All The Claims

1. A system for media and commerce management comprising:
a user interface;
a customer overview module accessible through the user interface and configured to allow a user to manage customers;
a search module accessible through the user interface and configured to allow the user to search for one or more of orders, customers, contacts, activities, leads campaigns, and opportunities;
an activities module accessible through the user interface and configured to allow the user to manage tasks;
an opportunities module accessible through the user interface and configured to allow the user to track potential opportunities for sales;
a campaign module accessible through the user interface and configured to allow the user to create and manage plans to generate sales; and
a leads module accessible through the user interface and configured to allow the user to manage potential customers.
The claims below are in addition to those above.
All refrences to claims which appear below refer to the numbering after this setence.

1. A method for generating a tomographic temperature map in a patient using a CT device, the method comprising:
sampling and tomographically reconstructing attenuation values of tissue based on at least two mutually different X-ray energies or X-ray energy spectra relative to at least two sets of energy-dependent image data to generate tomographic image data;
performing a rhoZ decomposition of the tomographic image data, and ascertaining a current local density and a current local mean Z value for each location;
ascertaining a local temperature distribution in the tissue, current local temperature values being determined from previously experimentally determined or calculated relations between Z values, density and temperature; and
at least one of outputting and visualizing a spatial temperature distribution based on the ascertaining.
2. The method as claimed in claim 1, wherein for a plurality of Z values, density and temperature curves or density and temperature tables are used in order to ascertain the temperature.
3. The method as claimed in claim 1, wherein mean Z values are used in which the composition of the currently investigated tissue is taken into account.
4. The method as claimed in claim 1, further comprising:
determining how the Z values change during heating, and
density-temperature relations assigned to a Z0 value initially determined under physiological conditions are used for ascertaining the temperature.
5. The method as claimed in claim 1, wherein sectional image data sets are used as tomographic image data.
6. The method as claimed in claim 1, wherein volume image data sets are used as tomographic image data.
7. The method as claimed in claim 1, wherein the sets of tomographic image data acquired in multiple iterations of the method are registered on top of one another.
8. The method as claimed in claim 1, wherein the determined temperature map is overlaid with tomographic image data registered thereon.
9. A computing unit including a non-transitory computer readable storage medium in which computer programs or program modules are stored, the computing unit being configured to perform, during operation, at least the following:
sampling and tomographically reconstructing attenuation values of tissue based on at least two mutually different X-ray energies or X-ray energy spectra relative to at least two sets of energy-dependent image data to generate tomographic image data;
performing a rhoZ decomposition of the tomographic image data, and ascertaining a current local density and a current local mean Z value for each location;
ascertaining a local temperature distribution in the tissue, current local temperature values being determined from previously experimentally determined or theoretically calculated relations between Z values, density and temperature; and
at least one of outputting and visualizing a spatial temperature distribution based on the ascertaining.
10. A CT system including a computing unit as claimed in claim 9.
11. A non-transitory computer readable medium including program segments for, when executed on a computer device, causing the computer device to implement the method of claim 1.
12. The method as claimed in claim 2, wherein mean Z values are used in which the composition of the currently investigated tissue is taken into account.
13. The method as claimed in claim 2, further comprising:
determining how the Z values change during heating, and
density-temperature relations assigned to a Z0 value initially determined under physiological conditions are used for ascertaining the temperature.
14. The method as claimed in claim 2, wherein sectional image data sets are used as tomographic image data.
15. The method as claimed in claim 2, wherein volume image data sets are used as tomographic image data.
16. The method as claimed in claim 2, wherein the sets of tomographic image data acquired in multiple iterations of the method are registered on top of one another.
17. The method as claimed in claim 2, wherein the determined temperature map is overlaid with tomographic image data registered thereon.

