameter based on said time interval;
replacing a stored video signal processor parameter with said video signal processor parameter.
13. The method of claim 12 wherein said stored video signal processor parameter is replaced with said video signal processor parameter only in response to said video signal processor parameter being different than said stored video signal processor parameter.
14. The apparatus of claim 12 wherein said stored video signal processor parameter is replaced with said video signal processor parameter only in response to said video signal processor parameter being greater than 0.0015% different than said stored video signal processor parameter.
15. The apparatus of claim 12 wherein said stored video signal processor parameter is replaced with said video signal processor parameter only when said video signal processor parameter is greater than 15 parts per million different than said stored video signal processor parameter.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An electronic assembly, comprising:
three or more shaped ferrous core elements mated to one another in a substantially side-by-side fashion, said mated shaped ferrous core elements forming a plurality of winding channels, each winding channel having a respective aperture associated therewith;
a bonded wire winding having a plurality of turns and disposed at least partly within at least one of said channels, said winding further comprising at least two ends which are routed through said respective aperture; and
a termination element comprising a plurality of electrically conductive terminals associated therewith, said plurality of electrically conductive terminals adapted for mating to corresponding electrical interfaces disposed on a printed circuit board, said at least two ends of said winding being in electrical communication with ones of said terminals;
wherein said at least one of said channels associated with said bonded wire winding includes no former or bobbin for said bonded wire winding; and
wherein said bonded wire winding does not protrude below a bottom surface of said termination element.
2. The assembly of claim 1, wherein each of said three or more shaped ferrous core elements comprises a ferrite ER-type core element having a substantially circular center post.
3. The assembly of claim 2, wherein said termination element is bonded to at least one of said plurality of shaped ferrous core elements using an adhesive.
4. The assembly of claim 3, wherein said substantially side-by-side fashion includes a face-to-face mating interface, and at least one other type of mating interface.
5. The assembly of claim 4, wherein at least a portion of said plurality of electrically conductive terminals comprises a substantially circular cross-section.
6. The assembly of claim 4, wherein said printed circuit board further comprises a signal interface to a broadband data connection.
7. The assembly of claim 6, wherein said printed circuit board further comprises an electronic circuit that, in combination with a plurality of inductive devices formed using said three or more shaped ferrous core elements, is compliant with a DSL configuration or service.
8. The assembly of claim 7, wherein said bonded wire winding comprises multiple windings bonded into a unitary physical structure.
9. The assembly of claim 1, wherein said plurality of shaped ferrous core elements are ganged together in an array.
10. The assembly of claim 9, wherein said plurality of shaped ferrous core elements are ganged together in a multiplicity of formations.
11. A digital subscriber line (DSL) electronic assembly, comprising:
a printed circuit board (PCB) having a plurality of inductive devices mounted thereon, said plurality of inductive devices collectively comprising:
a plurality of shaped ferrous core elements mated to one another, said plurality of shaped ferrous core elements forming at least one winding channel when so mated, said plurality of shaped ferrous core elements also collectively forming at least one aperture communicating with said at least one channel when so mated;
a bonded wire winding having a plurality of turns and disposed at least partly within said at least one winding channel, said winding further comprising at least two ends which are routed through said at least one aperture; and
a mounting header, comprising:
a body;
a bottom surface; and
a plurality of electrically conductive terminals protruding from said bottom surface of said mounting header and adapted for mating to traces disposed on a substantially planar surface of said PCB, said at least two ends of said winding being in electrical communication with ones of said terminals;

wherein said bonded wire winding disposed at least partly within said at least one winding channel includes no former or bobbin for said winding.
12. The assembly of claim 11, wherein said bonded wire winding comprises multiple windings bonded into a unitary physical structure.
13. The assembly of claim 12, wherein said plurality of shaped ferrous core elements are ganged together in an array.
14. The assembly of claim 13, wherein said plurality of shaped ferrous core elements are ganged together in a multiplicity of formations.
15. The assembly of claim 14, wherein substantially all of said plurality of turns of said bonded winding are each bonded via an insulative coating to adjacent ones of said winding turns.
