All The Claims

1. An air suspension system for a passenger vehicle comprising:
at least four corner assemblies, two of the corner assemblies in a front end and two of the corner assemblies in a rear end;
an air supply unit including an ECU, a reservoir, a compressor, and a valve block fluidly connected to the four corner assemblies, wherein the air supply unit is capable of independently adjusting the four corner assemblies; and
wherein the air suspension system is operable to place the four corner assemblies in an unloading mode corresponding to the front corner assemblies in a raised position and the rear corner assemblies in a lowered position, and wherein the air suspension system is operable to place the four corner assemblies in a trailer unloading mode with the front corner assemblies in a lowered position and the rear corner assemblies in a raised position; and
wherein the air pressure can be adjusted to maintain a position of the vehicle as weight is removed in one of said modes.
2. The air suspension system of claim 1, wherein the electronic control unit is controllably connected to valves within fluid lines of the air suspension system to control air supply to control the air supply between the reservoir for the air suspension system and the corner assemblies.
3. The air suspension system of claim 2, the compressor is fluidly connected to the reservoir to maintain a desired fluid pressure within the air suspension system, and wherein operation of the compressor is controlled by the electronic control unit.
4. The air suspension system of claim 1, wherein the air suspension system is one of a closed system and an open system.
5. The air suspension system of claim 1, wherein the raised position corresponds to the furthest point the corresponding suspension corner may be raised and wherein the lowered position corresponds to the lowest position the corresponding suspension corner may be lowered.
6. The air suspension system of claim 1, wherein the unloading mode can be selected by one of a selector in the vehicle and a button on a key fob.
7. The air suspension system of claim 1, wherein the trailer unloading mode has a lower angle between the ground and the rear of the trailer than a normal operating mode, such that the trailer unloading mode can be used to load an object on the vehicle.
8. A suspension system as described in claim 1 wherein when said vehicle accelerates above a certain speed in the forward direction the suspension system is lowered by first lowering the front corner assemblies and then the rear corner assemblies and when the vehicle decelerates below a predefined threshold the rear corner assemblies are first raised and the front assemblies are then raised.
9. A method of adjusting an air suspension system for a vehicle comprising:
detecting with an electronic control unit for the air suspension system that one of an unloading mode and trailer unloading mode has been selected;
controlling air supply within the air suspension system to move two front corner assemblies upward for an unloading mode and downward for a trailer unloading mode and moving two rear corner assemblies downward for an unloading mode and upward for a trailer unloading mode; and
adjusting the air pressure in the corner assemblies to maintain a position of the vehicle as weight is removed in one of said modes.
10. A method of adjusting an air suspension system for a vehicle described in claim 9 further comprising:
lowering the vehicle when the vehicle accelerates forward above a predefined speed by first lowering the front corner assemblies and then lowering the rear corner assemblies and raising the vehicle when the vehicle decelerates below a certain threshold by first raising the rear corner assemblies and then raising the front corner assemblies.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for combing a video signal, the method comprising:
assigning a weight to a 3D comb mesh value; and
blending combing according to the assigned weight of the 3D comb mesh value.
2. The method according to claim 1, further comprising accumulating the weighted 3D comb mesh value to generate accumulated mesh value.
3. The method according to claim 2, further comprising reducing the accumulated mesh value to a saturation value, if the accumulated mesh value exceeds the saturation value.
4. The method according to claim 2, further comprising resetting the accumulated mesh value to zero, if the 3D comb mesh value is smaller than a first threshold value.
5. The method according to claim 2, further comprising generating a multiplier according to the accumulated mesh value.
6. The method according to claim 5, further comprising blending the multiplier, if the accumulated mesh value is between a second threshold value and a third threshold value.
7. The method according to claim 6, further comprising varying blending over a determined range between the second threshold value and the third threshold value.
8. The method according to claim 6, further comprising setting the multiplier to zero, if the accumulated mesh value is at most equal to the second threshold value.