1. An autoidentification user feedback system, comprising:
an optical imager for capturing an image of a target;
a radiofrequency identification reader for interrogating said target;
an illumination source associated with said optical imager and aligned to emit light of a first color and a second color onto said target; and
a microcontroller interconnected to said imager, said reader, and said illumination source, wherein said microcontroller is programmed to operate said illumination source to emit light of said first color when reader successfully reads said target and is further programmed to operate said illumination source to emit light of said second color when reader unsuccessfully read a target;
a host interface for interconnecting said microcontroller to a host device; and
wherein said microcontroller is further programmed to include a command interpreter for interpreting commands received from said host device through said host interface and operating said first autoidentification reader and said second autoidentification reader based on said host commands and then sending data to said host device through said host interface.
2-5. (canceled)
6. The system of claim 5, wherein said optical imager successfully reads a target by recognizing barcode information in a captured image.
7. The system of claim 6, wherein said reader successfully reads a target by interrogating a remotely positioned radiofrequency identification tag and receiving data from said tag.
8. The system of claim 7, wherein said first color and said second color are different.
9. The system of claim 1, wherein said illumination source emits light of a third color.
10. The system of claim 9, wherein said microcontroller is programmed to operate said illumination source to emit light of said first color when said imager successfully reads a target, to operate said illumination source to emit light of said third color when said reader successfully reads a target, and to operate said illumination source to emit light of said second color when said imager or said reader unsuccessfully read a target.
11. The system of claim 10, wherein said first light is green, said second light is blue, and said third light is red.
12. A method of providing user feedback in an autoidentification system, comprising the steps of:
directing an illumination source at a target;
activating at least a first autoidentification reader based on the receipt of commands send by a host device;
determining whether said imager or reader successfully read said target;
illuminating said target with light of a first color if said first reader successfully read said target; and
illuminating said target with light of a second color if said first reader did not successfully read said target.
13. The method of claim 12, wherein said first color is green and said second color is red.
14. The method of claim 12, further comprising the step of activating a second autoidentification reader.
15. The method of 13, further comprising the step of illuminating said target with light of a third color if said second reader successfully read said target.
16. The method of claim 14, wherein said first color is green, said second color is red, and said third color is blue.

The claims below are in addition to those above.
All refrences to claims which appear below refer to the numbering after this setence.