16. The assembly of claim 15, wherein said plurality of turns are bonded via a vacuum deposition process.
17. The assembly of claim 11, wherein said plurality of shaped ferrous core elements are mated to one another using at least one face-to-face mating, and at least one other mating other then a face-to-face mating.
18. A method of operating a digital subscriber line (DSL) electronic assembly, comprising:
obtaining a printed circuit board (PCB) having a plurality of inductive devices mounted thereon, said plurality of inductive devices comprising:
a plurality of shaped ferrous core elements mated to one another, said plurality of shaped ferrous core elements forming at least one winding channel when so mated, said plurality of shaped ferrous core elements also collectively forming at least one wire routing aperture communicating with said at least one winding channel with a first portion of said plurality of shaped ferrous core elements mated in a face-to-face disposition and a second portion of said plurality of shaped ferrous core elements mated in non face-to-face disposition;
a bonded wire winding having a plurality of turns and disposed at least partly within said at least one winding channel, said winding further comprising at least two ends which are routed through said at least one wire routing aperture; and
a mounting header for said plurality of shaped ferrous core elements, said mounting header comprising:
a body supporting said plurality of shaped ferrous core elements;
a bottom surface; and
a plurality of electrically conductive terminals protruding from said bottom surface of said mounting header and adapted for mating to said printed circuit board, said at least two ends of said winding being in electrical communication with ones of said terminals;

wherein said bonded wire winding disposed at least partly within said at least one winding channel includes no former or bobbin for said winding; and

disposing said printed circuit board comprising said plurality of inductive devices in a DSL equipment apparatus so as to operative therein.
19. The method of claim 18, wherein said DSL equipment apparatus comprises DSL central office equipment.
20. The method of claim 18, wherein said DSL equipment apparatus comprises DSL home premises equipment.
21. A digital subscriber line (DSL) apparatus, comprising:
at least one DSL modem apparatus; and
an electronic assembly in signal communication with said modem apparatus, the assembly comprising:
a plurality of shaped ferrous core elements mated to one another in a substantially side-by-side fashion, said mated shaped ferrous core elements forming a plurality of winding channels, each winding channel having a respective aperture associated therewith;
a bonded wire winding having a plurality of turns and disposed at least partly within at least one of said channels, said winding further comprising at least two ends which are routed through said respective aperture; and
a termination element comprising a plurality of electrically conductive terminals associated therewith, said plurality of electrically conductive terminals adapted for mating to corresponding electrical interfaces disposed on a printed circuit board associated with said DSL apparatus, said at least two ends of said winding being in electrical communication with ones of said terminals;
wherein said at least one of said channels associated with said bonded wire winding includes no former or bobbin for said bonded wire winding; and
wherein said bonded wire winding is disposed substantially above a bottom surface of said termination element.
22. The apparatus of claim 21, wherein said DSL apparatus comprises DSL central office equipment.
23. The apparatus of claim 21, wherein said DSL apparatus comprises DSL consumer premises equipment.

1. A synchronized controlled oscillation modulator (SCOM), comprising:
at least one controlled oscillation modulator (COM) having a non-hysteresis comparator, a switching stage and a negative feedback loop adapted to achieve conditions for controlled oscillation of a predetermined frequency by means of at least two poles, and
a synchronizing device connected to said COM modulator.
2. A modulator according to claim 1, wherein the synchronizing device comprises an oscillation signal generator.
3. A modulator according to claim 1, wherein the modulator is synchronized by another SCOM modulator comprising any oscillating modulator signal with the frequency of a wanted idle switching frequency.
4. A modulator according to claim 1, comprising a second COM modulator, said synchronizing device being connected between forward paths of said COM modulators and arranged to synchronize the COM modulators with each other.
5. A modulator according to claim 3, wherein said synchronization device comprises a circuit consisting of R, RC or C components.
6. A modulator according to claim 5, wherein said synchronizing device comprises:
a first and a second series resistances (RA, RB), a parallel resistor (Rosc), and a parallel capacitor (Cosc), wherein said first series resistance is connected to a first end of the parallel capacitor and parallel resistor, and said second series resistance is connected to a second end of the parallel capacitor and parallel resistor, and wherein said first and second series resistances are connected to a comparator in the forward path of each modulator respectively.
