1. A light emitting diode device comprising:
a substrate made of resin;
an LED mounted on the substrate;
a transparent layer made of transparent resin and sealing the LED; and
a reflector film made of resin containing white pigment and adhered to peripheral outside walls of the transparent layer, except for an upper surface of the transparent layer as a light emitting surface,
wherein the substrate, the transparent layer and the reflector film are made of epoxy resin, and the reflector film surrounding the transparent layer has a length and width corresponding to those of the substrate, and a height corresponding to that of the transparent layer, integrated with the transparent layer.
2. The light emitting diode device according to claim 1, wherein the substrate has a plurality of LED’s mounted thereon.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A light emitting device comprising:
a first nitride semiconductor layer;
an active layer on the first nitride semiconductor layer;
a second nitride semiconductor layer on the active layer; and
an electrode on the second nitride semiconductor layer;
wherein the active layer includes a quantum well structure for emitting light;
wherein the first nitride semiconductor layer includes a super lattice structure having at least two layers; and
wherein the second nitride semiconductor layer includes a p-type impurity, the p-type impurity having a doping profile comprising a plurality of peaks through the depth of the second nitride semiconductor layer,
wherein the second nitride semiconductor layer comprises a periodic structure, and wherein a period of the periodic structure comprises a p-doped first GaN layer and a p-doped second GaN layer, wherein the p-doped second GaN layer includes a material selected from the group consisting of In and Al, and
wherein each peak of the plurality of peaks occurs in a p-doped first GaN layer of the periodic structure.
2. The light emitting device according to claim 1, wherein the p-doped second GaN layer includes a p-doped AlGaN layer.
3. The light emitting device according to claim 1, wherein the p-doped second GaN layer includes a p-doped InGaN layer.
4. The light emitting device according to claim 1, wherein the electrode comprises ITO, IZO(In\u2014ZnO), GZO(Ga\u2014ZnO), AZO(Al\u2014ZnO), AGZO(Al\u2014Ga ZnO), IGZO(In\u2014Ga ZnO), IrOx, RuOx, RuOx,ITO, NiIrOx,Au, or NiIrOxAuITO.
5. The light emitting device according to claim 1, wherein the p-type impurity is Mg.
6. The light emitting device according to claim 1, wherein the super lattice structure comprises an undoped AlGaN layer and a doped GaN layer.
7. The light emitting device according to claim 1, wherein the first nitride semiconductor layer is an n-type GaN layer, and wherein the second nitride semiconductor layer is a p-type GaN layer.
8. The light emitting device according to claim 1, wherein the first nitride semiconductor layer is an n-GaN layer formed by a Si-In simultaneous doping in a doping concentration range of 1\xd71019cm3-9\xd71019cm3 at a thickness range of 1-4 \u03bcm.
9. The light emitting device according to claim 1, wherein the first nitride semiconductor layer has an overall thickness of less than 2 \u03bcm.
10. The light emitting device according to claim 1, wherein the active layer includes a multi-quantum well structure.
11. A light emitting device comprising:
a first nitride semiconductor layer:
an active layer on the first nitride semiconductor layer;
a second nitride semiconductor layer on the active layer; and
an electrode on the second nitride semiconductor layer:
wherein the active layer includes a quantum well structure for emitting light:
wherein the first nitride semiconductor layer includes a super lattice structure having at least two layers: and
wherein the second nitride semiconductor layer includes a p-type impurity, the p-type impurity having a doping profile comprising a plurality of peaks through the depth of the second nitride semiconductor layer, wherein the second nitride semiconductor layer comprises a p-type GaN layer and a p-type AlGaN layer, wherein a p-type impurity of the p-type GaN layer is more heavily doped than a p-type impurity of the p-type AlGaN layer.
12. The light emitting device according to claim 11, wherein the p-type impurity is Mg and the eak of the doing profile of the p-type GaN layer is higher than the peak of the doping profile of the p-type AlGaN layer.
13. The light emitting device according to claim 11, wherein a thickness of the p-type AlGaN layer is within a range of 10-300 \u212b.
14. A light emitting device comprising:
a first nitride semiconductor layer;
an active layer on the first nitride semiconductor layer;
a second nitride semiconductor layer on the active layer; and
an electrode on the second nitride semiconductor layer;
wherein the active layer includes a quantum well structure for emitting light:
wherein the first nitride semiconductor layer includes a super lattice structure having at least two layers; and
wherein the second nitride semiconductor layer includes a p-type impurity, the p-type impurity having a doping profile comprising a plurality of peaks through the depth of the second nitride semiconductor layer, wherein the second nitride semiconductor layer comprises a periodic structure, and wherein a period of the periodic structure comprises a p-doped GaN layer, a p-doped AlGaN cap layer, and a p-doped InGaN layer.
15. The light emitting device according to claim 14, wherein each peak of the plurality of peaks occurs in a p-doped GaN layer of the periodic structure.
16. A method of forming a light emitting device, comprising:
forming a first nitride semiconductor layer on a substrate, wherein the first nitride semiconductor layer includes a super lattice structure having at least two layers;
forming an active layer on the first nitride semiconductor layer, wherein the active layer includes a quantum well structure for emitting light;
forming a second nitride semiconductor layer on the active layer, wherein forming the second nitride semiconductor layer comprises doping the second nitride semiconductor layer with a p-type impurity using a delta doping process such that the p-type impurity has a doping profile having a plurality of peaks through the depth of the second nitride semiconductor layer;
forming an electrode on the second nitride semiconductor layer; and
performing an activation process whereby the p-type impurity diffuses through the second nitride semiconductor layer.
17. The method according to claim 16, wherein the second nitride semiconductor layer comprises a periodic structure,
wherein, before performing the activation process, a period of the periodic structure comprises a p-doped GaN layer and an undoped AlGaN layer, and
wherein, after performing the activation process, said diffusion of the p-type impurity yields the periodic structure comprising a p-doped GaN layer and a p-doped AlGaN layer.
18. The method according to claim 16, wherein the second nitride semiconductor layer comprises a periodic structure,
wherein, before performing the activation process, a period of the periodic structure comprises a p-doped GaN layer and an undoped InGaN layer, and
wherein, after performing the activation process, said diffusion of the p-type impurity yields the periodic structure comprising a p-doped GaN layer and a p-doped InGaN layer.
19. The method according to claim 16, wherein the second nitride semiconductor layer comprises a periodic structure,
wherein, before performing the activation process, a period of the periodic structure comprises an undoped GaN layer, an undoped AlGaN cap layer, and a p-doped GaN layer, and
wherein, after performing the activation process, said diffusion of the p-type impurity yields the periodic structure comprising a first p-doped GaN layer, a p-doped AlGaN cap layer, and a second p-doped GaN layer, wherein the second p-doped GaN layer is more heavily doped than the first p-doped GaN layer.
20. The method according to claim 16, wherein the second nitride semiconductor layer comprises a periodic structure,
wherein, before performing the activation process, a period of the periodic structure comprises a p-doped GaN layer, an undoped AlGaN cap layer, and an undoped InGaN layer, and
wherein, after performing the activation process, said diffusion of the p-type impurity yields the periodic structure comprising a p-doped GaN layer, a p-doped AlGaN cap layer, and a p-doped InGaN layer.
21. The method according to claim 16, wherein the p-type impurity is Mg.