9. The method according to claim 6, further comprising setting the multiplier to one, if the accumulated mesh value is at least equal to the third threshold value.
10. The method according to claim 6, further comprising blending combing according to the blended multiplier and the 3D comb mesh value.
11. The method according to claim 5, further comprising disabling 3D combing, if the multiplier is zero.
12. The method according to claim 5, further comprising 3D combing according to the 3D comb mesh value, if the multiplier is one.
13. A machine-readable storage having stored thereon, a computer program having at least one code section for combing a video signal, the at least one code section being executable by a machine for causing the machine to perform steps comprising:
assigning a weight to a 3D comb mesh value; and
blending combing according to the assigned weight of the 3D comb mesh value.
14. The machine-readable storage according to claim 13, further comprising code for accumulating the weighted 3D comb mesh value to generate accumulated mesh value.
15. The machine-readable storage according to claim 14, further comprising code for reducing the accumulated mesh value to a saturation value, if the accumulated mesh value exceeds the saturation value.
16. The machine-readable storage according to claim 14, further comprising code for resetting the accumulated mesh value to zero, if the 3D comb mesh value is smaller than a first threshold value.
17. The machine-readable storage according to claim 14, further comprising code for generating a multiplier according to the accumulated mesh value.
18. The machine-readable storage according to claim 17, further comprising code for blending the multiplier, if the accumulated mesh value is between a second threshold value and a third threshold value.
19. The machine-readable storage according to claim 18, further comprising code for varying blending over a determined range between the second threshold value and the third threshold value.
20. The machine-readable storage according to claim 18, further comprising code for setting the multiplier to zero, if the accumulated mesh value is at most equal to the second threshold value.
21. The machine-readable storage according to claim 18, further comprising code for setting the multiplier to one, if the accumulated mesh value is at least equal to the third threshold value.
22. The machine-readable storage according to claim 18, further comprising code for blending combing according to the blended multiplier and the 3D comb mesh value.
23. The machine-readable storage according to claim 17, further comprising code for disabling 3D combing, if the multiplier is zero.
24. The machine-readable storage according to claim 17, further comprising code for 3D combing according to the 3D comb mesh value, if the multiplier is one.
25. A system for combing a video signal, the system comprising:
at least one processor that assigns a weight to a 3D comb mesh value; and
the at least one processor blends combing according to the assigned weight of the 3D comb mesh value.
26. The system according to claim 25, further comprising first circuitry that accumulates the weighted 3D comb mesh value to generate accumulated mesh value.
27. The system according to claim 26, further comprising second circuitry that reduces the accumulated mesh value to a saturation value, if the accumulated mesh value exceeds the saturation value.
28. The system according to claim 26, further comprising reset circuitry that resets the accumulated mesh value to zero, if the 3D comb mesh value is smaller than a first threshold value.
29. The system according to claim 26, further comprising a third circuitry that generates a multiplier according to the accumulated mesh value.
30. The system according to claim 29, wherein the third circuitry blends the multiplier, if the accumulated mesh value is between a second threshold value and a third threshold value.
31. The system according to claim 30, wherein the third circuitry varies blending over a determined range between the second threshold value and the third threshold value.
32. The system according to claim 30, wherein the third circuitry sets the multiplier to zero, if the accumulated mesh value is at most equal to the second threshold value.
33. The system according to claim 30, wherein the third circuitry sets the multiplier to one, if the accumulated mesh value is at least equal to the third threshold value.
34. The system according to claim 30, wherein the at least one processor blends combing according to the blended multiplier and the 3D comb mesh value.
35. The system according to claim 29, wherein the at least one processor disables 3D combing, if the multiplier is zero.
36. The system according to claim 29, wherein the at least one processor 3D combs according to the 3D comb mesh value, if the multiplier is one.
