1. The process for coating solid particles with at least one hot-melt agent, according to which:
the solid particles are fluidized in a spiralling, ascending current of air making it possible to obtain a homogeneous separated distribution of the particles in the air bed, the temperature of the air bed being lower than the melting temperature of the hot-melt agent,
the molten hot-melt agent is then sprayed onto the particles, in the form of atomized droplets, said droplets being distributed in a spray cone contained in a region of air, the temperature of which makes it possible to maintain, throughout said spraying, a hot-melt agent temperature which is substantially equal to the melting temperature thereof, the spraying being carried out in an ascending manner in the same direction as and tangentially to the path of the solid particles,
finally, when the coating is finished, the coated particles obtained are cooled so as to solidify the hot-melt agent around the particles.
2. The process as claimed in claim 1, characterized in that the solid particle is heat-sensitive and has a melting point close to, but higher than, that of the hot-melt agent.
3. The process as claimed in claim 1, characterized in that the diameter of the solid particles is less than 200 micrometers, advantageously between 30 and 180 micrometers.
4. The process as claimed in claim 1, characterized in that the temperature of the air bed is chosen so as to maintain the solid particle at a temperature which is below the melting temperature of the hot-melt agent, and which advantageously has a value close to 20 C. lower than the melting temperature of the hot-melt agent.
5. The process as claimed in claim 1, characterized in that the air pressure for atomizing the hot-melt agent is set, beforehand, between 0.3 bar and 5 bar, advantageously between 1 and 2 bar.
6. The process as claimed in claim 1, characterized in that the temperature of the region of air surrounding the spray cone in which the atomized droplets are maintained is advantageously chosen between or 5 C. with respect to the melting temperature of the hot-melt agent.
7. The process as claimed in claim 1, characterized in that the pressure of the region of air surrounding the spray cone containing the atomized droplets is less than 1.5 bar, advantageously equal to 0.5 bar.
8. The process as claimed in claim 1, characterized in that the temperature of the air for atomizing the hot-melt agent is a maximum of 10 C. higher than the melting temperature of said agent.
9. The process as claimed in claim 1, characterized in that the rate of spraying the hot-melt agent is between 5 and 50 gminute.
10. The process as claimed in claim 1, characterized in that the coating represents from 1 to 25% by weight, depending on the objective sought.
11. The process as claimed in claim 1, characterized in that the solid particle is an active principle chosen from the group comprising:
hydrochlorothiazide, acetazolamide, acetylsalicylic acid, allopurinol, alprenolol, amiloride, an anti-arrhythmia agent, an antibiotic, an antidiabetic, an anti-epileptic, anti-clotting agents, an antimycotic agent, atenolol, bendroflumethiazide, benzbromarone, benzthiazide, betamethasone and the esters thereof, a bronchodilator, buphenine, bupranolol, chlordiazepoxide, chloroquine, chlorothiazide, chlorpromazine, chlortalidone, clenbuterol, clomipramine, clonidine, co-dergocrine, cortisone, and the esters thereof, dexamethasone, and the esters thereof, dextropropoxyphene, diazepam, diazoxide, diclofenac, diclofenamide, digitalis glycoside, dihydralazine, dihidroergotamine, diltiazem, metal salts, ergotamine, ethacrynic acid, ethinyloestradiol, ethoxyzolamide, fenoterol, fludrocortinone, and the esters thereof, fluphenazine, furosemide, gallopamil, guanethidine, a hormone, hydrocortisone, and the esters thereof, hydroflumethiazide, an immunosuppressor, ibuprofen, imipramine, indomethacin, levodopa, a lithium salt, a magnesium salt, medroxyprogesterone acetate, menadione, methaqualone, 8-methoxypsoralen, methylclothiazide, methyldopa, methylprednisolone, methylestosterone, methylthiouracil, methylxanthine, metipranodol, molsidomine, morphine, naproxen, nicergoline, nifedipine, norfenefrine, oxyphenbutazone, papaverine, parmathasone, and the esters thereof, pentobarbital, perphenazine, phenobarbital, phenylbutazone, phytomenadione, pirenzepine, polythiazide, prazosine, prednisolone, and the esters thereof, prednisone, and the esters thereof, probenecid, propranolol, propylthiouracil, rescinnamine, reserpine, secbutabarbital, secobarbital, spironolactone, sulphasalazine, sulphonamide, thioridazine, triamcinolone, and the esters thereof, triamteren, trichlormethiazide, trifluoperazine, trifluopromazine, a tubercular static agent, verapamil, a virustatic agent, a zytostatic agent, bromocriptine, bromopride, carbidopa, carbocromen, quinine, chlorprothixene, cimetidine, clofibrate, cyclizine, desipramine, disulphiram, domperidone, doxepin, fenbufen, flufenamine acid, flunarizine, gemfibrocil, haloperidol, ketoprofen, labetalol, lorazepam, mefenamine acid, melperone, metoclopramide, nortriptyline, noscapine, oxprenolol, oxymetholone, pentazocine, pethidine, stanozolol, sulindac, sulpiride, tiotixene.
