All The Claims

1. A portable heat recovery system comprising:
a heater core;
a first pair of fluid coupling ends fluidly coupled to the heater core to circulate fluid therethrough and retain fluid therein when not connected to complementary ends; and
a cabling assembly including:
a pair of fluid lines having first and second ends;
a second pair of fluid coupling ends connected to the first ends of the pair of fluid lines and configured to form a quick disconnect fluid transfer coupling with the first pair of fluid coupling ends; and
a third pair of fluid coupling ends connected to the second ends of the pair of fluid lines and configured to form a quick disconnect fluid transfer coupling, wherein the second pair of coupling ends and the third pair coupling ends are configured to retain fluid in the lines when the second pair coupling ends and the third pair of coupling ends are disconnected from complement ends.
2. The portable heat recovery system of claim 1 and further comprising;
one or more fluid pumps fluidly connected to the heater core; and
a coupling assembly including:
a second pair of fluid lines configured to be connected to a source of heated fluid; and

a fourth pair of fluid coupling ends fluidly connected to the first pair of fluid lines and removably connected to the third pair of fluid coupling ends.
3. The portable heat recovery system of claim 2 wherein the coupling assembly further comprises a housing wherein the one or more fluid pumps are mounted in the housing.
4. The portable heat recovery system of claim 2 wherein the one or more fluid pumps are mounted in the enclosure.
5. The portable heat recovery system of claim 1 wherein the cabling assembly is flexible and includes and exterior sheath securing the second pair fluid lines and electrical conductors therein so as to be carried a single unit.
6. The portable heat recovery system of claim 5 wherein the cabling assembly comprises removably connectable segments, each segment having fluid lines and electrical conductors.
7. The portable heat recovery system of claim 1 and further comprising an enclosure, the heater core mounted in the enclosure.
8. The portable heat recovery system of claim 7 wherein the enclosure comprises a blanket.
9. The portable heat recovery system of claim 7 wherein the enclosure has apertures for airflow therethrough, a blower mounted in the enclosure and configured to blow air through the apertures and an electrical connector connected to the blower.
10. The portable heat recovery system of claim 9 and further comprising;
one or more fluid pumps fluidly connected to the heater core; and
a coupling assembly including:
a second pair of fluid lines configured to be connected to a source of heated fluid; and

a fourth pair of fluid coupling ends fluidly connected to the first pair of fluid lines and removably connected to the third pair of fluid coupling ends;
a second electrical connector configured to be connected to an electrical source of power, and the cabling assembly includes electrical conductors removably connectable to the electrical connector on the enclosure and removably connectable to the second electrical conductor.
11. The portable heat recovery system of claim 10 wherein the enclosure includes first switch connected to the blower and a second switch electrically connected to the one or more fluid pumps.
12. The portable heat recovery system of claim 11 wherein the one or more fluid pumps are remote from the enclosure and an electrical conductor is provided in the cabling assembly to electrically connect the second switch to the one or more fluid pumps.
13. The portable heat recovery system of claim 1 and further comprising a temperature sensor operably connected to the fluid flowing through the heater core and configured to provide an output indicative of temperature of the fluid.
14. The portable heat recovery system of claim 13 and further comprising a controller configured to receive the output from the temperature sensor and provide a second output configured to control fluid flow through the heater core.
15. The portable heat recovery system of claim 14 wherein the second output is operatively connected to the one or more fluid pumps.
16. The portable heat recovery system of claim 14 and further comprising one or more valves configured to inhibit fluid flow through the heater core, second output being operatively connected to the one or more valves.
17. The portable heat recovery system of claim 14 wherein the controller includes a third output configured to control an engine comprising the heated source.
18. The portable heat recovery system of claim 1 and further comprising a pressure sensor configured to provide an output indicative of pressure of the fluid in the system.
19. The portable heat recovery system of claim 18 and further comprising a controller configured to receive the output from the pressure sensor and provide a second output configured to control fluid flow through the system.
