1. A method of manufacturing a liquid crystal display, comprising the steps of:
forming a first conductive layer on a substrate;
patterning the first conductive layer to form a gate line with a gate line, a gate electrode and a gate pad;
forming a gate insulating layer, a semiconductor layer, a doped semiconductor layer and a second conductive layer on the gate line;
forming a photoresist pattern with various thicknesses on the second conductive layer;
providing stepwise etch said second conductive layer, said doped semiconductor layer, said semiconductor layer and said gate insulating layer so as to form a data line with source electrode and a drain electrode;
forming an organic protection layer;
patterning said organic protection layer to form a plurality of through holes; and
forming a third conductive layer in said through holes electrically connected to said second conductive layer.
2. The method of manufacturing a liquid crystal display of claim 1, wherein the photoresist pattern with various thicknesses is formed by a half tone mask.
3. The method of manufacturing a liquid crystal display of claim 1, wherein the photoresist pattern with various thicknesses is formed by a mask with a slit pattern.
4. The method of manufacturing a liquid crystal display of claim 1, wherein the organic protection layer is made from benzocyclobutene (BCB), perfluorocyclobutane (PFCB), fluorinated para-xylene, acrylic resin, or color resin.
5. The method of manufacturing a liquid crystal display of claim 1, wherein the photoresist layer is unexposed in a certain thickness over the gate pad and gate electrode.
6. The method of manufacturing a liquid crystal display of claim 1, wherein all areas are etched to the substrate to stop except the areas of the gate line and data line.
7. The method of manufacturing a liquid crystal display of claim 1, further comprising a step of forming an inorganic protection layer on the semiconductor layer over the gate electrode.
8. The method of manufacturing a liquid crystal display of claim 7, wherein the inorganic protection layer is formed by treating the semiconductor layer with a mixture of plasma and nitrogen, hot oxygen or hot nitrogen.
9. The method of manufacturing a liquid crystal display of claim 1, further comprising a step of removing the gate insulating layer and semiconductor layer disposed on the gate pads so as to expose the gate pads.
10. A method of manufacturing a liquid crystal display, comprising the steps of:
forming a first conductive layer on a substrate;
patterning the first conductive layer to form a gate line with a gate line, a gate electrode and a gate pad;
forming a gate insulating layer and a semiconductor layer on the gate line;
forming an etching stop layer on the semiconductor layer and over the gate electrode; forming a doped semiconductor layer and a second conductive layer on the etching stop layer and semiconductor layer;
patterning the second conductive layer, doped semiconductor layer, semiconductor layer and gate insulating layer to form a data line with a source electrode and a drain electrode;
forming an organic protection layer;
patterning the organic protection layer so as to form a plurality of through holes;
forming a third conductive layer in the through holes electrically connected to the second conductive layer.
11. The method of manufacturing a liquid crystal display of claim 10, wherein the thickness of the etching stop layer is greater than the total thickness of the semiconductor layer and gate insulating layer.
12. The method of manufacturing a liquid crystal display of claim 10, further comprising a step of removing the gate insulating layer over the gate pad by a mask after the second conductive layer is patterned.
13. The method of manufacturing a liquid crystal display of claim 10, wherein the organic protection layer is made from benzocyclobutene (BCB), perfluorocyclobutane (PFCB), fluorinated para-xylene, acrylic resin, or color resin.
14. The method of manufacturing a liquid crystal display of claim 10, wherein all areas are etched to the substrate to stop except the areas of the gate line and data line.
15. A method of manufacturing a liquid crystal display, comprising the steps of:
forming a first conductive layer on a substrate; patterning the first conductive layer to form a gate line with a gate line, a gate electrode and a gate pad;
forming a gate insulating layer on the gate line and patterning the gate insulating layer for the gate pad to be exposed;
forming a semiconductor layer, an etching stop layer, a doped semiconductor layer and a second conductive layer on the gate insulating layer and gate line;
patterning the second conductive layer, doped semiconductor layer and semiconductor layer to form a data line, a source electrode and a drain electrode;
forming an organic protection layer;
patterning the organic protection layer to form a plurality of through holes; and
forming a third conductive layer in the through holes electrically connected to the second conductive layer.