7. A modulator according to claim 3, wherein said-synchronization-device comprises an active circuit, preferably including at least one high pass filter.
8. A modulator according to claim 1, wherein the modulator is extended by an additional SCOM modulator driven in a full-bridge configuration to achieve a three-level pulse output.
9. A modulator according to claim 8, wherein the modulator is implemented in a PSCPWM system, without common mode high frequency spectral contributions in the three level pulse output.
10. A modulator according to claim 1, wherein the modulator is implemented in a multi-loop MECC (N,M) control system for enhanced noise suppression, where N and M are integers representing the number of local and global control loops respectively.
11. A modulator according to claim 1, further comprising N COM modulators synchronized by an additional synchronization signal or by a common COM signal of said COM modulators.
12. A modulator according to claim 1, further comprising a limiter device to control the PWM modulation depth.
13. A modulator according to claim 1, wherein the modulator is implemented in a general power conversion system, in the general power conversion system is in a DC-AC audio power conversion system.
14. A modulator according to claim 1, wherein the modulator is used to drive an electrodynamic transducer load directly.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A process for the preparation of Neutrophil Inhibitory Factor comprising the step of growing a cell line expressing Neutrophil Inhibitory Factor in an animal component-free medium selected from the group consisting of an inoculum growth medium, a production growth medium and a nutrient feed to give a production culture.
2. A process according to claim 1 wherein the Neutrophil Inhibitory Factor is the protein of SEQ. ID. NO. 3.
3. A process for the according to claim 2 wherein the protein is glycosylated and has a relative molecular weight of about 38.3 to about 64.1 kDa.
4. A process according to claim 2 wherein the protein is about 5 to about 25% mono-sialylated; about 10 to about 30% di-sialylated, about 15 to about 35% tri-sialylated, about 15 to about 45% tetra-sialylated and about 1 to about 20% non-sialylated.
5. A process according to claim 1 wherein the animal component-free production growth medium comprises:
(i) a CHO-III-PFMglucose solution;
(ii) a sodium hypoxanthinethymidine solution; and
(iii) yeast extract.
6. A process according to claim 1 wherein the animal component-free production growth medium comprises:
(i) CHO-III-PFMglucose solution;
(ii) about 5 to about 20 ml per liter (i) of a 10 mM sodium hypoxanthine1.6 mM thymidine solution; and
(iii) about 0.5 to about 5.0 grams per liter (i) yeast extract.
7. A process according to claim 1 wherein the animal component-free production growth medium comprises:
(i) CHO-III-PFMglucose;
(ii) 10.0 ml per liter (i) of a 10 mM sodium hypoxanthine1.6 mM thymidine solution; and
(iii) 1.5 grams per liter (i) yeast extract.
8. A process according to claim 1 further comprising the steps of:
(a) providing an inoculum prepared by incubating a cell line expressing Neutrophil Inhibitory Factor in an animal component-free inoculum growth medium; and
(b) transferring said inoculum to a vessel containing an animal component-free production growth medium.
9. A process according to claim 8 wherein the inoculum growth medium comprises:
(i) a CHO-III-PFMglucose;
(ii) a sodium hypoxanthinethymidine solution;
(iii) an amino acid solution comprising acids selected from the group consisting of L-aspartic acid, L-glutamic acid, L-asparagine, L-proline, L-serine, and L-methionine;
(iv) optionally an L-methionine sulphoximine solution; and
(v) an L-cysteine solution.
10. A process according to claim 8 wherein the inoculum growth medium comprises:
(i) CHO-III-PFMglucose solution;
(ii) about 5 to about 20 ml per liter (i) of a 10 mM sodium hypoxanthine1.6 mM thymidine solution;
(iii) about 5 to about 30 ml per liter (i) of an amino acid solution comprising L-aspartic acid (3.0 gl), L-glutamic acid (2.5 gl), L-asparagine (10.0 gl), L-proline (1.25 gl), L-serine (3.0 gl), and L-methionine (1.5 gl);
(iv) about 0 to about 75 mol per liter (i) of L-methionine sulphoximine; and
(v) about 10 to about 40 mg per liter (i) of L-cysteine.