20. A method of recovering waste heat from an engine when the engine is not operating, the method comprising;
connecting a heater core to source of fluid heated due to operation of the engine with fluid lines, the flow of fluid from the source of heated fluid controlled by one or more pumps; and
operating the pumps when the engine is not operating to circulate the fluid from the source of heated fluid through the heater core.
21. The method of claim 20 wherein connecting the heater core comprises connecting the fluid lines to receive coolant fluid used to cool the engine during operation.
22. The method of claim 20 wherein connecting the heater core comprises connecting the heater to heat exchanger such that source of heater fluid is separate from coolant fluid used to cool the engine during operation.
23. The method of claim 20 and further comprising;
measuring a temperature of the fluid provided to or through the heater core; and
operating the engine to heat the source of heated fluid when the temperature of the fluid falls below a selected temperature turning the engine off when the source of heated fluid reaches a selected temperature.
24. The method of claim 23 wherein the engine is a vehicle engine.
25. A system for recovering waste heat, the system comprising
an engine;
a heater core connected to a source of fluid heated due to operation of the engine with fluid lines;
one or more pumps connected to the heater core to control fluid flow to the heater core; and
a control device connected to the one or more pumps and configured to operate the one or more pumps when the engine is not operating to circulate the fluid from the source of heated fluid through the heater core.
26. The system of claim 25 wherein the source of fluid comprises a coolant system of the engine.
27. The system of claim 26 and further comprising a temperature sensor operably connected to the fluid flowing through the heater core and configured to provide an output indicative of temperature of the fluid, the control device connected to the temperature sensor to receive the output, and wherein the control device is configured to provide an output configured to control operation of the engine based on the temperature of the fluid.
28. The system of claim 27 wherein the engine is on a vehicle.
29. The system of claim 25 and further comprising a cooling assembly operably coupled to the heater core to receive heat therefrom.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A cylindrical grinding and polishing device, comprising:
a main body defining a cavity therein;
a polishing device received in the cavity, the polishing device comprising a plurality of polishing wheels positioned along a first direction;
a cylindrical grinding device received in the cavity, the cylindrical grinding device comprising a grinding wheel positioned at an end of the cavity along a second direction substantially perpendicular to the first direction; and
a support device received in the cavity, the support device comprising a support plate for supporting a work-piece, the support device capable of carrying the work-piece to contact the polishing wheels or the grinding wheel; and
a sliding rail received in the cavity, the slide rail being positioned on the bottom of the cavity and extending parallel to the first direction of the cavity,

wherein the support device comprises a drive unit and an elevation unit, the drive unit is slidably positioned on the slide rail, the elevation unit is capable of being driven by the drive unit to move toward or away from the polishing wheels, and the support plate is rotatably connected to an end of the elevation unit.
2. The cylindrical grinding and polishing device as claimed in claim 1, wherein the main body defines an opening communicating with the cavity for ingress and egress of the work-piece.
3. The cylindrical grinding and polishing device as claimed in claim 1, wherein the support plate defines a suction hole for sucking the work-piece.
4. The cylindrical grinding and polishing device as claimed in claim 3, wherein the elevation unit is a hollow threaded shaft, the suction hole is communicated to the elevation unit.
5. The cylindrical grinding and polishing device as claimed in claim 1, further comprising a first cleaning device positioned over the polishing device for jetting cleaning fluid to the work-piece during a polishing process.
6. The cylindrical grinding and polishing device as claimed in claim 1, further comprising a second cleaning device positioned adjacent to the cylindrical grinding device for jetting cleaning fluid to the work-piece during a cylindrical grinding process.
7. The cylindrical grinding and polishing device as claimed in claim 1, further comprising a drying device received in the cavity for drying the work-piece.
8. The cylindrical grinding and polishing device as claimed in claim 1, wherein each of the polishing wheels and the grinding wheel are emery wheels.
9. The cylindrical grinding and polishing device as claimed in claim 1, wherein each of the polishing wheels and the grinding wheel are barrel-shaped.
