All The Claims

1. A motorcycle attachment system attachable to a motorcycle having a frame to safely transport musical instruments comprising:
an instrument case;
a first bracket attached to said instrument case at a back side thereof;
a second bracket attached to said instrument case at a point spaced forward from said first bracket;
a first and a second spaced mounting post, each having a free end, said first post mounted forward of second post, said mounting posts being mounted to said motorcycle in the vicinity of the upper portion of the rear tire thereof;
a mounting spool having a free end, said mounting spool being mounted to the frame of said motorcycle at a point in the vicinity of the rear wheel of said motorcycle;
said first bracket having a forward opening groove for receiving said first mounting post;
said first bracket having a downward opening groove for receiving said second mounting post;
said second bracket having an upward opening groove for receiving said mounting spool;
said second bracket having a spring-biased latch so located on said second bracket as to removably retain said mounting spool within said upward opening groove.
2. The motorcycle attachment system of claim 1, wherein said first and said second spaced mounting posts are mounted on a rear portion of said frame.
3. The motorcycle attachment system of claim 1, wherein said first and said second spaced mounting posts are mounted by means of mounting screws extending through corresponding apertures in the rear fender of said motorcycle.
4. The motorcycle attachment system of claim 1, wherein said first and said second spaced mounting posts are mounted on the rear fender of said motorcycle.
5. The motorcycle attachment system of claim 1, wherein said motorcycle has a fender rail attached to a portion of said frame, said fender rail extending along the upper portion of a rear fender, said first and said second mounting posts being mounted on said fender rail.
6. The motorcycle attachment system of claim 1, wherein said mounting spool is mounted to said frame by means of a spacing front bracket support extending between the said frame and said spool mounting point.
7. The motorcycle attachment system of claim 6, wherein said front bracket support is a steel flat member having a forward end and a rearward end, said forward end being removably bolted to said frame at a point to the rear and in the vicinity of the transmission of said motorcycle, said rearward end bearing said mounting spool.
8. The motorcycle attachment system of claim 1, wherein said first and second spaced mounting posts have circumferential attachment grooves spaced from their free ends, respectively.
9. The motorcycle attachment system of claim 8, wherein said first mounting bracket has a retaining rim at the inward side of said forward opening groove, said retaining rim engaging said circumferential groove of said first mounting post.
10. The motorcycle attachment system of claim 9, wherein said first mounting bracket has a retaining rim at the inward side of said downward opening groove, said retaining rim engaging said circumferential groove of said second mounting post.
11. The motorcycle attachment system of claim 1, wherein said case is a rigid case having a removable liner bag for receiving an instrument therein.
12. The motorcycle attachment system of claim 11, wherein said liner bag comprises cushioning foam.
13. The motorcycle attachment system of claim 12, wherein said instrument case is adapted for carrying a guitar.
14. The motorcycle attachment system of claim 1, wherein said spring-biased docking latch of said second mounting bracket is rotatively mounted between an open position and a closed position and on the inward side of said second mounting bracket adjacent said upward opening mounting spool receiving groove such that said spring-biased latch may releasably engage and retain said mounting spool within said upward opening groove.
15. The motorcycle attachment system of claim 14, wherein said docking latch has an upward opening groove having a spring-biased latch member for retaining said spool when said latch member is rotated to said closed position and releasing said spool when said latch body is rotated to and open position.
16. The motorcycle attachment system of claim 15, wherein said latch member has a release crank extending below said second bracket for rotating said docking latch between a closed position and an open position.
17. The motorcycle attachment system of claim 16, wherein said release crank is knurled for ease in hand disengagement of said mounting spool by the user.
18. The motorcycle attachment system of claim 17, wherein said mounting spool and said second mounting post are so located relative to said first bracket and said second bracket such that when said case is supported on said first mounting post by said first bracket and within said forward end opening groove, said second mounting post engages said downward opening groove of said first bracket and said mounting post engages said upward opening groove of said second bracket while being retained by said upward opening latch of said spring-biased docking latch.

The claims below are in addition to those above.
All refrences to claims which appear below refer to the numbering after this setence.