1. A semiconductor device comprising:
a semiconductor substrate comprising an electronic component formed on a top surface of the semiconductor substrate;
a supporting member having a bottom surface and a top surface and bonded to the semiconductor substrate;
an adhesive layer attaching the bottom surface of the supporting member to the top surface of the semiconductor substrate; and
an electrode disposed on the bottom surface of the supporting member and electrically connected with the electronic component,
wherein the supporting member comprises a depressed portion formed from the top surface of the supporting member.
2. The semiconductor device of claim 1, wherein the supporting member has a through-hole penetrating through the supporting member, and the electrode is electrically connected with an electrode of another device through the through-hole.
3. The semiconductor device of claim 1, further comprising a first conductive terminal electrically connected with the electrode and provided in the through-hole in the supporting member, wherein the first conductive terminal protrudes from the top surface of the supporting member through the through-hole.
4. The semiconductor device of claim 1, further comprising a protection layer covering the semiconductor substrate and having an opening at the electrode, and a second conductive terminal electrically connected with the electrode through the opening in the protection layer.
5. The semiconductor device of claim 1, further comprising a MEMS component or a filtering material disposed in the depressed portion of the supporting member.
6. The semiconductor device of claim 1, wherein the adhesive layer is partially formed so as to form a cavity between the semiconductor substrate and the supporting member.
7. A semiconductor device comprising:
a semiconductor substrate comprising an electronic component formed on a top surface of the semiconductor substrate;
a supporting member having a bottom surface and a top surface and bonded to the semiconductor substrate;
an adhesive layer attaching the bottom surface of the supporting member to the top surface of the semiconductor substrate; and
an electrode disposed on the bottom surface of the supporting member and electrically connected with the electronic component;
wherein the supporting member has a first through-hole connecting the top and bottom surfaces of the supporting member and provided therein with a first conductive terminal electrically connected with the electrode and a second through-hole not provided with the first conductive terminal and configured to house all or a portion of another device.
8. The semiconductor device of claim 7, further comprising a protection layer covering the semiconductor substrate and having an opening at the electrode, and a second conductive terminal electrically connected with the electrode through the opening in the protection layer.
9. A stacked layer type semiconductor device comprising a plurality of semiconductor devices vertically stacked, comprising:
a lower layer semiconductor device comprising a semiconductor substrate having an electronic component on a surface thereof and a supporting member bonded to the surface of the semiconductor substrate through an adhesive layer; and
an upper layer semiconductor device disposed on the lower layer semiconductor device and comprising a semiconductor substrate having an electronic component on a surface thereof and a supporting member bonded to the surface of the semiconductor substrate of the upper layer semiconductor device through an adhesive layer,
wherein the supporting member of the lower layer semiconductor device comprises a depressed portion or a through-hole formed from a top surface thereof, and all or a portion of the upper layer semiconductor device is housed in the depressed portion or the through-hole of the supporting member of the lower layer semiconductor device.
10. The stacked layer type semiconductor device of claim 9, wherein the upper layer semiconductor device excluding the supporting member is housed in the depressed portion or the through-hole of the lower layer semiconductor device.
11. The semiconductor device of claim 9, wherein the supporting member of the lower layer semiconductor device has a though-hole for connection with an electrode, and an electric connection between the lower layer semiconductor device and the upper layer semiconductor device is made through a conductive material formed in the through-hole for connection with the electrode.
12. The stacked layer type semiconductor device of claim 11, wherein the lower layer semiconductor device further comprises a protection layer covering a corresponding semiconductor substrate and having an opening at a corresponding electrode and a conductive terminal electrically connected with the corresponding electrode through the opening in the protection layer.
13. A method of manufacturing a semiconductor device, comprising:
providing a semiconductor substrate comprising an electronic component formed on a surface thereof and an electrode electrically connected with the electronic component and formed on the surface of the semiconductor substrate;
bonding a supporting member to the surface of the semiconductor substrate using an adhesive; and
forming a depressed portion from a top surface of the supporting member.
14. The method of claim 13, further comprising forming a through-hole in the supporting member penetrating from the top surface thereof to a back surface of the supporting member so as to expose a surface of the electrode, and forming in the through-hole a first conductive terminal electrically connected with the electrode.
15. The method of claim 13, further comprising removing the semiconductor substrate so as to expose a surface of the electrode, forming a protection film covering the semiconductor substrate and having an opening at the electrode, and forming a second conductive terminal protruding from the supporting member toward the semiconductor substrate and electrically connected with the electrode through the opening in the protection film.
16. A method of manufacturing a stacked layer type semiconductor device, comprising:
providing a lower layer semiconductor device comprising a semiconductor substrate having an electronic component formed on a surface thereof and an electrode electrically connected with the electronic component and a supporting member bonded to the surface of the lower layer semiconductor substrate through an adhesive layer;
placing on the lower layer semiconductor device an upper layer semiconductor device comprising a semiconductor substrate having an electronic component formed on a surface thereof and an electrode electrically connected with the electronic component and a supporting member bonded to the surface of the upper layer semiconductor substrate through an adhesive layer,
wherein a depressed portion or a through-hole is formed from a top surface of the supporting member of the lower layer semiconductor device; and
all or a portion of the upper layer semiconductor device is housed in the depressed portion or the through-hole in the supporting member of the lower layer semiconductor device.
17. The method of claim 16, further comprising forming in the supporting member of the lower layer semiconductor device a through-hole for connection with the electrode penetrating from the top surface of the supporting member of the lower layer semiconductor device to a back surface of the supporting member of the lower layer semiconductor device, forming a conductive material in the through-hole for connection with the electrode, and electrically connecting the upper layer semiconductor device with the lower layer semiconductor device through the conductive material formed in the through-hole for connection with the electrode.
18. The method of claim 16, further comprising forming a protection layer covering each semiconductor substrate and a portion of a corresponding supporting member and having an opening at a corresponding electrode.