All The Claims

1. A method of fabricating a three-dimensional (3D) semiconductor device comprising:
forming a stack structure including a plurality of horizontal layers and a plurality of interlayer insulating layers alternately stacked on a substrate, the substrate including a cell array region and a contact region;
forming a first mask pattern covering the cell array region, the first mask pattern defining openings extending in one direction over the contact region;
performing a first etching process with a first etch-depth using the first mask pattern as an etch mask on the stack structure;
forming a second mask pattern covering the cell array region and exposing a part of the contact region; and
performing a second etching process with a second etch-depth using the second mask pattern as an etch mask structure on the stack structure, the second etch-depth being greater than the first etch-depth,
after performing the second etching process, repeatedly performing a process of shrinking a planar area of the second mask pattern and performing the second etching process using the shrunk second mask pattern as the etch mask structure.
2. A method of fabricating a three-dimensional (3D) semiconductor device comprising:
forming a stack structure including a plurality of horizontal layers sequentially stacked on a substrate,
the substrate including a cell array region and a contact region;

forming a first mask pattern covering the cell array region,
the first mask pattern defining openings extending in one direction over the contact region;

performing a first etching process with a first etch-depth using the first mask pattern as an etch mask on the stack structure,
the performing the first etching process including etching a part of the stack structure exposed by the first mask pattern to the first etch-depth using the first mask pattern as the etch mask, and
the first etch-depth corresponds to a vertical pitch of one of the plurality of horizontal layers; and

forming a second mask pattern covering the cell array region and exposing a part of the contact region;
performing a second etching process with a second etch-depth using the second mask pattern as an etch mask structure on the stack structure,
the second etch-depth being greater than the first etch-depth,
the performing the second etching process including
etching a portion of the stack structure exposed by the second mask pattern to the second etch-depth using the second etch pattern as the etch mask structure, and
the second etch-depth corresponds to at least twice the vertical pitch of one of the plurality of horizontal layers.
3. The method of claim 1, wherein the performing the first etching process comprises forming horizontal patterns by anisotropically etching an uppermost horizontal layer of the plurality of horizontal layers in the stack structure.
4. The method of claim 3, wherein the performing the second etching process comprises removing an outermost one of the horizontal patterns.
5. The method of claim 1, wherein
the number of the horizontal layers in the stack structure is 2N,
N is a natural number, and
the second etching process is repeatedly performed N\u22121 times.
6. The method of claim 1, wherein the repeatedly performing the process of shrinking the planar area of the second mask pattern includes laterally moving a sidewall of the second mask pattern by twice a width of the opening of the first mask pattern.
7. The method of claim 1, wherein the forming the first mask pattern on the stack structure occurs after the repeatedly performing the process of shrinking the planar area of the second mask pattern and the second etching process.
8. The method of claim 7, wherein performing the first etching process comprises anisotropically etching even-numbered horizontal layers of the stacked horizontal layers in the stack structure by using the first mask pattern as the etch mask.
9. The method of claim 1, wherein
the cell array region is adjacent to the contact region in a second direction,
the substrate includes a dummy region,
the cell array region is adjacent to the dummy region in the first direction,
the second direction is perpendicular to the first direction,
the first mask pattern covers the dummy region, and
the second mask pattern exposes a portion of the dummy region.
10. A method of fabricating a three-dimensional (3D) semiconductor device comprising:
forming a stack structure including a plurality of horizontal layers stacked on a first region and a second region of a substrate,
the plurality of horizontal layers including odd horizontal layers alternately stacked with even horizontal layers;

performing one of a first process and a first method on the stack structure,
the first process including,
forming a mask on the first and second regions of the substrate,
the mask defining a plurality of openings that are spaced apart from each other over the second region of the substrate, and
etching through at least one of the even horizontal layers using the mask as an etch mask structure on the stack structure without substantially etching one of the odd horizontal layers,

the first method including,
forming a mask pattern on the first and second regions of the substrate,
the mask pattern exposing a part of the second region of the substrate,
etching through at least a pair of the plurality of horizontal layers using the mask pattern as an etch mask pattern on the stack structure,