16. The method of manufacturing a liquid crystal display of claim 15, further comprising a step of removing the gate insulating layer except that over the gate line and data line after the gate insulating layer is formed.
17. The method of manufacturing a liquid crystal display of claim 15, wherein the gate line and gate electrode is covered with the gate insulating layer after the gate insulating layer is patterned.
18. The method of manufacturing a liquid crystal display of claim 15, wherein the organic protection layer is made from benzocyclobutene (BCB), perfluorocyclobutane (PFCB), fluorinated para-xylene, acrylic resin, or color resin.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A bubble cap adapted for co-current transport of a mixture of a liquid fluid and a gaseous fluid, comprising:
(a) a riser having a top; (b) a cap having a bottom and at least one side slot, the side slot having an upper end, wherein the cap is coupled to the riser to thereby form a space between the riser and the cap; and (c) a divider coupled to at least one of the riser and the cap and disposed in the space, wherein the divider extends to a length of at least 70% of a distance measured between the top of the riser and the bottom of the cap;
wherein the divider extends across the upper end of the slot such that an upper end of the divider is located above the upper end of the slot and such that a lower end of the divider is located below the upper end of the slot;
wherein the slot is configured to have a length such that the upper end of the slot is above a liquid fluid disposed on a distribution plate;
wherein the bubble cap is coupled to the distribution plate to thereby form a passage for downward flow of a mixture of the liquid fluid and a gaseous fluid through the distribution plate; and
wherein the distribution plate is disposed within a reactor that is configured such that the liquid fluid and the gaseous fluid move in a downward motion within the reactor.
2. The bubble cap of claim 1 wherein the length of the divider is at least 80% of the distance between the top of the riser and the bottom of the cap.
3. The bubble cap of claim 1 wherein the length of the divider is at least 90% of the distance between the top of the riser and the bottom of the cap.
4. The bubble cap of claim 1 wherein the length of the divider is 100% of the distance between the top of the riser and the bottom of the cap.
5. The bubble cap of claim 1 wherein the divider is attached to the riser.
6. The bubble cap of claim 1 wherein the divider is attached to the cap.
7. The bubble cap of claim 1 wherein the divider is attached to both the riser and the cap.
8. The bubble cap of claim 1 wherein the bubble cap has at least two dividers.
9. The bubble cap of claim 1 wherein the bubble cap has at least three dividers.
10. The bubble cap of claim 1 wherein the bubble cap has at least six dividers.
11. The bubble cap of claim 1, further comprising a swirl director attached to the riser.
12. A mixing device having a plurality of bubble caps according to claim 1.
13. A mixing device having a bubble cap of claim 1 wherein the bubble cap, having at least one slot, is positioned with respect to a distribution plate and the bottom of the cap is positioned at least 1.5 inches from the distribution plate.
14. A bubble cap, comprising:
a cap with at least one slot that has an upper end, and a riser configured to provide the cap with a skirt height of no less than 1.5 inches, wherein the bubble cap is configured to be coupled to a distribution plate in a vessel such that a liquid fluid and a gaseous fluid flow co-currently upwardly in a space between the riser and the cap;
a divider disposed in a space between the cap and the riser and extending to a length at least 70% of a distance measured between the tap of the riser and the bottom of the cap;
wherein the divider extends across the upper end of the slot such that an upper end of the divider is located above the upper end of the slot and such that a lower end of the divider is located below the upper end of the slot; and
wherein the slot is configured to have a length such that the upper end of the slot is above a liquid fluid surrounding the bubble cap.
15. The bubble cap of claim 14, wherein the skirt height is no less than 2.5 inches.
16. The bubble cap of claim 14, wherein the skirt height is no less than 4 inches.
17. The bubble cap of claim 14, wherein the cap has a side that includes at least three slots.
18. The bubble cap of claim 14, wherein the slot has a length of at least 2.5 inches.
19. The bubble cap of claim 14, wherein the slot has a length of at least 3.5 inches.
20. The bubble cap of claim 14, wherein the slot has a length of at least 5 inches.