1. A component of a transport line for pneumatically conveying bulk materials, comprising:
a first conduit having an open end;
a second conduit, connected to said first conduit at an angle relative thereto having the interior thereof communicating with the interior of said first conduit to provide a material flow passageway therethrough; and
a readily removable cap member detachably mounted on said first conduit, closing said open end thereof,
wherein said open end of said first conduit is disposed in alignment with a length of the interior of said first conduit to provide ready access to said interior upon removal of said cap member to facilitate the removal of material settling therein, and said cap member includes a section extendable into said first conduit when said cap member is mounted on said first conduit, having a peripheral side wall formed of an impermeable material and an end wall formed of a permeable material and an inlet for injecting a fluidizing gas into said extendable section.
2. A component according to claim 1 including means for detachably clamping said cap member to said first conduit.
3. A component according to claim 1 including a nozzle mounted in said cap member for injecting a gas under pressure into said first conduit.
4. A component according to claim 1 wherein said cap member includes a peripheral portion which may be mated to a peripheral flange portion of said first conduit for detachably mounting said cap member to said first conduit.
5. A component according to claim 4 including a nozzle mounted in said cap member for injecting a gas under pressure into said first conduit.
6. A component according to claim 1 including a nozzle mounted on said cap member and extending through said extendable section for injecting a gas under pressure into said first conduit.
7. A component according to claim 6 wherein said end wall of said extendable section is planar and disposed at an angle relative to the longitudinal centerline of said extendable section.
8. A component according to claim 1 wherein said first conduit is provided with a second open end and including a second cap member, detachably mounted onto said first conduit at an angle relative thereto, having an interior thereof communicating with the interior of said first conduit providing a material flow passageway through said conduits.
9. A component according to claim 8 including a third conduit connected to said first conduit at an angle relative thereto, having an interior thereof communicating with the interior of said first conduit providing a material flow passageway through said conduits.
10. A closure member for an open end of a first conduit forming a component of a transport line for pneumatically conveying a bulk material, having a second conduit connected thereto at an angle and the interior thereof communicating with the interior of said first conduit to provide a material flow passageway therethrough, comprising:
a cap member detachably mountable on said first mentioned conduit in closing relation relative to said open end thereof, including a section extendable into said first mentioned conduit when said cap member is mounted on said first conduit, having a peripheral side wall formed of an impermeable material and an end wall formed of a permeable material, and an inlet for injecting a fluidizing gas into said extendable section.
11. A cap member according to claim 10 including means for detachably clamping said cap member to said first conduit.
12. A cap member according to claim 11 including a nozzle mounted on said cap member for injecting a gas under pressure into said first conduit.
13. A closure member according to claim 10 wherein said cap member includes a peripheral portion which may be mated to a flange portion of said first conduit for detachably mounting said cap member to said first conduit.
14. A closure member according to claim 13 including a nozzle mounted in said cap member for injecting a gas under pressure into said first conduit when mounted thereon.
15. A closure member according to claim 10 wherein said cap member includes a annular peripheral portion which may be mated to an annular flange portion of said first mentioned conduit, and including an annular clamp for detachably connecting said peripheral portion of said cap member to said annular flange of said first conduit when mated together.
16. A closure member according to claim 15 including a nozzle mounted in said cap member for injecting a gas under pressure into said first conduit when mounted thereon.
17. A closure member according to claim 10 including a nozzle mounted on said cap member and extending through said extendable section for injecting a gas under pressure into said first conduit when mounted thereon.
18. A closure member according to claim 10 wherein said extendable section includes a cylindrical side wall portion formed of an impermeable material and a planar end wall disposed at an angle relative to the axis of said wall, formed of a permeable material.