10. The cylindrical grinding and polishing device as claimed in claim 1, wherein the cavity is cuboid shaped.

1. A water treatment system comprising:
an aquarium having a glass tank having an interior filled with water, said tank having an open top and a top edge;
dual pumps including a first water pump and a second water pump alternating to replenish a water level in the tank and simultaneously maintaining calcium and alkalinity balances;
a pair of reservoirs including a calcium solution reservoir and an alkalinity solution reservoir, said calcium solution reservoir containing fresh reverse osmosis and de-ionized water treated with a calcium supplement, said alkalinity solution reservoir containing fresh reverse osmosis and de-ionized water treated with an alkalinity supplement;
a first pair of pipes including a first pipe and a second pipe, wherein said first pipe connects said calcium reservoirs to said first dual pump, and wherein said second pipe connects said alkalinity solution reservoir to said second pump;
a second pair of pipes including a third pipe and a fourth pipe, wherein said third pipe carries solution from said first pumps into said interior of said tank, and wherein said fourth pipe carries solution from said second pipe into said interior of said tank;
a pair of pipe holders including a first and second pipe holder attachable to said top edge of said aquarium, wherein said first pipe holder holds said third pipe positionable downwardly and into said interior of said tank, and wherein said second pipe holder holds said fourth pipe positionable downwardly and into said interior of said tank;
a switch box having a back end and a top surface and positionable between said calcium solution reservoir and said alkalinity solution reservoir, wherein said switch box having two alternating current power sockets attachable to said back end for delivering electrical power to said first and second water pumps separately, wherein said back end having an alternating current power cord and wires extending from said water level sensors, wherein said top surface having three apertures thereon;
three light emitting diodes including a first, second and third light emitting diode, one said diode extending upwardly through each said aperture, wherein said first light emitting diode indicating power, said second light emitting diode indicating activation of said calcium solution reservoir, and said third light emitting diode indicating activation of said alkalinity solution reservoir;
a printed circuit board housed within said switch box, having a solid state relay mounted thereon and in communication with each pump for alternating pumping from said calcium solution reservoir to said alkalinity solution reservoir;
wherein said first and second dual pumps each have a bottom end having an alternating current line cord extending outwardly therefrom, each alternating current line cord having a two prong alternating current power plug for plugging into one of said alternating current power sockets of said switch box, wherein said first pump is separately connected by said first pipe to said calcium solution reservoir, wherein said second pump is separately connected by said second pipe to said alkalinity solution reservoir;
a pair of water level sensors in communication with said solid state relay, said sensors having a top end electrically connected to said printed circuit board and relay within said switch box by said wires, said sensors having bottom ends submerged within said water of said tank, wherein said sensor holder is securely mounted to said top edge of said tank; and
a power switch coupled to said switch box, and having a standard power cord for powering said system.
2. The water treatment system of claim 1 further comprising two float switches, including an upper and lower switch, wired in series mounted to an adjustable water level sensor holder for detecting low water levels within the tank, wherein the lower switch is mountable lower than the higher switch within the tank.
3. The water treatment system of claim 1 wherein the water level sensors are from the group consisting of liquid point level detection, continuous level monitoring, including magnetic and mechanical float level sensors, pneumatic level sensors, electrode based level sensors, capacitance level sensors, optical interface point level sensors, ultrasonic sensors, radar level sensors, magnetostrictive level sensors, resistive chain level sensors, hydrostatic pressure level sensors, and air bubbler level measurement systems.
4. The water treatment system of claim 1 wherein said aquarium is a marine reef aquarium.
3. The water treatment system of claim 1 wherein said calcium solution reservoir and alkalinity solution reservoir is stored beneath said aquarium.
4. The water treatment system of claim 1 wherein said first and second pumps are submersible.
5. The water treatment system of claim 1 wherein said first and second pumps are external water pumps.
6. A water treatment system for automatically replenishing a water level within an aquarium the steps comprising:
i) providing the system of claim 1;
ii) detecting a drop in water level below a predetermined level by said water level sensors;
iii) triggering the relay to actuate the power of the first pump;
iv) pumping fresh water from the calcium solution reservoir into the tank by the first pump;
v) detecting a full tank by water level sensors and triggering the relay;
vi) turning the first pump off;
vii) detecting a drop in water level below a predetermined level by said water level sensors;
viii) triggering the relay to actuate the power of the second pump;
ix) pumping fresh water from the alkalinity solution reservoir into the tank by the second pump;
x) detecting a full tank by water level sensors and triggering the relay; and
xi) turning the second pump off.