11. A process according to claim 8 wherein the inoculum growth medium comprises:
(i) CHO-III-PFMglucose;
(ii) 10.0 ml per liter (i) of a 10 mM sodium hypoxanthine1.6 mM thymidine solution;
(iii) 20.0 ml per liter (i) of an amino acid solution comprising L-aspartic acid (3.0 gl), L-glutamic acid 2.5 gl), L-asparagine (10.0 gl), L-proline (1.25 gl), L-serine (3.0 gl), and L-methionine (1.5 gl);
(iv) optionally 1.0 ml per liter (i) of a 25 mM L-methionine sulphoximine solution; and
(v) 25.0 mg per liter (i) of L-cysteine.
12. A process according to claim 8 further comprising the step:
(c) feeding the production culture with at least one nutrient feed.
13. A process according to claim 12 wherein step (c) includes a first nutrient feed and a second nutrient feed.
14. A process according to claim 13 wherein the first nutrient feed is a nutrient feed comprising an aqueous solution of about 100 to about 500 grams of glucose per liter.
15. A process according to claim 13 wherein the first nutrient feed is a nutrient feed comprising an aqueous solution of about 200 grams of glucose per liter.
16. A process according to claim 15 wherein the first nutrient feed is added at a rate of about 0.0 to about 6.0 grams of glucose per liter growth medium per day.
17. A process according to claim 13 wherein the second nutrient feed comprises
(i) a CHO-III-PFM (5) solution with 1 L-cystine, 3 L-tyrosine and without glucose, hypoxanthine, thymidine, L-glutamine, sodium bicarbonate, sodium chloride;
(ii) 25 to 100 ml per liter of solution (i) of a 10 mM sodium hypoxanthine1.6 mM thymidine solution; and
(iii) 5 to 20 grams per liter of solution (i) yeast extract.
18. A process according to claim 13 wherein the second nutrient feed comprises
(i) CHO-III-PFM (5) solution with 1 L-cystine, 3 L-tyrosine and without glucose, hypoxanthine, thymidine, L-glutamine, sodium bicarbonate, sodium chloride;
(ii) 50 ml per liter of solution (i) of a 10 mM sodium hypoxanthine1.6 mM thymidine solution; and
(iii) 7.5 grams per liter of solution (i) yeast extract.
19. A process according to claim 18 wherein the second nutrient feed is fed to the reactor continuously at a rate of approximately 25 mlliter-day.
20. A process according to claim 13 wherein said first nutrient feed comprises about 100 to about 500 grams per liter glucose and said second nutrient feed comprises (1) a CHO-III-PFM (5) solution, (2) about 25 to about 100 ml per liter (1) of a 10 mM sodium hypoxanthine1.6 mM thyandine solution; and (3) about 5 to about 5 grams per liter (1) yeast extract.
21. A process according to claim 12 wherein the nutrient feed is a nutrient feed comprising an aqueous solution of about 100 to about 500 grams of glucose per liter.
22. A process according to claim 12 wherein the nutrient feed is a nutrient feed comprising an aqueous solution of about 200 grams of glucose per liter.
23. A process according to claim 22 wherein the nutrient feed is added at a rate of about 0.0 to about 6.0 grams of glucose per liter growth medium per day.
24. A neutrophil inhibitory factor made by the process of claim 1.
25. An animal component-free production growth medium comprising:
(i) a CHO-III-PFMglucose solution;
(ii) a sodium hypoxanthinethymidine solution; and
(iii) yeast extract.
26. A medium according to claim 25 comprising:
(i) CHO-III-PFMglucose solution;
(ii) about 5 to about 20 ml per liter (i) of a 10 mM sodium hypoxanthine1.6 mM thymidine solution; and
(iii) about 0.5 to about 5.0 grams per liter (i) yeast extract.
