1. A method for operating a telephone system having
at least two telephony terminals where functional data can be transmitted through special functions of the telephone system comprising:
allocating a second telephony terminal to a first telephony terminal through selection from a list;
assigning a respective function to an action key of the first telephony terminal depending on the status of the first or second telephony terminal; and
triggering, by a processor, the respective function by actuation of the action key of the first telephony terminal.
2. The method of claim 1, wherein in the case of available first and second telephony terminals, a call connection between the two telephony terminals is triggered by actuation of the action key.
3. The method of claim 1, wherein in the case of a call coming in on the second telephony terminal, a taking of the call by the first telephony terminal is triggered by actuation of the action key.
4. The method of claim 1, wherein in the case of several calls coming in simultaneously on the second telephony terminal, taking of one of the incoming calls by the first telephony terminal is triggered by the action key and an allocated selection unit.
5. The method of claim 1 wherein in the case of an active telephone conversation between a third terminal and the second terminal, the action key connects the first terminal to the telephone conversation.
6. The method of claim 1, wherein an incoming call, which had been forwarded before by the first telephony terminal to the second terminal is retrieved by the first terminal by means of the action key.
7. The method of claim 1, wherein the allocation of the second telephony terminal selected from the list to the first telephony terminal is triggered by the action key.
8. The method of claim 1, wherein the list of the telephony terminals available for allocation is activated by pressing the action key.
9. The method of claim 1, wherein an action key triggers special functions.
10. The method of claim 1, wherein the telephony terminals include an integrated storage, respectively, and further comprising selecting storage areas in the integrated storage for storing allocation information on other telephony terminals
11. A telephone system including at least two telephony terminals, wherein functional data can be transmitted through special functions of the telephone system between the at least two telephony terminals comprising:
a processor that allocates a second telephony terminal to a first telephony terminal through selection from a list, assigns a respective function to an action key of the first telephony terminal depending on the status of the first or second telephony terminal, and triggers the respective function by actuation of the action key of the first telephony terminal.
12. A non-transitory computer-readable information storage media having stored thereon instructions, that when executed by a processor, cause to be performed a method for operating a telephone system having at least two telephony terminals where functional data can be transmitted through special functions of the telephone system comprising:
allocating a second telephony terminal to a first telephony terminal through selection from a list;
assigning a respective function to an action key of the first telephony terminal depending on the status of the first or second telephony terminal; and
triggering the respective function by actuation of the action key of the first telephony terminal.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor device comprising:
an integrated circuit chip having active and passive surfaces, said active surface polymer-coated with a roughened surface opposing said active surface and having a plurality of electrical coupling members coupled to said active surface;
a substrate,
said chip assembled face-down onto said substrate, said coupling members forming a gap between said polymer coat and said substrate; and
polymeric underfill material filling said gap, said underfill material adhering to said polymer-coat and said substrate;
said adhesion of said underfill material being sufficiently strong so that a force applied externally to said semiconductor device breaks said substrate prior to or rather than breaking the interface between said underfill and said polymer-coat andor said substrate.
2. The device according to claim 1 further comprising:
encapsulation material protecting said passive chip surface and at least a portion of said substrate not covered by said attached chip; and
solder balls attached to said substrate opposite to the attached chip and encapsulation material.
3. The device according to claim 1 wherein said semiconductor chip comprises silicon, silicon germanium, gallium arsenide, or any other semiconductor material used in electronic device production.
4. The device according to claim 1 wherein said polymer coat is made of polyimide (PIQ) or poly-benzoxasole (PBO) in the thickness range from about 2 to 8 \u03bcm.
5. The device according to claim 1 wherein said electrical coupling members are solder bumps selected from a group consisting of tinsilver, indium, tinindium, tinbismuth, tin-lead, conductive adhesives, and solder-coated spheres, and have a diameter from about 50 to 200 \u03bcm.
6. The device according to claim 1 wherein said electrical coupling members are bumps selected from a group consisting of gold bumps, copper bumps, coppernickelpalladium bumps, and z-axis conductive epoxy.
7. The device according to claim 5 wherein said solder bumps have a center-to-center spacing between about 100 and 500 \u03bcm.
8. The device according to claim 1 wherein said underfill material is an epoxy filled with boron nitride or with aluminum nitride; the epoxy is a bisphenol A with an anhydride cross-linking agent.
9. The device according to claim 1 wherein said substrate is made of organic material and is selected from a group consisting of polyimide film, FR-4, FR-5 and BT resin and may contain a plurality of electrically conductive interconnection lines, as well as strengthening fillers including a grid of glass fibers.
10. The device according to claim 2 wherein said encapsulation material is a molding compound.