7. The water treatment system for automatically replenishing a water level within an aquarium further comprising repeating steps ii) through xi).
8. A water treatment system for automatically replenishing a water level within an aquarium the steps comprising:
i) providing the system of claim 1;
ii) detecting a drop in water level below a predetermined level; and
iii) replenishing water into the tank by alternating between said calcium solution reservoir to said alkalinity solution reservoir by said solid state relay.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An integrated device, comprising:
a semiconductor substrate having at least one first portion of at least one microfluidic system, and a second portion for the integration of an additional circuitry;
wherein said microfluidic system includes at least one cavity realized in a containment layer of said integrated device and closed on top by at least one portion of a polysilicon layer, said polysilicon layer being a thin layer that is also disposed over said additional circuitry, said closing portion of said cavity realizing a piezoresistive membrane for said microfluidic system.
2. Integrated device according to claim 1, further comprising a contact, realized in correspondence with at least one active area, realized in said thin polysilicon layer in said first portion, said contact being suitable for controlling said covering portion of said cavity as piezoresistive membranes of said microfluidic system.
3. Integrated device according to claim 2, wherein said additional circuitry is realized by means of thin film technology and comprises said thin polysilicon layer.
4. Integrated device according to claim 3, wherein said additional circuitry comprises at least one thin film transistor including at least one circuitry active area realized in a second portion of said thin polysilicon layer in correspondence with said second portion and contacted by means of a first circuitry contact, while a second circuitry contact is realized in correspondence with a non active area of said second portion, said first circuitry contact being a sourcedrain contact and said second circuitry contact being a gate contact of said thin film transistor.
5. Integrated device according to claim 3, wherein said cavity is realized in a first oxide layer realized above said semiconductor substrate.
6. Integrated device according to claim 5, wherein said first oxide layer comprises at least one portion of greater thickness with respect to the rest of the layer and in that said cavity is realized in said portion of greater thickness.
7. Integrated device according to claim 6, wherein said first oxide layer has a step in correspondence with said portion of greater thickness, in superelevated position with respect to an upper surface level of said second circuitry portion.
8. Integrated device according to claim 6, wherein said first oxide layer has a lowered portion in correspondence with said first portion for realizing said portion of greater thickness.
9. Integrated device according to claim 3, wherein said cavity is realized in said semiconductor substrate and is closed on top by a first oxide layer.
10. Integrated device according to claim 9, further comprising at least one first, one second and one third portion of said thin polysilicon layer realized above said first oxide layer in correspondence with said cavity and separated from each other by at least one first and one second opening for realizing a piezoresistive membrane provided with microfluidic openings for said microfluidic system.
11. Integrated device according to claim 9, wherein said cavity comprises a trench structure.
12. Integrated device according to claim 11, wherein said trench structure comprises a covering oxide layer that covers side walls and a bottom of said trench.
13. Integrated device according to claim 5, further comprising a second oxide layer realized above said thin polysilicon layer and above said first oxide layer on the whole integrated device.
14. Integrated device according to claim 13, further comprising, above said semiconductor substrate and below said first oxide layer, a doped silicon layer.
15. Integrated device according to claim 14, wherein said doped silicon layer extends at least in correspondence with said first portion.
16. Integrated device according to claim 14, wherein said doped silicon layer extends above said semiconductor substrate in correspondence with said first portion and with said second portion.
17. Integrated device according to claim 14, further comprising a substrate contact.
18. Integrated device according to claim 17, wherein said substrate contact is realized in correspondence with a suitable opening in contact with said doped silicon layer.
19. Integrated device according to claim 17, wherein said substrate contact is realized on the back of the device itself, directly in contact with said semiconductor substrate.
