1. A planar lightwave circuit having an element secured thereon, the planar lightwave circuit comprising:
a substrate;
a trench cut in said substrate;
at least one metal pad deposited on a top surface above said substrate, said at least one metal pad exhibiting a top surface removed from said substrate top surface;
at least one of a waveguide defined in a layer deposited above said substrate and below said at least one metal pad and an optical fiber, said top surface of said at least one metal pad being parallel with a longitudinal axis of said at least one of a waveguide and an optical fiber; and
an optical element placed within said trench and in optical communication with said at least one of a waveguide and an optical fiber,
said optical element comprising at least one metal contact configured to be adjacent to said metal pad, said metal contact being connected to said metal pad by at least one of a solder ball and a conductive adhesive deposited on the metal pad top surface at a point where said top surface lies parallel with said longitudinal axis of said at least one of a waveguide and an optical fiber,
wherein said at least one of a solder ball and a conductive adhesive deposited on the metal pad top surface supplies physical support to said optical element and electrical connection between said metal pad and said metal contact.
2. A planar lightwave circuit according to claim 1, wherein said optical element comprises an active optical area on a facet of said optical element substantially perpendicular to said top surface, said optical communication being between said active optical area and said at least one of a waveguide and an optical fiber.
3. A planar lightwave circuit according to claim 1, wherein said optical element is a photodiode.
4. A planar lightwave circuit according to claim 1, wherein said optical element is one of a vertical cavity surface emitting laser and a vertical external cavity surface emitting laser.
5. A planar lightwave circuit according to claim 4, further comprising a lens, said lens being placed between said optical element and said at least one of a waveguide and an optical fiber.
6. A planar lightwave circuit according to claim 5, wherein said lens is a ball lens.
7. A planar lightwave circuit according to claim 1, further comprising a lens, said lens being placed between said optical element and said at least one of a waveguide and an optical fiber.
8. A planar lightwave circuit according to claim 7, wherein said lens is a ball lens.
9. A planar lightwave circuit according to claim 1, wherein said metal pad is connected to said metal contact by said deposited one of a solder ball and a conductive adhesive deposited on the metal pad top surface over a gap.
10. A planar lightwave circuit according to claim 1, wherein said conductive adhesive is silver epoxy.
11. A planar lightwave circuit according to claim 1, wherein said at least one metal pad comprises two metal pads, and wherein said at least one metal contact comprises two metal contacts configured on said optical element to be adjacent said two metal pads, each of said two metal pads being connected to a respective one of said two metal contacts.
12. A planar lightwave circuit according to claim 1, wherein said metal pad is separated from said metal contact by a gap.
13. A planar lightwave circuit according to claim 12, wherein said gap is filled with optical adhesive, said optical adhesive supporting said at least one of a solder ball and a conductive adhesive.
14. An optical element for use in a planar lightwave circuit having a substrate, the optical element comprising:
a first facet having an optical aperture, said first facet exhibiting an end configured and dimensioned to placed at the bottom of a trench formed in a planar lightwave circuit; and
a plurality of contacts positioned to extend above a top surface of matching pads deposited on, and parallel to, a top surface of the planar lightwave circuit, said top surface of the matching pads opposing a bottom surface of the matching pads, the bottom surface being formed on the top surface of the planar lightwave circuit, said plurality of contacts being positioned removed from said end of said first facet.
15. An optical element according to claim 14, wherein at least one of said plurality of contacts is placed on said first facet.
16. An optical element according to claim 14, wherein said contacts are dimensioned to further extend below said top surface.
17. An optical element according to claim 14, further comprising a facet opposing said first facet, wherein at least one of said plurality of contacts is placed on said facet opposing said first facet.
18. An optical element according to claim 14, wherein said optical element is one of a photodiode, a vertical cavity surface emitting laser and a vertical external cavity surface emitting laser.
19. A method of manufacturing a planar lightwave circuit, comprising:
defining a waveguide;
defining a top surface above said waveguide;
depositing at least one metal pad on said top surface, said at least one metal pad exhibiting a top surface removed from said defined top surface above said waveguide and parallel to a longitudinal axis of said defined waveguide;
providing an optical element having at least one metal contact configured to extend above said top surface of said deposited metal pad;
cutting a trench;
defining a facet of said waveguide;
inserting said provided optical element within said cut trench; and
connecting said at least one metal contact to said top surface of said at least one deposited metal pad at a point where said top surface lies parallel with said longitudinal axis of said waveguide.
20. A method of manufacturing a planar lightwave circuit according to claim 19, wherein said provided optical element comprises an active optical area, said stage of inserting being accomplished with said active optical area being substantially perpendicular to said waveguide.
21. A method of manufacturing a planar lightwave circuit according to claim 19, wherein said provided optical element is one of a photodiode, a vertical cavity surface emitting laser and a vertical external cavity surface emitting laser.
22. A method of manufacturing a planar lightwave circuit according to claim 19, wherein said connecting comprises placing a solder ball and heating said placed solder ball.
23. A method of manufacturing a planar lightwave circuit according to claim 19, wherein said connecting comprises placing conductive adhesive.
24. A method of manufacturing a planar lightwave circuit according to claim 19, wherein said connecting further comprises filling a gap between said metal contacts and said top surface of said at least one deposited metal pad with optical adhesive.
25. A method of manufacturing a planar lightwave circuit according to claim 24, wherein said connecting comprises placing conductive adhesive on top of said optical adhesive, said optical adhesive supporting said conductive adhesive.