37. The system according to claim 29, wherein the third circuitry comprises an estimation circuitry.
38. The system according to claim 27, wherein the second circuitry comprises a saturation circuitry.
39. The system according to claim 26, wherein the first circuitry comprises an adder.

1. A trench isolation method of a semiconductor device comprising:
preparing a semiconductor substrate having an N-MOS region and a P-MOS region;
forming a first mask pattern exposing an N-MOS field region on the N-MOS region, and forming a second mask pattern exposing a P-MOS field region on the P-MOS region;
etching the semiconductor substrate of the N-MOS field region and the P-MOS field region exposed by the first and second mask patterns respectively, thereby forming a first preliminary trench and a second preliminary trench;
forming a first photoresist pattern covering the P-MOS region and exposing the N-MOS region on the semiconductor substrate having the first and second preliminary trenches;
implanting first impurity ions into inner walls of the first preliminary trench, using the first mask pattern and the first photoresist pattern as ion implantation masks, thereby forming a first impurity layer, a portion of the first impurity layer being formed to extend below the first mask pattern;
removing the first photoresist pattern;
anisotropically etching the semiconductor substrate having the first and second preliminary trenches, using the first and second mask patterns as etch masks, thereby forming a first trench and a second trench, and concurrently, forming a first impurity pattern of the first impurity layer remaining below the first mask pattern; and
forming a trench isolation layer filling the first and second trenches.
2. The method according to claim 1, wherein the first and second mask patterns each comprise a pad oxide pattern and a hard mask pattern, which are sequentially stacked.
3. The method according to claim 2, wherein the hard mask pattern comprises a silicon nitride layer or silicon oxynitride (SiON) layer.
4. The method according to claim 1, wherein the first impurity ions are impurity ions of Group III.
5. The method according to claim 4, wherein the first impurity ions are implanted by an ion implantation method using about 0.2 to about 100 keV of energy.
6. The method according to claim 4, wherein the first impurity ions are implanted at a dose of about 1\xd71011 to about 1\xd71016 ionscm2.
7. The method according to claim 1 further comprising:
forming a second photoresist pattern covering the N-MOS region and exposing the P-MOS region;
implanting second impurity ions into inner walls of the second preliminary trench, using the second photoresist pattern and the second mask pattern as ion implantation masks, thereby forming a second impurity layer, a portion of the second impurity layer being formed to extend below the second mask pattern; and
removing the second photoresist pattern.
8. The method according to claim 7, wherein etching the semiconductor substrate further forms a second impurity pattern of the second impurity layer remaining below the second mask pattern concurrently with the formation of the second trench.
9. The method according to claim 7, wherein the second impurity ions comprise boron (B), boron difluoride (BF2), arsenic (As), phosphorus (P), or indium (In) ions.
10. The method according to claim 7, wherein the second impurity ions are implanted by an ion implantation method using about 0.2 to about 100 keV of energy.
11. The method according to claim 7, wherein the second impurity ions are implanted at a dose of about 1\xd71011 to about 1\xd71016 ionscm2.
12. The method according to claim 7, further comprising annealing the semiconductor substrate having the first and second impurity layers formed thereon.
13. The method according to claim 12, wherein the annealing operation is performed at a temperature of 600\xb0 C. to 1000\xb0 C.
14. The method according to claim 1, wherein the operation of forming the trench isolation layer comprises:
forming an insulating layer for isolation filling the first and second trenches on an overall surface of the semiconductor substrate having the first and second trenches;
planarizing the insulating layer for isolation until the first and second mask patterns are exposed; and
removing the exposed first and second mask patterns, thereby exposing the semiconductor substrate.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for manufacturing a liquid container in which a negative pressure generating member is contained in a first recessed portion separated from a second recessed portion by a partition wall with a communication portion formed therein, the method comprising:
a compression step of pressing, before the negative pressure generating member is placed in the first recessed portion, a plurality of outer surfaces of the negative pressure generating member so that the negative pressure generating member becomes smaller than an opening of the first recessed portion, the plurality of outer surfaces of the negative pressure generating member including a first outer surface which is pressed by a first compression member and which is to contact a surface of the partition wall positioned in the first recessed portion and a second outer surface which is pressed by a second compression member and which is to contact an inner surface of the first recessed portion lying opposite the partition wall; and
a placing step of placing the negative pressure generating member in the first recessed portion while releasing the pressure exerted on the first outer surface by the first compression member and while maintaining the pressure exerted on the second outer surface by the second compression member so that the negative pressure generating member is positionally biased toward the partition wall, and after the negative pressure generating member is placed in the first recessed portion, releasing the pressure exerted on the second outer surface by the second compression member.