1. A spin clean method, comprising:
providing pressurized cleaning liquid onto a wafer while spinning the wafer,
wherein vertical jet pressure on the wafer and wafer spin speed are substantially maintained in inverse proportion.
2. The method as claimed in claim 1, wherein vertical jet pressure is 120 KPa to 0.05 KPa, and wafer spin speed is 0 to 1200 rpm.
3. The method as claimed in claim 1, wherein vertical jet pressure is 0 KPa to 120 KPa, and the wafer spin speed is 0 To 1200 rpm.
4. The method as claimed in claim 1, wherein the cleaning liquid consists essentially of de-ionized water.
5. The method as claimed in claim 1, further comprising scrubbing the wafer with at least one brush and the spin speed of the at least one brush is 50 to 2500 rpm.
6. A spin clean method for removing particles from a wafer, the method comprising:
positioning a wafer onto a chuck, the wafer having a plurality of particles thereon;
providing pressurized cleaning liquid onto the wafer from a nozzle positioned above the wafer; and
spinning the chuck about an axis to remove the particles,
wherein vertical jet pressure on the wafer and wafer spin speed are substantially maintained in inverse proportion and a particle removal rate is no less than 95%.
7. The method as claimed in claim 6, wherein vertical jet pressure is 0 KPa to 120 KPa, and wafer spin speed is 0 to 1200 rpm.
8. The method as claimed in claim 6, wherein vertical jet pressure is 0 KPa to 120 KPa, and wafer spin speed is 0 to 1200 rpm.
9. The method as claimed in claim 6, wherein the cleaning liquid consists essentially of de-ionized water.
10. The method as claimed in claim 6, further comprising scrubbing the wafer with at least one brush and the spin speed of the at least one brush is 50 to 2500 rpm.
11. The method as claimed in claim 6, wherein the nozzle is positioned 5 to 300 millimeters from the wafer surface.
12. A spin clean method, comprising:
positioning a wafer onto a chuck, the wafer having a plurality of particles thereon;
providing pressurized cleaning liquid onto the wafer from a nozzle positioned above the wafer; and
spinning the chuck about an axis, whereby the cleaning liquid spreads out over the wafer;
wherein vertical jet pressure on the wafer and wafer spin speed follows the equation:
Jet pressure(Kpa)*spin speed(rpm)<12000 Kpa*rpm
13. The method as claimed in claim 12, wherein vertical jet pressure is 100 KPa to 0.05 KPa, and wafer spin speed is 50 to 1200 rpm.
14. The method as claimed in claim 12, wherein vertical jet pressure is 0 KPa to 120 KPa, and the wafer spin speed is 0 to 120 rpm.
15. The method as claimed in claim 12, wherein the cleaning liquid consists essentially of de-ionized water.
16. The method as claimed in claim 12, further comprising scrubbing the wafer with at least one brush and the spin speed of,the at least one brush is 500 to 2500 rpm.
17. The method as claimed in claim 12, wherein the nozzle is positioned 50 to 300 millimeters from the wafer surface.

1. A method for endpoint location and identification comprising:
transmitting a registration request from an endpoint to a server;
storing an address of the endpoint;
requesting a location identification number from the endpoint;
storing the location identification number; and
associating the address of the endpoint with the location identification number.
2. The method of claim 1, further comprising:
transmitting an emergency number contact from the endpoint;
routing the emergency number contact to the server;
retrieving the location identification number address associated with the address of the endpoint;
connecting the endpoint to the emergency number contact; and
transmitting the location identification number associated with the address of the endpoint to the emergency number contact.
3. The method of claim 2, further comprising:
determining from the location identification number an appropriate public safety answering point to connect the endpoint.
4. The method of claim 1, wherein the address of the endpoint is an IP address.
5. The method of claim 1, further comprising:
providing a user with a list of location identification numbers associated with the user.
6. The method of claim 1, further comprising:
determining whether the endpoint sending the registration request is a transient endpoint.
7. The method of claim 1, wherein the endpoint and the server use session initiation protocol.
8. A system for endpoint location identification comprising:
a module for transmitting a registration request from an endpoint to a server;
a module for requesting a location identification number from the endpoint; and
a database for storing an address of the endpoint and the location identification number.
9. The system of claim 8, further comprising:
a module for transmitting an emergency number contact from the endpoint to the server;
a module for retrieving the location identification number from the database;
a module for connecting the endpoint to the emergency number contact; and
a module for transmitting the location identification number associated with the address of the endpoint to the emergency number contact.
10. The system of claim 8, further comprising:
a module for determining from the location identification number an appropriate public safety answering point to connect the endpoint.
11. The system of claim 8, wherein the address of the endpoint is an IP address.
12. The system of claim 8, further comprising:
a module for providing a user with a list of location identification numbers associated with the user.
13. The system of claim 8, further comprising:
a module for determining if the endpoint sending the registration request is a transient endpoint.
14. The system of claim 8, wherein the endpoint and the server use session initiation protocol.
15. A system for location identification comprising:
a means for transmitting a registration request from a means for communicating to a server;
a means for requesting a location identification number from the means for communication; and
a means for storing an address of the means for communication and the location identification number in a database.
16. The system of claim 15, further comprising:
a means for transmitting an emergency number contact from the means for communicating to the server;
a means for retrieving the location identification number from the database;
a means for connecting the means for communication to the emergency number contact; and
a means for transmitting the location identification number associated with the address of the means for communication to the emergency number contact.
17. The system of claim 15, further comprising:
a means for determining from the location identification number an appropriate public safety answering point to connect the means for communication.
18. The system of claim 15, wherein the address of the means for communication is an IP address.
19. The system of claim 15, further comprising:
a means for providing a user with a list of location identification numbers associated with the user.
20. The system of claim 15, further comprising:
a means for determining if the means for communication sending the registration request is a transient means for communication.
The claims below are in addition to those above.
All refrences to claims which appear below refer to the numbering after this setence.