20. Integrated device according to claim 1, wherein said microfluidic system realizes one among a sensor, a tank for fluids, and a microchannel for fluids.
21. An apparatus, comprising:
a semiconductor;
a first section of the semiconductor including,
a cavity having an opening, and
a first piezo-resistive semiconductor layer disposed over the opening; and

a second section of the semiconductor including
a second semiconductor layer, and
a circuit component disposed in the second semiconductor layer.
22. The apparatus of claim 21 wherein the first and second semiconductor layers form respective portions of a same semiconductor layer.
23. The apparatus of claim 21 wherein:
the first section includes an insulator layer; and
the cavity is disposed in the insulator layer.
24. The apparatus of claim 21 wherein:
the second section includes an insulator layer; and
the circuit component is disposed over the insulator layer.
25. The apparatus of claim 21 wherein:
the first section includes a first insulator layer;
the cavity is disposed in the first insulator layer;
the second section includes a second insulator layer; and
the circuit component is disposed over the second insulator layer.
26. The apparatus of claim 25 wherein the first and second insulator layers form respective portions of a same insulator layer.
27. The apparatus of claim 25, further comprising:
a substrate having a surface;
wherein the first and second insulator layers are disposed over the surface of the substrate; and
wherein the first insulator layer extends a higher above the surface of substrate than the second insulator layer extends.
28. The apparatus of claim 25, further comprising:
a substrate having a first surface at a first level and a second surface at a second level; and
wherein the first and second insulator layers are respectively disposed over the first and second surfaces of the substrate.
29. The apparatus of claim 28 wherein the first level is lower than the second level.
30. The apparatus of claim 28 wherein the first level is higher than the second level.
31. The apparatus of claim 25, further comprising:
a substrate having a surface;
wherein the first and second insulator layers are disposed over the surface of the substrate; and
a third semiconductor layer disposed between the substrate and the first insulator layer.
32. The apparatus of claim 31 wherein the third semiconductor layer is disposed between the substrate and the second insulator.
33. The apparatus of claim 31, further comprising an electrical contact coupled to the third semiconductor layer.
34. The apparatus of claim 21, further comprising:
a substrate;
wherein the cavity is disposed in the substrate; and
wherein the circuit component is disposed over the substrate.
35. The apparatus of claim 21, further comprising:
a substrate;
wherein the cavity includes an insulator-lined trench disposed in the substrate; and
wherein the circuit component is disposed over the substrate.
36. The apparatus of claim 21 wherein the first semiconductor layer includes a piezo-resistive material.
37. The apparatus of claim 21, further comprising a micro-fluidic opening in the first semiconductor layer over the cavity opening.
38. The apparatus of claim 21 wherein the first section includes an insulator layer disposed over the first semiconductor layer.
39. The apparatus of claim 21 wherein the second section includes an insulator layer disposed over the second semiconductor layer.
40. The apparatus of claim 21, further comprising an insulator layer disposed over the first and second semiconductor layers.
41. The apparatus of claim 21 wherein the circuit component comprises a thin-film transistor.
42. A system, comprising:
a first integrated circuit, including
a first section including,
a cavity having an opening, and
a first piezo-resistive semiconductor layer disposed over the opening; and

a second section including
a second semiconductor layer, and
a circuit component disposed in the second semiconductor layer; and
a second integrated circuit coupled to the first integrated circuit.
43. The system of claim 42 wherein the first and second integrated circuits are disposed on a same die.
44. A system, comprising:
a first integrated circuit, including
a first section including,
a cavity having an opening, and
a first semiconductor layer disposed over the opening; and

a second section including
a second semiconductor layer, and
a circuit component disposed in the second semiconductor layer; and
a second integrated circuit coupled to the first integrated circuit;
wherein the first and second integrated circuits are disposed on respective dies.
45. The system of claim 42 wherein one of the first and second integrated circuits comprises a controller.
46. The system of claim 42 wherein the first integrated circuit comprises a fluid analyzer.