All The Claims

1. A chip package comprising:
a substrate:
a first chip over the substrate;
a second chip over the substrate; and
a voltage regulator device over the substrate, wherein the voltage regulator device is configured and arranged to accommodate different voltage needs of the first chip and second chip.
2. The chip package of claim 1, wherein the voltage regulator device comprises a semiconductor chip, wherein the semiconductor chip includes:
a silicon substrate;
multiple active devices in or over the silicon substrate, wherein the active devices comprise a switch controller and a voltage feedback device, wherein the switch controller and the voltage feedback device comprise a plurality of MOS devices;
a first dielectric layer over the silicon substrate;
a metallization structure over the first dielectric layer, wherein the metallization structure is connected to the active devices, and wherein the metallization structure comprises a first metal layer and a second metal layer over the first metal layer;
a second dielectric layer between the first and second metal layers;
a passivation layer over the metallization structure and over the first and second dielectric layers, an opening in the passivation layer exposing a pad and a contact pad of the metallization structure; and
an inductor component and a capacitor component connected to the pads through a first solder layer, wherein the inductor component, the capacitor component, the switch controller and the voltage feedback device form the voltage regulator.
3. The chip package of claim 2, wherein the passivation layer comprises a silicon nitride layer having a thickness of more than 0.3 micrometers.
4. The chip package of claim 2, further comprising an under bump metal structure between the pad and the inductor component and the capacitor component, wherein the first solder layer is over the under bump metal structure.
5. The chip package of claim 4, wherein the under bump metal structure comprises a nickel layer.
6. The chip package of claim 4, wherein the under bump metal structure comprises a copper layer.
7. The chip package of claim 1, wherein the second chip is over the first chip.
8. The chip package of claim 1, wherein the substrate comprises a Ball Grid Array (BGA) substrate.
9. A chip package comprising:
a substrate:
a first chip over the substrate;
a second chip over the substrate; and
a voltage converter device over the substrate, wherein the voltage regulator device is configured and arranged to accommodate different voltage needs of the first chip and second chip.
10. The chip package of claim 9, wherein the voltage converter device comprises a semiconductor chip, wherein the semiconductor chip includes:
a silicon substrate;
multiple active devices in or over the silicon substrate, wherein the active devices comprise a switch controller and a voltage feedback device, wherein the switch controller and the voltage feedback device comprise a plurality of MOS devices;
a first dielectric layer over the silicon substrate;
a metallization structure over the first dielectric layer, wherein the metallization structure is connected to the active devices, and wherein the metallization structure comprises a first metal layer and a second metal layer over the first metal layer;
a second dielectric layer between the first and second metal layers;
a passivation layer over the metallization structure and over the first and second dielectric layers, an opening in the passivation layer exposing a pad and a contact pad of the metallization structure; and
an inductor component and a capacitor component connected to the pads through a first solder layer, wherein the inductor component, the capacitor component, the switch controller and the voltage feedback device form an on-chip voltage converter.
11. The chip package of claim 10, wherein the passivation layer comprises a silicon nitride layer having a thickness of more than 0.3 micrometers.
12. The chip package of claim 10, further comprising an under bump metal structure between the pad and the inductor component and the capacitor component, wherein the first solder layer is over the under bump metal structure.
13. The chip package of claim 12, wherein the under bump metal structure comprises a nickel layer.
14. The chip package of claim 12, wherein the under bump metal structure comprises a copper layer.
15. The chip package of claim 9, wherein the second chip is over the first chip.
16. The chip package of claim 9, wherein the substrate comprises a ball grid array (BGA) substrate.
17. A chip package comprising:
a substrate:
a first chip over the substrate;
a second chip over the substrate; and
a power management device over the substrate, wherein the power management device is configured and arranged to accommodate different voltage needs of the first chip and the second chip.
18. The chip package of claim 17, wherein the power management device comprises a semiconductor chip, wherein the semiconductor chip includes:
a silicon substrate;
multiple active devices in or over the silicon substrate, wherein the active devices comprise a switch controller and a voltage feedback device, wherein the switch controller and the voltage feedback device comprise a plurality of MOS devices;
a first dielectric layer over the silicon substrate;
a metallization structure over the first dielectric layer, wherein the metallization structure is connected to the active devices, and wherein the metallization structure comprises a first metal layer and a second metal layer over the first metal layer;
a second dielectric layer between the first and second metal layers;
a passivation layer over the metallization structure and over the first and second dielectric layers, an opening in the passivation layer exposing a pad and a contact pad of the metallization structure; and
an inductor component and a capacitor component connected to the pads through a first solder layer.
