1. A Picture Archiving and Communications System, comprising:
an imaging modality subsystem configured to produce medical images;
a PACS workstation communicatively coupled with the imaging modality subsystem to process data corresponding to the medical images; and
a database subsystem communicatively coupled with the imaging modality subsystem and the PACS workstation to process the medical images and the data corresponding to the medical images.
2. A Picture Archiving and Communications System as in claim 1, wherein the database subsystem uses two-phase commit processing to store the medical images.
3. A Picture Archiving and Communications System as in claim 1, wherein the database subsystem stores the medical images so as to provide atomicity, consistency, isolation and durability (ACID) characteristics.
4. A Picture Archiving and Communications System as in claim 1, wherein the database subsystem is a distributed system.
5. A Picture Archiving and Communications System as in claim 1, wherein the database subsystem includes an exception handler to process the medical images and the data corresponding to the medical images responsive to a failure of two-phase commit processing.
6. A Picture Archiving and Communications System as in claim 1, wherein the data corresponding to the medical images includes at least one of a subset of patient name, exam information, timestamp, patient medical record, image meta data, image version, image size, image quality, color depth, edit history, user identification, and audit information.
7. A Picture Archiving and Communications System as in claim 1, wherein the database subsystem is configured to ensure transactional integrity of the medical images and the data corresponding to the medical images by use of commitrollback processing in which a transaction results in commit processing if possible and rollback processing if commit processing fails.
8. A method of transactionally storing medical images and routing workflows for the medical images, comprising:
communicating the medical images to a database;
communicating data corresponding to the medical images to the database; and
processing the medical images and the data corresponding to the medical images to store the medical images and the data corresponding to the medical images in the database with transactional integrity.
9. A method as in claim 8, wherein the step of processing includes two-phase commit processing to store the medical images.
10. A method as in claim 8, wherein the step of processing includes atomicity, consistency, isolation and durability (ACID) characteristics.
11. A method as in claim 8, further comprising the step of distributing the database among a plurality of servers.
12. A method as in claim 8, wherein the processing includes exception handling to process the medical images and the data corresponding to the medical images responsive to a failure of two-phase commit processing.
13. A method as in claim 8, wherein the data corresponding to the medical images includes at least one of a subset of patient name, exam information, timestamp, patient medical record, image meta data, image version, image size, image quality, color depth, edit history, user identification, and audit information.
14. A method as in claim 8, wherein processing includes commitrollback processing in which a transaction results in commit processing if possible and rollback processing if commit processing fails.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor device comprising:
a first pad arranged on a semiconductor chip and designed to be used for bonding;
a second pad arranged on the semiconductor chip and designed to be used for both bonding and probing; and
a third pad arranged on the semiconductor chip and electrically connected to the first pad and designed to be used for probing.
2. The semiconductor device according to claim 1, wherein the first pad is arranged on an inner position of the semiconductor chip compared to the second pad and the third pad.
3. The semiconductor device according to claim 2, wherein the first pad and the third pad are electrically connected to a first inputoutput buffer arranged on the semiconductor chip, and
the second pad is electrically connected to a second inputoutput buffer arranged on the semiconductor chip.
4. The semiconductor chip according to claim 1, wherein the first pad is arranged on an inputoutput buffer area of the semiconductor device, and
the second pad and the third pad are arranged on an outside of the inputoutput buffer area.
5. The semiconductor device according to claim 1, wherein the first pad is arranged on an inputoutput buffer area of the semiconductor device, and
the second pad and the third pad are arranged on the inputoutput buffer area and near a terminal on the inputoutput buffer area compared to the first pad, and
the semiconductor device further includes:
a stress absorbing layer arranged below the second pad and the third pad.
6. The semiconductor device according to claim 5, wherein the first pad, the second pad and the third pad are arranged on a top layer of a multi layer interconnection structure, and
the stress absorbing layer is an interconnection layer which is not used as a part of an electrical circuit or an interlayer insulation film being thicker than an interlayer insulator existing below the first pad.
7. The semiconductor device according to claim 1, wherein an area of the third pad is smaller than an area of the first pad in area.
8. The semiconductor device according to claim 4, wherein the inputoutput buffer area includes a plurality of macro cells, and
the first pad is arbitrary one of a plurality of first pads, and each of the plurality of macro cells is connected to more than two of the plurality of first pads.
9. The semiconductor device according to claim 1, wherein the second pad is arranged to a longer direction of the second pad being directed to be parallel to a moving direction of a probe in probing the second pad; and
the third pad is arranged to a longer direction of the third pad being directed to be parallel to a moving direction of the probe in probing the third pad.
10. A semiconductor device comprising:
a first pad arranged on a semiconductor chip and electrically connected to a first inputoutput buffer arranged on the semiconductor chip;
a second pad and electrically connected to a second inputoutput buffer and arranged on an outer position of the semiconductor chip compared to the first pad; and
a third pad and electrically connected to the first inputoutput buffer and arranged on an outer position of the semiconductor chip compared to the first pad.