12. The process as claimed in claim 1, characterized in that the hot-melt agent is a lipid based on free fatty acids andor on fatty acid esters.
13. The process as claimed in claim 12, characterized in that the lipid comprises at least one partial ester of alcohol with at least one fatty acid.
14. The process as claimed in claim 13, characterized in that the lipid is chosen from the group comprising esters of palmitostearic acid and of alcohol, and esters of behenic acid and of alcohol.
15. A coated solid particle which can be obtained using the process which is the subject of claim 1.
16. A solid particle coated with a coating agent comprising at least one partial ester of alcohol with at least one fatty acid, characterized in that the particle size before coating is less than 400 micrometers, advantageously less than 200 micrometers, and in that the coating represents between 1 and 25% by weight of the coated particle.
17. The particle as claimed in claim 16, characterized in that the coating represents from 2 to 8% by weight of the coated particle.
18. The particle as claimed in claim 16, characterized in that it is heat-sensitive and has a melting point which is close to, but higher than, that of the hot-melt agent.
19. The particle as claimed in claim 16, characterized in that the particle is an active principle chosen from the group comprising:
hydrochlorothiazide, acetazolamide, acetylsalicylic acid, allopurinol, alprenolol, amiloride, an anti-arrhythmia agent, an antibiotic, an antidiabetic, an anti-epileptic, anti-clotting agents, an antimycotic agent, atenolol, bendroflumethiazide, benzbromarone, benzthiazide, betamethasone and the esters thereof, a bronchodilator, buphenine, bupranolol, chlordiazepoxide, chloroquine, chlorothiazide, chlorpromazine, chlortalidone, clenbuterol, clomipramine, clonidine, co-dergocrine, cortisone, and the esters thereof, dexamethasone, and the esters thereof, dextropropoxyphene, diazepam, diazoxide, diclofenac, diclofenamide, digitalis glycoside, dihydralazine, dihidroergotamine, diltiazem, metal salts, ergotamine, ethacrynic acid, ethinyloestradiol, ethoxyzolamide, fenoterol, fludrocortinone, and the esters thereof, fluphenazine, furosemide, gallopamil, guanethidine, a hormone, hydrocortisone, and the esters thereof, hydroflumethiazide, an immunosuppressor, ibuprofen, imipramine, indomethacin, levodopa, a lithium salt, a magnesium salt, medroxyprogesterone acetate, menadione, methaqualone, 8-methoxypsoralen, methylclothiazide, methyldopa, methylprednisolone, methylestosterone, methylthiouracil, methylxanthine, metipranodol, molsidomine, morphine, naproxen, nicergoline, nifedipine, norfenefrine, oxyphenbutazone, papaverine, parmathasone, and the esters thereof, pentobarbital, perphenazine, phenobarbital, phenylbutazone, phytomenadione, pirenzepine, polythiazide, prazosine, prednisolone, and the esters thereof, prednisone, and the esters thereof, probenecid, propranolol, propylthiouracil, rescinnamine, reserpine, secbutabarbital, secobarbital, spironolactone, sulphasalazine, sulphonamide, thioridazine, triamcinolone, and the esters thereof, triamteren, trichlormethiazide, trifluoperazine, trifluopromazine, a tubercular static agent, verapamil, a virustatic agent, a zytostatic agent, bromocriptine, bromopride, carbidopa, carbocromen, quinine, chlorprothixene, cimetidine, clofibrate, cyclizine, desipramine, disulphiram, domperidone, doxepin, fenbufen, flufenamine acid, flunarizine, gemfibrocil, haloperidol, ketoprofen, labetalol, lorazepam, mefenamine acid, melperone, metoclopramide, nortriptyline, noscapine, oxprenolol, oxymetholone, pentazocine, pethidine, stanozolol, sulindac, sulpiride, tiotixene.
20. The particle as claimed in claim 16, characterized in that the partial ester of alcohol with at least one fatty acid is chosen from the group comprising esters of palmitostearic acid and of alcohol, and esters of behenic acid and of alcohol.
21. A composition which integrates the coated particles which are the subjects of claim 16.
22. An ibuprofen particle coated with a coating agent, characterized in that the uncoated particle size is less than 200 micrometers, and in that the coating agent comprises at least one partial ester of alcohol with at least one fatty acid and represents between 1 and 25% by weight of the coated particle, advantageously between 2 and 8%.