19. The chip package of claim 18, wherein the passivation layer comprises a silicon nitride layer having a thickness of more than 0.3 micrometers.
20. The chip package of claim 18, further comprising an under bump metal structure between the pad and the inductor component and the capacitor component, wherein the first solder layer is over the under bump metal structure.
21. The chip package of claim 20, wherein the under bump metal structure comprises a nickel layer.
22. The chip package of claim 20, wherein the under bump metal structure comprises a copper layer.
23. The chip package of claim 17, wherein the second chip is over the first chip.
24. The chip package of claim 17, wherein the substrate comprises a Ball Grid Array (BGA) substrate.

The claims below are in addition to those above.
All refrences to claims which appear below refer to the numbering after this setence.

1. A continuous ink jet printer comprising a fluid system comprising:
an ink tank for holding ink;
a print head;
an ink nozzle disposed in the print head and in fluid communication with the ink tank for ejecting ink droplets;
a gutter disposed in the print head for receiving, through an ink-receiving inlet thereof, ink droplets which are not used for printing;
a gutter flow path starting at the ink-receiving inlet, for ink that has entered the gutter through the ink-receiving inlet, and providing fluid communication to the ink tank;
a makeup tank in vapor communication with the ink tank to allow air to be conveyed from the ink tank to the makeup tank;
a return line in fluid communication between the makeup tank and the print head for conveying air from the makeup tank to the print head and into the gutter flow path; and
a condenser in fluid communication with the makeup tank and the return line, the condenser disposed between the makeup tank and the return line, the condenser adapted to receive exhaust from the makeup tank and condense solvent from the exhaust, the condensed solvent flowing into the makeup tank.
2. The continuous ink jet printer of claim 1 where the return line is connected to the gutter flow path.
3. The continuous ink jet printer of claim 1, further comprising an ink supply line disposed between the ink tank and the ink nozzle.
4. The continuous ink jet printer of claim 1, further comprising a solvent supply line disposed between the ink tank and the print head.
5. The continuous ink jet printer of claim 1 wherein the condenser is a passive condenser.
6. The continuous ink jet printer of claim 1 wherein the condenser is an active condenser.
7. The continuous ink jet printer of claim 1 wherein the condenser is disposed above the makeup tank.
8. The continuous ink jet printer of claim 1 further comprising a heater disposed adjacent the condenser for heating air conveyed from the makeup tank.
9. The continuous ink jet printer of claim 1 further comprising a heater disposed in the return line adjacent the gutter for heating air conveyed to the gutter.
10. The continuous ink jet printer of claim 1 wherein the makeup tank and the ink tank are integrated in a single component.
11. The continuous ink jet printer of claim 10 wherein there is direct vapor communication between the ink tank and the makeup tank.
12. The continuous ink jet printer of claim 10 wherein the single component comprises a wall disposed between the makeup tank and the ink tank with an opening adjacent a top of the component for allowing vapor communication between the makeup tank and the ink tank.
13. The continuous ink jet printer of claim 1 wherein the makeup tank and the ink tank are separate components.
14. The continuous ink jet printer of claim 1 wherein the return line conveys air with evaporated solvent at an amount less than saturation and the air is substantially free of liquid solvent.
15. The continuous ink jet printer of claim 1 further comprising an air intake line to introduce air into the makeup tank andor the ink tank from outside the fluid system.
16. A method of operating a continuous ink jet printer comprising:
conveying ink from an ink tank to an ink nozzle;
ejecting ink droplets from the nozzle;
receiving, through an ink-receiving inlet of a gutter, ink droplets which are not used for printing;
conveying ink that has entered the gutter through the ink-receiving inlet to the ink tank;
conveying air from a makeup tank to the print head;
conveying air from the ink tank to the makeup tank; and
condensing solvent from air from the makeup tank and conveying the condensed solvent to the makeup tank.
17. The method of claim 16 further comprising introducing ambient air into the makeup tank andor the ink tank.
18. The method of claim 16 further comprising removing solvent from the ink tank by condensing solvent into the makeup tank.
19. The continuous ink jet printer of claim 1 wherein the return line is in fluid communication between the makeup tank and the print head for conveying air from the makeup tank to the gutter flow path.
20. The method of claim 16 wherein the printer has a solvent consumption of less than 3.5 mlhr with a volatile organic solvent selected from MEK, acetone, ethanol, and mixtures thereof.