2. The method for manufacturing a liquid container according to claim 1, wherein the compression step includes a step of keeping the negative pressure generating member compressed at a position opposite to the opening of the first recessed portion, and
the placing step includes a step of moving an insertion pawl extending from the second compression member, along the inner surface of the first recessed portion, and then moving the negative pressure generating member from the opposite position into the first recessed portion.
3. The method for manufacturing a liquid container according to claim 2, wherein in the placing step, in a case where the negative pressure generating member is moved from the opposite position into the first recessed portion, the surface of the partition wall is positioned more outwardly than the first outer surface of the negative pressure generating member pressed by the first compression member.
4. The method for manufacturing a liquid container according to claim 2, wherein in the placing step, in a case where the negative pressure generating member is moved from the opposite position into the first recessed portion, a first insertion pawl extending from the first compression member is inserted into a vicinity of the opening of the first recessed portion and a second insertion pawl extending from the second compression member is inserted into a vicinity of a bottom of the first recessed portion.
5. The method for manufacturing a liquid container according to claim 1, comprising a plurality of compression members including the first and second compression members, and
the plurality of compression members form an insertion pipe surrounding the plurality of outer surfaces when the negative pressure generating member is compressed.
6. The method for manufacturing a liquid container according to claim 1, further comprising a step of fixing a cover member covering the opening of the first recessed portion and an opening of the second recessed portion.
7. An apparatus for manufacturing a liquid container in which a negative pressure generating member is contained in a first recessed portion separated from a second recessed portion by a partition wall with a communication portion formed therein, the apparatus comprising:
a compression unit configured to press, before the negative pressure generating member is placed in the first recessed portion, a plurality of outer surfaces of the negative pressure generating member by a compression member so that the negative pressure generating member becomes smaller than an opening of the first recessed portion, the plurality of outer surfaces of the negative pressure generating member including a first outer surface which is to contact a surface of the partition wall positioned in the first recessed portion and a second outer surface which is to contact an inner surface of the first recessed portion lying opposite the partition wall; and
a placing unit configured to place the negative pressure generating member in the first recessed portion while releasing the pressure exerted on the first outer surface by the compression member and while maintaining the pressure exerted on the second outer surface by the compression member so that the negative pressure generating member is positionally biased toward the partition wall, and after the negative pressure generating member is placed in the first recessed portion, release the pressure exerted on the second outer surface by the compression member,
wherein the compression member includes a first compression member pressing the first outer surface and a second compression member pressing the second outer surface,
the compression unit keeps the negative pressure generating member compressed at a position opposite to the opening of the first recessed portion, and
the placing unit moves an insertion pawl extending from the second compression member, along the inner surface of the first recessed portion, and then moves the negative pressure generating member from the opposite position into the first recessed portion.
8. The apparatus for manufacturing a liquid container according to claim 7, wherein in a case where the negative pressure generating member is moved from the opposite position into the first recessed portion, the surface of the partition wall is positioned more outwardly than the first outer surface of the negative pressure generating member pressed by the first compression member.
9. The apparatus for manufacturing a liquid container according to claim 7, wherein the placing unit causes, in a case where the negative pressure generating member is moved from the opposite position into the first recessed portion, a first insertion pawl extending from the first compression member to be inserted into a vicinity of the opening of the first recessed portion and a second insertion pawl extending from the second compression member to be inserted into a vicinity of a bottom of the first recessed portion.