19. A closure member according to claim 18 wherein said nozzle is mounted on said cap member and extends axially through said extendable section.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A substrate board being applied to arrange at least one working electronic component, which generates a heat energy when working, also being applied to provide an electrical isolation condition for the working electronic component, and the substrate board comprising:
a substrate layer having an arrangement surface and a heat-dissipating surface;
a first anodic treatment layer covering the arrangement surface for arranging the electronic working component;
a second anodic treatment layer covering the heat-dissipating surface for conducting the heat energy;
a heat conduction and electrical isolation layer covering the second anodic treatment layer for conducting the heat energy; and
a diamond like carbon (DLC) layer covering the heat conduction and electrical isolation layer for dissipating the heat energy;
wherein the heat expansion coefficient of the substrate layer is greater than that of the second anodic treatment layer; the heat expansion coefficient of the second anodic treatment layer is greater than that of the heat conduction and electrical isolation layer; and the heat expansion coefficient of the heat conduction and electrical isolation layer is greater than that of the DLC layer.
2. The substrate board as claimed in claim 1, wherein the first anodic treatment layer is laid out with a printed circuit for arranging the electronic component.
3. The substrate board as claimed in claim 1, wherein the substrate layer is composed of one of an aluminum alloy and a copper alloy.
4. The substrate board as claimed in claim 1, wherein the second anodic treatment layer is composed of a metallic oxide of a metal, so as to provide the electrical isolation condition.
5. The substrate board as claimed in claim 4, wherein the metal is aluminum (Al), and the metallic oxide is aluminum oxide (Al2O3).
6. The substrate board as claimed in claim 4, wherein the heat conduction and electrical isolation layer is composed of a metallic nitride of the metal.
7. The substrate board as claimed in claim 6, wherein the metal is aluminum (Al), and the metallic nitride is aluminum nitride (AlN).
8. The substrate board as claimed in claim 1, wherein the heat conduction and electrical isolation layer is composed of one of beryllium oxide (BeO), silicon carbide (SiC), silicon nitride (Si3N4) and boron nitride (BN).
9. The substrate board as claimed in claim 1, wherein the DLC layer is a DLC heat-dissipating fin assembly.
10. A method for manufacturing the substrate board as claimed in claim 1, comprising the steps of:
(a) providing the substrate layer;
(b) executing an anodic treatment to the substrate layer, so as to form the first anodic treatment layer and the second anodic treatment layer respectively on the arrangement surface and the heat-dissipating surface;
(c) forming the heat conduction and electrical isolation layer on the DLC layer; and
(d) forming the DLC layer on the heat conduction and electrical isolation layer;
wherein the heat conduction coefficient of the second anodic treatment layer is less than that of the heat conduction and electrical isolation layer; the heat conduction coefficient of the heat conduction and electrical isolation layer is less than that of the DLC layer.
11. The method as claimed in claimed 10, after the step (d), further comprising a step (f) of executing an optical lithography to make the DLC layer become a DLC heat-dissipating-fin assembly.
12. The method as claimed in claimed 10, wherein the heat conduction and electrical isolation layer is formed on the second anodic treatment layer via executing one of a vacuum-sputter treatment, a plasma vapor deposition (PVD) treatment, a chemical vapor deposition (CVD) treatment, and an ion implantation treatment.
13. The method as claimed in claimed 10, wherein the DLC layer is formed on the heat conduction and electrical isolation layer via executing one of a plasma-enhanced chemical vapor deposition (PECVD) treatment, a PVD treatment and a CVD treatment.
14. The method as claimed in claimed 10, wherein the substrate layer is composed of one of an aluminum alloy and a copper alloy.
15. The method as claimed in claimed 10, wherein the second anodic treatment layer is composed of a metallic oxide of a metal.
16. The method as claimed in claimed 15, wherein the metal is aluminum (Al), and the metallic oxide is aluminum oxide (Al2O3).
17. The method as claimed in claimed 15, wherein the heat conduction and electrical isolation layer is composed of a metallic nitride of the metal.
18. The method as claimed in claimed 17, wherein the metal is aluminum (Al), and the metallic nitride is aluminum nitride (AlN).
19. The method as claimed in claimed 10, wherein the heat conduction and electrical isolation layer is composed of one of beryllium oxide (BeO), silicon carbide (SiC), silicon nitride (Si3N4) and boron nitride (BN).