1. A full aperture beverage end comprising a center panel, a countersink surrounding the centre panel, a main score arranged in proximity to the countersink to define a removable aperture panel, and a vent score, whereby the end is adapted for use with products that are pressurized to over 30 psi (200 kPa) and such that during opening the vent score is adapted to sever first, controlling the pressure differential between the external surface and internal surface of the centre panel, thereby allowing the main score to tear in a controlled and reliable manner.
2. A full aperture beverage end according to claim 1 adapted for use with products held under pressure of between 30 and 90 psi (200 and 600 kPa).
3. A full aperture beverage end according to claim 1, wherein the beverage end further includes a tab having a nose and a handle, which is lifted by a user to initiate sequential rupture of the vent score and then the main score.
4. A full aperture beverage end according to claim 3, wherein the tab is solid and has no hinge.
5. A full aperture beverage end according to claim 3, wherein the tab is positioned so that the tab nose is within the main score or proximate to the main score upon initial actuation of the tab.
6. A full aperture beverage end according to claim 1, wherein the main score has an asymmetric score profile.
7. A full aperture beverage end according to claim 6, wherein the asymmetric score profile is designed to ensure that the score land portion remains with the aperture panel after the aperture panel is detached.
8. A full aperture beverage end according to claim 1, wherein the center panel further includes a second, anti-fracture score positioned radially inside the main score.
9. A full aperture beverage end according to claim 1, wherein the height from the base of the countersink to the end panel is greater than 1.5 mm.
10. A full aperture beverage end of claim 1 wherein main score is positioned to within 0.020 inches (0.5 mm) radially of the panel fillet so as to maximise cut edge safety.
11. A full aperture beverage can having rated for internal pressure of over 30 psi (200 kPa), the beverage can comprising:
a can body;
an end, seamed onto the can body, including a center panel, a countersink surrounding the center panel, a tab attached to the center panel by a rivet; a main score that defines a removable aperture panel, a vent score formed in the aperture panel, the main score having an outer wall proximate a lip of the end, an inner wall proximate the aperture panel, and a land at the base of the main score, the land having a thickness that is smaller proximate the main score outer wall than the land thickness proximate the main score inner wall, whereby the land remains affixed to the aperture panel after detachment of the aperture panel.
12. The full aperture beverage can of claim 11 wherein the can is rated for internal pressure of at least 70 psi.
13. The full aperture beverage can of claim 11 wherein the can is rated for internal pressure of at least 85 psi.
14. The full aperture beverage can of claim 11 wherein the can is rated for internal pressure of at least 90 psi.
15. The full aperture beverage can of claim 11 wherein the centerline of the main score is located between 0.000 inches and 0.020 inches from a center of a transition radius between the countersink and the center panel.
16. The full aperture beverage can of claim 11 wherein the centerline of the main score is located between 0.000 inches and 0.010 inches from a center of a transition radius between the countersink and the center panel.
17. The full aperture beverage can of claim 11 wherein the centerline of the main score is located between 0.000 inches and 0.006 inches from a center of a transition radius between the countersink and the center panel.
18. The full aperture beverage can of claim 11 wherein the centerline of the main score is located between 0.000 inches and 0.004 inches from a center of a transition radius between the countersink and the center panel.
19. The full aperture beverage can of claim 11 wherein the centerline of the main score is located between 0.000 inches and 0.002 inches from a center of a transition radius between the countersink and the center panel.
20. The full aperture beverage can of claim 11 wherein a nose of the tab in its rest state is radially inwardly spaced apart from an inner edge of the main score by between approximately 0.000 inches and 0.008 inches, measured horizontally.
21. The full aperture beverage can of claim 11 wherein a nose of the tab in its rest state is radially inwardly spaced apart from an inner edge of the main score by between approximately 0.000 inches and 0.005 inches, measured horizontally.
22. The full aperture beverage can of claim 11 wherein a nose of the tab in a partially actuated state, in which the tab nose contacts the center panel, is approximately between the centerline of the main score and 0.005 inches radially inboard from an inner edge of the main score.
23. The full aperture beverage can of claim 11 wherein a nose of the tab in a partially actuated state, in which the tab nose contacts the center panel, is within 0.002 inches of an inner edge of the main score.