27. A medium according to claim 25 comprising:
(i) CHO-III-PFMglucose solution;
(ii) 10.0 ml per liter (i) of a 10 mM sodium hypoxanthine1.6 mM thymidine solution; and
(iii) 1.5 grams per liter (i) yeast extract.
28. A method for the preparation of recombinant proteins comprising the cultivation of mammalian cells expressing an exogenous recombinant protein in the animal component-free growth medium of claim 25.
29. A method according to claim 28 wherein the mammalian cells are Chinese Hamster Ovary cells transfected with a glutamine synthetase plasmid vector containing the DNA coding region for the recombinant protein.
30. A method according to claim 29 wherein the vector is a glutamine synthetasemethionine sulfoximine co-amplification vector selected from pEE14 and pEE14.1.
31. An inoculum growth medium comprising:
(i) a CHO-III-PFMglucose solution;
(ii) a sodium hypoxanthinethymidine solution;
(iii) an amino acid solution comprising acids selected from the group consisting of L-aspartic acid, L-glutamic acid, L-asparagine, L-proline, L-serine, and L-methionine;
(iv) optionally an L-methionine sulphoximine solution; and
(v) an L-cysteine solution.
32. An inoculum growth medium according to claim 31 comprising:
(i) CHO-III-PFMglucose solution;
(ii) about 5 to about 20 ml per liter (i) of a 10 mM sodium hypoxanthine1.6 mM thymidine solution;
(iii) about 5 to about 30 ml per liter (i) of an amino acid solution comprising L-aspartic acid (about 3.0 gl), L-glutamic acid (about 2.5 gl), L-asparagine (about 10.0 gl), L-proline (about 1.25 gl), L-serine (about 3.0 gl), and L-methionine (about 1.5 gl);
(iv) about 0 to about 75 mol per liter (i) of an L-methionine sulphoximine; and
(v) about 10 to about 40 mg per liter (i) of L-cysteine.
33. An inoculum growth medium according to claim 32 comprising:
(i) CHO-III-PFMglucose solution;
(ii) 10.0 ml per liter (i) of a 10 mM sodium hypoxanthine1.6 mM thymidine solution;
(iii) 20.0 ml per liter (i) of an amino acid solution comprising L-aspartic acid (3.0 gl), L-glutamic acid 2.5 gl), L-asparagine (10.0 gl), L-proline (1.25 gl), L-serine (3.0 gl), and L-methionine (1.5 gl);
(iv) optionally 1.0 ml per liter (i) of a 25 mM L-methionine sulphoximine solution; and
(v) 25.0 mg per liter (i) of L-cysteine.
34. A nutrient feed comprising
(i) a CHO-III-PFM (5) solution with 1 L-cystine, 3x L-tyrosine and without glucose, hypoxanthine, thymidine, L-glutamine, sodium bicarbonate, sodium chloride;
(ii) 25 to 111 ml per liter of solution (i) of a 10 mM sodium hypoxanthine1.6 mM thymidine solution; and
(iii) 5 to 20 grams per liter of solution (i) yeast extract.
35. The cell line PFG-01 (ATCC PTA-2503).
36. A method for the preparation of Neutrophil Inhibitory Factor comprising culturing the cell line of claim 35 under conditions promoting expression of Neutrophil Inhibitory Factor and recovering the Neutrophil Inhibitory Factor.
37. A method according to claim 36 wherein the Neutrophil Inhibitory factor comprises the amino acid sequence of SEQ. ID. NO. 3.
38. A Neutrophil Inhibitory Factor prepared by culturing the cell line PFGOl (ATCC PTA-2503).
39. A Neutrophil Inhibitory Factor prepared by the method of claim 36 or 37.
40. A process according to any of claims 1 to 23 wherein said cell line is PFG01 (ATCC PTA-2503).
41. A Neutrophil Inhibitory Factor made by the process of any of claims 2 to 23.
42. An isolated Neutrophil Inhibitory Factor having neutrophil inhibitory activity and comprising the amino acid sequence of SEQ. ID. NO. 3 that is produced by cell line PFG01 (ATCC PTA-2503).