each pair of the plurality of horizontal layers including one of the even horizontal layers that is adjacent to one of the odd horizontal layers; and
performing an other of the first process and the first method on the stack structure.
11. The method of claim 10, wherein the performing the first process occurs before the performing the first method.
12. The method of claim 10, wherein the performing the first method occurs before the performing the first process.
13. The method of claim 10, wherein the first method includes:
after performing the second etching process a first time, repeatedly performing a shrinking-and-etch process including,
shrinking a planar area of the mask pattern so more of the second region of the substrate is exposed,
repeating the etching through at least a pair of the plurality of horizontal layers using the shrunken mask pattern as the etch mask pattern.
14. The method of claim 13, wherein the stack structure includes a plurality of interlayers alternately stacked in between the plurality of horizontal layers.
15. The method of claim 1, wherein the part of the contact region exposed by the second mask pattern includes a part of an area of the contact region exposed by the first mask pattern.
16. The method of claim 1, wherein the openings defined by the first mask are spaced apart from each other in a second direction perpendicular to the first direction.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A fluid dynamic bearing system used particularly for a spindle motor having a shaft (1; 101) that is accommodated in a bearing bush (2; 102) and rotatably supported with respect to the bearing bush,
characterized in that the bearing bush (2; 102) is made of plastics.
2. A fluid dynamic bearing system according to claim 1, characterized in that an elastic element (4) is disposed at outside circumference of the bearing bush (2) by means of which the bearing bush is held in a sleeve (3) or in a baseplate (9) of a spindle motor.
3. A fluid dynamic bearing system according to claim 2, characterized in that the elastic element (4) is given the form of an elastic coating on the bearing bush.
4. A fluid dynamic bearing system according to claim 2, characterized in that the elastic element (4) is given the form of an elastic mounting between the bearing bush (2) and the sleeve (3).
5. A fluid dynamic bearing system according to claim 1, characterized in that the bearing bush (102) is formed as a part of a spindle motor hub made of plastic.
6. A fluid dynamic bearing system according to claim 1, characterized in that an elastic element (115) is disposed at the outside circumference of the bearing bush (113) by means of which the bearing bush is held in a hub (114) of a spindle motors.
7. A fluid dynamic bearing system according to claim 1, characterized in that bearing patterns are formed in a bearing surface of the bearing bush (2; 102).

1. A system for projecting images onto predefined portions of objects in a projection area, comprising:
a computing device storing:
geometry data defining a digital model of an object; the geometry data including identifiers of parts of the digital model; and
image data defining an image and including a reference to the digital model;

the reference consisting of at least one of the identifiers in a pixel array field;
a light source connected to the computing device and configured to project structured light onto the projection area;
a camera connected to the computing device and configured to capture an image of the projection area during the projection of structured light;
the computing device configured to receive the captured image from the camera and to determine a position and orientation of the object in the projection area by comparing the geometry data to the captured image;
the computing device further configured to generate a canvas image including a version of the image transformed to match the determined position and orientation of the object;
the computing device further configured to transmit the canvas image to a projector, for projection onto the projection area, whereby the image is projected onto a portion of the object corresponding to the reference in the image data.
2. The system of claim 1, the computing device configured to determine a position of the object by detecting signatures in the captured image corresponding to the digital model, and comparing the signatures to the geometry data.
3. The system of claim 2, the computing device configured to apply transformations to the digital model such that the transformed digital model matches the signatures;
the computing device further configured to generate the version of the image by applying at least one of the transformations to the image.
4. The system of claim 2, wherein the light source is a component of the projector.
5. The system of claim 1, wherein the projection area contains at least one of a plurality of objects; and wherein the geometry data defines a plurality of digital models corresponding to the plurality of objects;
the computing device configured to detect signatures corresponding to at least one of the plurality of digital models in the captured image.
6. The system of claim 5, wherein the image data defines a plurality of images, at least one of the images including a reference to at least one of the plurality of digital models.
7. The system of claim 1, wherein the image data includes the identifiers in a mapping metadata field.
8. A computing device for use in a system for projecting images onto predefined portions of objects in a projection area, the computing device comprising:
a memory storing:
geometry data defining a digital model of an object; the geometry data including identifiers of parts of the digital model; and
image data defining an image and including a reference to the digital model;

