1. A semiconductor device, comprising:
a first leadframe having a perimeter that defines a cavity and a plurality of leads extending inwardly from the perimeter, wherein the first leadframe has a first thickness;
a second leadframe having a die paddle surrounding a die receiving area, the second leadframe having a top surface, a bottom surface, and a second thickness;
an integrated circuit (IC) disposed within the die receiving area of the second leadframe, the IC having a plurality of bonding pads located on a peripheral portion of a first surface thereof, wherein the second leadframe and the IC are in facing relation with the first leadframe, and the leads of the first leadframe are electrically connected to respective ones of the bonding pads; and
a mold compound injected between the first and second leadframes and covering the second leadframe top surface and a central area of the first surface of the IC, and wherein at least bottom surfaces of the leads are exposed.
2. The semiconductor device of claim 1, further comprising a plurality of conductive balls interposed between the bonding pads of the IC and the leads of the first leadframe, wherein the leads are electrically connected to respective ones of the bonding pads of the IC by way of the conductive balls.
3. The semiconductor device of claim 2, wherein the plurality of leads of the first leadframe are partially etched and the conductive balls are received within the etched portions of the leads.
4. The semiconductor device of claim 3, wherein the conductive balls press on the leads of the first leadframe, wherein a spring back force of the leads acts on the conductive balls, thereby enhancing a joint strength of the leads and the balls.
5. The semiconductor device of claim 1, wherein a second surface of the IC opposing the first surface is exposed.
6. The semiconductor device of claim 1, wherein the first and second leadframes are formed of copper.
7. The semiconductor device of claim 6, wherein the first leadframe is pre-plated with tin.
8. The semiconductor device of claim 1, wherein the second leadframe thickness is greater than the first leadframe thickness.
9. The semiconductor device of claim 1, wherein the first and second leadframes are electrically isolated from each other
10. The semiconductor device of claim 9, wherein the first leadframe further comprises a ground plane located within the cavity, wherein one or more of the IC bonding pads is electrically connected to the ground plane.
11-32. (canceled)
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
I claim:
1. The magnet motor of an electric vehicle, comprising a whole rotator, an electric magnet pole module, and a circuit control unit, wherein the e whole rotator and electromagnet pole module are located at the motorcycle wheel case, in the wheel case, a wheel drum center is divided into two half portions, and the inner face of the wheel drum, a good resistant material of a friction face is provided, and the clutch is mounted with a whole rotator, and near one side of the wheel drum, which is placed into the wheel drum, and at wheel axle center will follow the sequences pass through a support, an electromagnet pole module of a shell housing, the whole rotator, the centrifugal clutch, the wheel drum, the triggering apparatus, and both ends of the support are fastened with screw nuts, and the bolt seat is protruded out from a support, in which a bolt can pass through and screw on the shell housing, and all loops of the site sensor and the electromagnet pole module are connected back to the circuit controller.
2. The magnet motor of an electric vehicle of claim 3, wherein the triggering apparatus can either be a plate type or a drum type.
3. The magnet motor of an electric vehicle of claim 3, wherein, a clutch, both axles center of a wheel case and a whole rotator are placed in a biased method, and an inner ring of a wheel drum of the wheel case, a parallel gear is provided, and at the end structure of the axle center of the whole rotator, a transmission clutch gear is disposed, which is exactly coupled with an internal side of the parallel gear and a transmission gear, a plurality of dent holes is provided, the dent hole shape is formed into a small arc and a large arc, and a cutting thread is mounted over and the dent holes are placed in with a spring and a round lock.
4. A magnet motor of an electric vehicle, comprising a whole rotator, an electric magnet pole module, and a circuit control unit, wherein the whole rotator and the electromagnet pole module are separately located at its internal and external layers of the internal shell. It comprises an inner shell, a rotating axle, both ends of the rotating axle, a stop push axle bearing is provided, and on the internal shell, a peak pin is disposed; in which both ends are separately set in the position of the rotating axle and it can be a free rotation, and at the center of the rotating axle, a perpetual magnet ring is provided, and having the inter-repelling function with the same pole magnet of an internal shell extended housing, and on the rotating axle, at least one set of the whole rotator is provided. On the other both faces of the whole rotator, a perpetual magnet is disposed individually, at least one set of the electromagnet pole module is constructed at the internal shell extended housing and become a relative site to the perpetual magnet. The magnet pole coil adjacent, it conductive magnet coil seat can form into a body, and all loop of the site sensor and the electromagnet pole module are connected back to the circuit controller, and an active gear has constructed at the rotating axle end, which is engaged with a passive gear of a transmitting axle, and an external shell, an internal shell is placed in the external shell and maintained a clear clearance, and the coolant will flow into one end, and flow out from the other end.
5. The magnet motor of an electric vehicle of claim 5, wherein; the outer part of the external shell has been covered with an insulation material, as to maintain the temperature and prevent to loss it easily.