23. The particle as claimed in claim 22, characterized in that the coating agent is chosen from the group comprising esters of palmitostearic acid and of alcohol, and esters of behenic acid and of alcohol.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An integrated circuit package, comprising:
a first chip having a first side and a second side, the first and second sides having a first plurality of conductive pads formed thereon, at least one conductive pad on the first side being electrically connected to a conductive pad on the second side, the first side containing active circuitry of the first chip;
a first layer formed directly on the second side and having a first cutout, wherein the first layer comprises a polymer material;
a second chip disposed in the first cutout;
a dielectric second layer formed directly on the first layer and the second chip and having a second cutout;
a third chip disposed in the second cutout;
a third dielectric layer formed directly on the second layer and the third chip; and
an interconnect formed in the one or more of the first, second or third layers to electrically connect at least one conductive pad of the first plurality of conductive pads to one or more of the second and third chips.
2. The integrated circuit package of claim 1, wherein the interconnect further comprises a second plurality of conductive pads on an exposed surface of one or more of the first, second or third layers.
3. The integrated circuit package of claim 1, further comprising:
a second interconnect disposed in the first layer, the second interconnect electrically connected to conductive pads of the first plurality of conductive pads on the first side, the second interconnect including third conductive pads on an exposed surface of the first layer.
4. The integrated circuit package of claim 1, wherein the second and third layers comprise a polymer material.
5. The integrated circuit package of claim 1, further comprising:
a first plurality of conductive bumps electrically connected to conductive pads on the first side of the first chip; and
a second plurality of conductive bumps on at least one exposed surface of one or more of the first, second or third layers, the first chip being disposed between the first and second plurality of conductive bumps.
6. The integrated circuit package of claim 5, further comprising a ball grid array structure coupled to the first plurality of conductive bumps.
7. The integrated circuit package of claim 5, wherein the second plurality of conductive bumps to provide test access points.
8. The integrated circuit package of claim 1, wherein the second chip is joined to the first chip to form a flip-chip structure.
9. The integrated circuit package of claim 1, wherein the interconnect comprises metal deposited in a electroless deposition process.
10. The integrated circuit package of claim 1, wherein the first, second and third chips are thinned chips.
11. The integrated circuit package of claim 1, wherein the first, second and third chips are part of a single wafer before being singulated together in a single package.
12. The integrated circuit package of claim 1, wherein the second chip has a thickness of about 75 \u03bcm.
13. The integrated circuit package of claim 1, wherein the third chip has a thickness of about 50 \u03bcm.
14. An integrated circuit package, comprising:
a first chip having a first side and a second side, the first and second sides having a first plurality of conductive pads formed thereon, at least one conductive pad on the first side being electrically connected to a conductive pad on the second side, the first side containing active circuitry of the first chip;
a first layer formed directly on the second side and having a first hole, wherein the first layer comprises a polymer material;
a second chip disposed in the first hole;
a second dielectric layer formed directly on the second chip and having a second hole;
a third chip disposed in the second hole;
a third dielectric layer formed directly on the third chip; and
an interconnect formed in the one or more of the first, second or third layers to electrically connect at least one conductive pad of the first plurality of conductive pads to one or more of the second and third chips.
15. The integrated circuit package of claim 14, wherein the interconnect further comprises a second plurality of conductive pads on an exposed surface of one or more of the first, second or third layers.
16. The integrated circuit package of claim 14, further comprising:
a second interconnect disposed in the first layer, the second interconnect electrically connected to conductive pads of the first plurality of conductive pads on the first side, the second interconnect including third conductive pads on an exposed surface of the first layer.
17. The integrated circuit package of claim 14, further comprising:
a first plurality of conductive bumps electrically connected to conductive pads on the first side of the first chip; and
a second plurality of conductive bumps on at least one exposed surface of one or more of the first, second or third layers, the first chip being disposed between the first and second plurality of conductive bumps.
18. An integrated circuit package, comprising:
a first chip having a first side and a second side, the first and second sides having a first plurality of conductive pads formed thereon, at least one conductive pad on the first side being electrically connected to a conductive pad on the second side, the first side containing active circuitry of the first chip;
a first layer formed directly on the second side and having a first hole, wherein the first layer comprises a polymer material;
a second chip disposed in the first hole, wherein the second chip is in contact with the second side;
a second dielectric layer formed directly on the second chip and having a second hole;
a third chip disposed in the second hole, wherein the third chip is in contact with the second chip;
a third dielectric layer formed directly on the third chip; and
an interconnect formed in the one or more of the first, second or third layers to electrically connect at least one conductive pad of the first plurality of conductive pads to one or more of the second and third chips.
19. The integrated circuit package of claim 18, wherein the interconnect further comprises a second plurality of conductive pads on an exposed surface of one or more of the first, second or third layers.
20. The integrated circuit package of claim 18, further comprising:
a second interconnect disposed in the first layer, the second interconnect electrically connected to conductive pads of the first plurality of conductive pads on the first side, the second interconnect including third conductive pads on an exposed surface of the first layer.
21. The integrated circuit package of claim 14 wherein the second and third layers comprise a polymer material.
22. The integrated circuit package of claim 18 wherein the second and third layers comprise a polymer material.