the reference consisting of at least one of the identifiers in a pixel array field;
a data interface configured to communicate with a light source, a projector and a camera; and
a processor interconnected with the memory and the data interface, the processor configured to:
control the light source to project structured light onto the projection area;
control the camera to capture an image of the projection area during the projection of structured light;
receive the captured image from the camera, and determine a position and orientation of the object in the projection area by comparing the geometry data to the captured image;
generate a canvas image including a version of the image transformed to match the determined position and orientation of the object; and
transmit the canvas image to a projector, for projection onto the projection area, whereby the image is projected onto a portion of the object corresponding to the reference in the image data.
9. The computing device of claim 8, the processor configured to determine a position of the object by detecting signatures in the captured image corresponding to the digital model, and comparing the signatures to the geometry data.
10. The computing device of claim 9, the processor configured to apply transformations to the digital model such that the transformed digital model matches the signatures;
the processor further configured to generate the version of the image by applying at least one of the transformations to the image.
11. The computing device of claim 9, wherein the light source is a component of the projector.
12. The computing device of claim 8, wherein the projection area contains at least one of a plurality of objects; and wherein the geometry data defines a plurality of digital models corresponding to the plurality of objects;
the processor configured to detect signatures corresponding to at least one of the plurality of digital models in the captured image.
13. The computing device of claim 12, wherein the image data defines a plurality of images, at least one of the images including a reference to at least one of the plurality of digital models.
14. The computing device system of claim 8, wherein the image data includes the identifiers in a mapping metadata field.
15. A method of projecting images onto predefined portions of objects in a projection area, comprising:
storing, in a memory of a computing device:
geometry data defining a digital model of an object; the geometry data including identifiers of parts of the digital model; and
image data defining an image and including a reference to the digital model;

the reference consisting of at least one of the identifiers in a pixel array field;
controlling a light source connected to the computing device to project structured light onto the projection area;
controlling a camera connected to the computing device to capture an image of the projection area during the projection of structured light;
receiving the captured image at the computing device from the camera and determining a position and orientation of the object in the projection area by comparing the geometry data to the captured image;
generating a canvas image at the computing device, including a version of the image transformed to match the determined position and orientation of the object;
transmitting the canvas image to a projector connected to the computing device, for projection onto the projection area, whereby the image is projected onto a portion of the object corresponding to the reference in the image data.
16. A non-transitory computer readable medium storing a plurality of computer readable instructions executable by a processor of a computing device, for causing the processor to perform a method of projecting images onto predefined portions of objects in a projection area, the method comprising:
storing, in a memory of a computing device:
geometry data defining a digital model of an object; the geometry data including identifiers of parts of the digital model; and
image data defining an image and including a reference to the digital model;

the reference consisting of at least one of the identifiers in a pixel array field;
controlling a light source connected to the computing device to project structured light onto the projection area;
controlling a camera connected to the computing device to capture an image of the projection area during the projection of structured light;
receiving the captured image at the computing device from the camera and determining a position and orientation of the object in the projection area by comparing the geometry data to the captured image;
generating a canvas image at the computing device, including a version of the image transformed to match the determined position and orientation of the object;
transmitting the canvas image to a projector connected to the computing device, for projection onto the projection area, whereby the image is projected onto a portion of the object corresponding to the reference in the image data.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A content-addressable-memory device comprising:
a tag storing unit that stores, in a plurality of entries, a plurality of tags corresponding to a plurality of addresses, a parity bit of each of the tags, and a reverse bit obtained by reversing the parity bit;
a data storing unit that stores a plurality of data corresponding to the tags in a plurality of corresponding entries;
a comparing unit that compares an address for search with a tag of each of the entries; and
a determining unit that performs an OR-operation on contents stored in a plurality of relevant entries when a multiple hit occurs from a comparison by the comparing unit, and determines a cause of the multiple hit based on a parity bit and a reverse bit obtained after the OR-operation.
2. The content-addressable-memory device according to claim 1, further comprising:
a masking unit that masks a portion of the tag, and excludes the masked portion from a target for the comparison by the comparing unit; and
a masked-portion changing unit that changes the masked portion to all \u201c0\u201d or all \u201c1\u201d.
3. The content-addressable-memory device according to claim 2, wherein
the data stored in the data storing unit includes mask control data, and
the masking unit masks the tag based on the mask control data, and checks an error in the mask control data.
4. A method of controlling a content-addressable-memory, the method comprising:
first storing including
storing, in a plurality of entries, a plurality of tags corresponding to a plurality of addresses, a parity bit of each of the tags, and a reverse bit obtained by reversing the parity bit;

second storing including
storing a plurality of data corresponding to the tags in a plurality of corresponding entries;

comparing an address for search with a tag of each of the entries;
performing an OR-operation on contents stored in a plurality of relevant entries when a multiple hit occurs from a comparison at the comparing; and
determining a cause of the multiple hit based on a parity bit and a reverse bit obtained after the OR-operation.
5. The method according to claim 4, further comprising:
masking a portion of the tag, and excludes the masked portion from a target for the comparison at the comparing; and
changing the masked portion to all \u201c0\u201d or all \u201c1\u201d.
6. The method according to claim 5, wherein
the data stored at the second storing includes mask control data, and
the masking includes
masking the tag based on the mask control data; and
checking an error in the mask control data.