1. A method of manufacturing a thin film magnetic head,
the thin film magnetic head comprising:
a thin film coil generating magnetic flux, and
a pole layer comprising a laminate including a main pole layer having a plane shape including a uniform width region with a uniform width determining a recording track width of a recording medium and a widening width region with a larger width than the uniform width region, and having an end surface exposed to a recording-medium-facing surface facing the recording medium, an auxiliary pole layer being disposed so as to face a part of the main pole layer, and a non-magnetic layer being disposed in a region where the main pole layer and the auxiliary pole layer face each other so as to be sandwiched between these two layers, and the pole layer emitting the magnetic flux generated in the thin film coil to the recording medium,
the method comprising:
forming a first mask layer to become a mask determining the widening width region;
forming a second mask layer to become a mask determining the uniform width region, wherein the first mask layer and the second mask layer are independently formed through separate steps; and
completing formation of the pole layer through a series of patterning steps for at least two of the main pole layer, the auxiliary pole layer and the non-magnetic layer by use of the first mask layer and the second mask layer.
2. A method of manufacturing a thin film magnetic head according to claim 1, wherein
a step of forming the first mask layer is carried out before a step of forming the second mask layer.
3. A method of manufacturing a thin film magnetic head according to claim 1, wherein
a step of forming the pole layer comprises the steps of:
forming and laminating a precursory main pole layer as a preparatory layer of the main pole layer, a precursory non-magnetic layer as a preparatory layer of the non-magnetic layer and a precursory auxiliary pole layer as a preparatory layer of the auxiliary pole layer in this order,
selectively forming the first mask layer on the precursory auxiliary pole layer in a region corresponding to the widening width region,
patterning the precursory auxiliary pole layer through etching by use of the first mask layer as a mask so as to form a precursory auxiliary pole layer pattern,
selectively forming the second mask layer on the precursory auxiliary pole layer pattern and its surroundings in a region corresponding to the uniform width region and the widening width region,
patterning the precursory non-magnetic layer through etching by use of the auxiliary pole layer pattern and the second mask layer as masks so as to form the non-magnetic layer,
patterning the precursory main pole layer through etching by use of the second mask layer, the precursory auxiliary pole layer pattern and the non-magnetic layer as masks so as to form the main pole layer, and
patterning the precursory auxiliary pole layer pattern through etching by use of the second mask layer as a mask so as to form the auxiliary pole layer.
4. A method of manufacturing a thin film magnetic head according to claim 1, wherein
a step of forming the pole layer comprises the steps of:
forming and laminating a precursory auxiliary pole layer as a preparatory layer of the auxiliary pole layer and a precursory non-magnetic layer as a preparatory layer of the non-magnetic layer in this order,
selectively forming the first mask layer on the precursory non-magnetic layer in a region corresponding to the widening width region,
patterning the precursory non-magnetic layer by use of the first mask layer as a mask so as to form the non-magnetic layer,
patterning the precursory auxiliary pole layer through etching by use of the first mask layer as a mask so as to form the auxiliary pole layer,
forming a precursory main pole layer as a preparatory layer of the main pole layer on the non-magnetic layer and its surroundings,
selectively forming the second mask layer on the precursory main pole layer in a region corresponding to the uniform width region and the widening width region, and
patterning the precursory main pole layer through etching by use of the second mask layer as a mask so as to form the main pole layer.
5. A method of manufacturing a thin film magnetic head according to claim 1 wherein completing formation of the pole layer comprises:
completing formation of the pole layer through a series of patterning steps for the main pole layer, the auxiliary pole layer and the non-magnetic layer by use of the first mask layer and the second mask layer.