1. A method for reducing sensor redundancy in sensor-equipped devices, the method comprising:
identifying, via a master device, at least one device within an area;
querying, via the master device, the at least one device to determine at least one of a device status or application status for the at least one device;
determining, via the master device, a configuration of one or more sensors within the at least one device based at least in part on the querying; and
based at least in part on the determining, configuring, via the master device, the one or more sensors within the at least one device to balance quality of service across the master device and the at least one device.
2. The method of claim 1 wherein the at least one device comprises at least one of a smartphone, a tablet computer, a smart shoe, a smart watch, television, personal computer, or a smart glass.
3. The method of claim 1 wherein configuring the one or more sensors comprises switching a power state of the one or more sensors within the at least one device.
4. The method of claim 1 wherein configuring the one or more sensors comprises configuring one or more data processing attributes of the one or more sensors.
5. The method of claim 4 wherein the one or more data processing attributes comprises at least one of datapath, data accuracy, data format, or data interval.
6. The method of claim 1 wherein the area may be determined by at least one of a predetermined value, a dynamic value, or a determined context associated with the at least one device.
7. The method of claim 1 wherein the determining comprises determining a sensor implementation mapping of the at least one device.
8. The method of claim 1 further comprising time-synchronizing, via the master device, data from the one or more sensors within the at least one device with data from one or more sensors within the master device.
9. The method of claim 1 wherein the configuring is performed upon a predetermined interval or upon a predefined condition.
10. The method of claim 1 further comprising:
receiving, at the master device, a location request;
polling, via the master device, the or more sensors within the at least one device;
in response to the polling, receiving, from the at least one device, a location of the at least one device; and
responding, via the master device, to the location request with the location of the at least one device.
11. An apparatus for reducing sensor redundancy in sensor-equipped devices, the apparatus comprising:
a transceiver configured to send and receive a communication;
memory;
a processor coupled to the transceiver and the memory;
the processor configured to:
identify at least one device within an area;
query, via the transceiver, the at least one device to determine at least one of a device status or application status for the at least one device;
determine a configuration of one or more sensors within the at least one device based at least in part on the querying; and
based at least in part on the determining, configure the one or more sensors within the at least one device to balance quality of service across the apparatus and the at least one device.
12. The apparatus of claim 11 wherein the at least one device comprises at least one of a smartphone, a tablet computer, a smart shoe, a smart watch, television, personal computer, or a smart glass.
13. The apparatus of claim 11 wherein configuring the one or more sensors comprises switching a power state of the one or more sensors within the at least one device.
14. The apparatus of claim 11 wherein configuring the one or more sensors comprises configuring one or more data processing attributes of the one or more sensors.
15. The apparatus of claim 14 wherein the one or more data processing attributes comprises at least one of datapath, data accuracy, data format, or data interval.
16. The apparatus of claim 11 wherein the area may be determined by at least one of a predetermined value, a dynamic value, or a determined context associated with the at least one device.
17. The apparatus of claim 11 wherein the determining comprises determining a sensor implementation mapping of the at least one device.
18. The apparatus of claim 11 wherein the processor is further configured to time-synchronize data from the one or more sensors within the at least one device with data from one or more sensors within the apparatus.
19. The apparatus of claim 11 wherein the configuring is performed upon a predetermined interval or upon a predefined condition.
20. The apparatus of claim 11 wherein the processor is further configured to:
receiving a location request;
poll, via the transceiver, the or more sensors within the at least one device;
in response to the polling, receive via the transceiver, from the at least one device, a location of the at least one device; and
respond to the location request with the location of the at least one device.
21. An apparatus for reducing sensor redundancy in sensor-equipped devices, the apparatus comprising:
means for identifying, via a master device, at least one device within an area;
means for querying, via the master device, the at least one device to determine at least one of a device status or application status for the at least one device;
means for determining, via the master device, a configuration of one or more sensors within the at least one device based at least in part on the querying; and
based at least in part on the determining, means for configuring, via the master device, the one or more sensors within the at least one device to balance quality of service across the master device and the at least one device.
22. The apparatus of claim 21 wherein the means for configuring the one or more sensors comprises means for switching a power state of the one or more sensors within the at least one device.
23. The apparatus of claim 21 wherein the means for configuring the one or more sensors comprises means for configuring one or more data processing attributes of the one or more sensors.
24. The apparatus of claim 21 wherein the means for determining comprises means for determining a sensor implementation mapping of the at least one device.
25. The apparatus of claim 21 further comprising means for time-synchronizing, via the master device, data from the one or more sensors within the at least one device with data from one or more sensors within the master device.
26. A processor-readable non-transitory medium comprising processor readable instructions configured to cause a processor to:
identify at least one device within an area;
query the at least one device to determine at least one of a device status or application status for the at least one device;
determine a configuration of one or more sensors within the at least one device based at least in part on the querying; and
based at least in part on the determining, configure the one or more sensors within the at least one device to balance quality of service across a master device and the at least one device.
27. The processor-readable non-transitory medium of claim 26 wherein configuring the one or more sensors comprises switching a power state of the one or more sensors within the at least one device.
28. The processor-readable non-transitory medium of claim 26 wherein configuring the one or more sensors comprises configuring one or more data processing attributes of the one or more sensors.
29. The processor-readable non-transitory medium of claim 26 wherein the determining comprises determining a sensor implementation mapping of the at least one device.
30. The processor-readable non-transitory medium of claim 26 wherein the processor readable instructions are further configured to cause the processor to time-synchronize, via the master device, data from the one or more sensors within the at least one device with data from one or more sensors within the master device.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A flip-chip packaging process comprising:
providing a chip having thereon at least one metal pad surface;
providing a probe tip comprising a needle body and a stop cylinder having a recess for accommodating the needle body therein, the needle body being electrically connected to the stop cylinder via a resilient conductive material;
laterally moving the needle body of the probe tip to scratch a portion of the metal pad surface so as to form a protruding probe mark thereon;
pressing the protruding probe mark to a predetermined height with the stop cylinder;
forming a under bump metallurgy (UBM) over the metal pad surface; and
forming a bump over the UBM.
2. The flip-chip packaging process of claim 1 wherein the predetermined height is below 2 microns.
3. The flip-chip packaging process of claim 1 wherein the predetermined height is below 1 microns.
4. The flip-chip packaging process of claim 1 wherein the bump is solder bump.
5. The flip-chip packaging process of claim 1 wherein the metal pad is made of aluminum or copper and is formed on a chip.
6. The flip-chip packaging process of claim 1 wherein the needle body protrudes from the bottom of the stop cylinder by at least 1 micron.
7. The flip-chip packaging process of claim 1 wherein the resilient conductive material is conductive glue.
8. The flip-chip packaging process of claim 1 wherein the annual flat bottom has a width of about 20 microns to 30 microns.