24. A method of opening a full aperture beverage can having rated for internal pressure of over 30 psi (200 kPa), the method comprising the steps of:
providing a can having a can body and an end, seamed onto the can body, including a center panel, a countersink surrounding the center panel, a tab attached to the center panel by a rivet; a main score that defines a removable aperture panel, a vent score formed in the aperture panel, the main score having an outer wall proximate a lip of the end, an inner wall proximate the aperture panel, and a land at the base of the main score, the land having a thickness that is smaller proximate the main score outer wall than the land thickness proximate the main score inner wall, whereby the land remains affixed to the aperture panel after detachment of the aperture panel;
raising a heel of a tab to pivot the tab relative to the rivet to rupture the vent score;
after the raising step, continuing to raise the heel of the tab to rupture the main score and propagate the score rupture around the center panel to completely detach the aperture panel, thereby providing a full aperture from which a user a drink.
The claims below are in addition to those above.
All refrences to claims which appear below refer to the numbering after this setence.

What we claim:

1. An optical interface device, comprising:
a first port;
a second port;
a third port;
each of the first, second, and third ports for receiving optical signals;
a first coupler for splitting optical signals from the first port into a plurality of optical signal components and for routing one of the optical signal components to each of the second and third ports;
a second coupler for splitting optical signals from the second port into a plurality of optical signal components and for routing one of the optical signal components to each of the first and third ports;
a third coupler for splitting optical signals from the third port into a plurality of optical signal components and for routing one of the optical signal components to each of the first and second ports;
a first optical amplifier located between the first and second ports for amplifying optical signals routed between the first and second ports;
a second optical amplifier located between the second and third ports for amplifying optical signals routed between the second and third ports;
a third optical amplifier located between the first and third ports for amplifying optical signals routed between the first and third ports;
wherein each of the first, second, and third optical amplifiers has a gain that is sufficient to compensate for coupling losses associated with the first, second, and third ports, respectively, and splitting losses associated with the first, second, and third splitter, respectively.
2. The optical interface device as set forth in claim 1, wherein the first, second, and third amplifiers comprise fiber amplifiers.
3. The optical interface device as set forth in claim 1, wherein the first, second, and third couplers comprise 5050 splitters.
4. The optical interface device as set forth in claim 1, wherein the optical interface device has more than three ports.
5. The optical interface device as set forth in claim 1, wherein the gain is the same for each of the first, second, and third optical amplifiers.
6. The optical interface device as set forth in claim 1, wherein the gain in the first optical amplifier differs from the gain in the second and third optical amplifier.
7. The optical interface device as set forth in claim 1, further comprising a fourth optical amplifier associated with the first port, the fourth optical amplifier for providing optical amplification of signals traveling between the first port and the first coupler.
8. The optical interface device as set forth in claim 1, wherein each of the first, second, and third optical amplifiers receive an excitation signal from a common pump.
9. The optical interface device as set forth in claim 1, wherein the first, second, and third optical amplifiers receive excitation signals from different pumps.
10. The optical interface device as set forth in claim 1, wherein the first, second, and third optical couplers split the optical signals into equal optical components.
11. An optical interface device, comprising:
means for receiving an optical signal from a first port;
means for separating the optical signal into a plurality of signal components;
means for amplifying the optical signal components to compensate for losses associated with the receiving means and the separating means, the amplifying means generating amplified optical signal components; and
means for passing the amplified optical signal components from at least a second port and a third port.
12. The optical interface device as set forth in claim 11, wherein the receiving means comprises a port.
13. The optical interface device as set forth in claim 11, wherein the separating means comprises a splitter.
14. The optical interface device as set forth in claim 11, wherein the amplifying means comprises a fiber amplifier.
15. The optical interface device as set forth in claim 11, wherein the amplifying means amplifies each signal component with the same gain.
16. The optical interface device as set forth in claim 11, wherein the amplifying means amplifies the signal components with different gains.
17. The optical interface device as set forth in claim 11, further comprising second amplifying means for amplifying the optical signal.
18. A method for routing an optical signal from a first line onto at least a second line and a third line, comprising:
receiving the optical signal from the first line;
splitting the optical signal into a plurality of signal components;
amplifying each of the signal components to compensate for coupling and splitting losses, the amplifying of the signal components resulting in amplified signal components; and
passing the amplified signal components onto each of the second line and the third line.
19. The method as set forth in claim 18, wherein splitting comprises splitting the optical signal into equal optical signal components.
20. The method as set forth in claim 18, wherein amplifying comprises amplifying the optical signal components to a level greater than a level of the optical signal.
21. The method as set forth in claim 18, wherein splitting comprises splitting the optical signal into two optical signal components and the passing comprises passing the two optical signal components onto the second and third lines.