26. A method of manufacturing a planar lightwave circuit according to claim 19, wherein said connecting provides physical support to said optical element and electrical connection between said top surface of said deposited at least one metal pad and said metal contact.
27. A method of manufacturing a planar lightwave circuit, comprising:
providing a substrate;
defining a v-groove in a first portion of said substrate;
defining a top surface deposited on a second portion of said substrate;
depositing at least one metal pad on said top surface, said at least one metal pad exhibiting a top surface parallel to, and removed from, said defined top surface on said second portion of said substrate;
providing an optical element having at least one metal contact configured to be adjacent to, and extend above, said top surface of said deposited metal pad;
cutting a trench;
placing an optical fiber in said v-groove;
inserting said provided optical element within said cut trench; and
connecting said at least one metal contact to said top surface of said at least one deposited metal pad at a point where said top surface of said at least one metal pad lies parallel with a longitudinal axis of said placed optical fiber.
28. A method of manufacturing a planar lightwave circuit according to claim 27, wherein said provided optical element comprises an active optical area, said inserting being accomplished with said active optical area being substantially perpendicular to placed optical fiber.
29. A method of manufacturing a planar lightwave circuit according to claim 27, wherein said provided optical element is one of a photodiode, a vertical cavity surface emitting laser and a vertical external cavity surface emitting laser.
30. A method of manufacturing a planar lightwave circuit according to claim 27, wherein said connecting comprises placing a solder ball and heating said placed solder ball.
31. A method of manufacturing a planar lightwave circuit according to claim 27, wherein said connecting comprises placing conductive adhesive.
32. A method of manufacturing a planar lightwave circuit according to claim 27, wherein said connecting further comprises filling a gap between said metal contacts and said top surface of said deposited at least one metal pad with optical adhesive.
33. A method of manufacturing a planar lightwave circuit according to claim 32, wherein said connecting comprises placing conductive adhesive on top of said optical adhesive, said optical adhesive supporting said conductive adhesive.
34. A method of manufacturing a planar lightwave circuit according to claim 27, wherein said connecting provides physical support to said optical element and electrical connection between said top surface of said deposited metal pad and said metal contact.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An adhesive agent comprising a base and an activator,
wherein the base comprises at least any one of:
a first epoxy compound of bisphenol F epoxy compound;
a second epoxy compound in which bisphenol F epoxy compound is mixed with an epoxy compound having three or more epoxy groups; and
a third epoxy compound in which bisphenol A epoxy compound is mixed with an epoxy compound having three or more epoxy groups,
wherein the activator comprises:
polyamide composed of a condensation reaction product of C36 unsaturated fatty acid dimer and polyamine, and
alicyclic polyamine,
the activator containing 5 to 200 parts by mass of the alicyclic polyamine with respect to 100 parts by mass of the polyamide, and
wherein the base is mixed with the activator with a ratio of 10 to 200 parts by mass of the activator with respect to 100 parts by mass of the base.
2. The adhesive agent of claim 1, wherein the activator contains 10 to 150 parts by mass of the alicyclic polyamine with respect to 100 parts by mass of the polyamide.
3. The adhesive agent of claim 1, wherein the activator contains 20 to 100 parts by mass of the alicyclic polyamine with respect to 100 parts by mass of the polyamide.
4. The adhesive agent of claim 1, further comprising fine particles having mean particle size of 0.1 \u03bcm or less.
5-9. (canceled)
10. The inkjet head of claim 5, wherein the ink contains 3 mass % or more of solvent having 9.5 to 15.0 of a SP value and 2.0 to 5.0 of a dipole moment to whole solvent weight.
11. A manufacturing method of an inkjet head, the inkjet head comprising a channel substrate with a channel of ink, an adherend member adhered to the channel substrate, and a second adherend member further adhered to the adherend member, comprising the steps of:
applying an adhesive agent comprising a base and an activator at least one of between the channel substrate and the adherend member, and between the adherend member and the second adherend member, and
curing the adhesive agent by applying heat of 60\xb0 C. or less to the adhesive agent, so that the channel substrate is adhered with the adherend member, or the adherend member is adhered with the second adherend member,
wherein the base comprises at least any one of:
a first epoxy compound of bisphenol F epoxy compound;
a second epoxy compound in which bisphenol F epoxy compound is mixed with an epoxy compound having three or more epoxy groups; and
a third epoxy compound in which bisphenol A epoxy compound is mixed with an epoxy compound having three or more epoxy groups,
wherein the activator comprises:
polyamide containing a condensation reaction product of C36 unsaturated fatty acid dimer and polyamine, and
alicyclic polyamine,
the activator containing 5 to 200 parts by mass of the alicyclic polyamine with respect to 100 parts by mass of the polyamide, and
wherein the base is mixed with the activator with a ratio of 10 to 200 parts by mass of the activator with respect to 100 parts by mass of the base.
12. The method of claim 11, wherein the base comprises the second epoxy compound.
13. The method of claim 11, wherein the activator contains 10 to 150 parts by mass of the alicyclic polyamine with respect to 100 parts by mass of the polyamide.
14. The method of claim 11, wherein the activator contains 20 to 100 parts by mass of the alicyclic polyamine with respect to 100 parts by mass of the polyamide.
15. The method of claim 11, wherein the adhesive agent further comprises fine particles having mean particle size of 0.1 \u03bcm or less.
16. The method of claim 11, wherein the adhesive agent is cured by applying heat of 40\xb0 C. or less to the adhesive agent.