1460713547-2b75b041-cf11-448b-a0ce-f56b223aeb88

1. A method, comprising:
exposing polysilicon to an aqueous composition comprising nitric acid, poly-carboxylic acid and ammonium fluoride;
wherein the aqueous composition comprises a water content of less than 39 wt %.
2. The method of claim 1, further comprising exposing the polysilicon to the aqueous composition, wherein the aqueous composition comprises a water content of less than or equal to 35 wt %.
3. The method of claim 1, further comprising exposing the polysilicon to the aqueous composition, wherein the aqueous composition comprises 65-70 wt % nitric acid and 0.06-0.6 wt % ammonium fluoride.
4. The method of claim 3, further comprising exposing the polysilicon to the aqueous composition, wherein the aqueous composition further comprises hydrofluoric acid.
5. The method of claim 3 or 4, further comprising exposing the polysilicon to the aqueous composition, wherein the aqueous composition further comprises poly-carboxylic acid at 0.4 wt % or less.
6. The method of claim 5, further comprising exposing the polysilicon to the aqueous composition comprising poly-carboxylic acid at 0.4 wt % or less, wherein the poly-carboxylic acid is oxalic acid.
7. The method of claim 1, further comprising exposing the polysilicon to the aqueous composition, wherein the aqueous composition comprises 65-70 wt % nitric acid, 0.06-0.6 wt % ammonium fluoride, 0.00-0.08 wt % hydrofluoric acid, and oxalic acid at 0.4 wt % or less.
8. The method of claim 1, wherein exposing polysilicon to an aqueous composition comprising nitric acid, poly-carboxylic acid and ammonium fluoride comprises exposing the polysilicon to the aqueous composition in the presence of an oxide.
9. The method of claim 7, wherein exposing the polysilicon to the aqueous composition in the presence of an oxide comprises exposing the polysilicon to the aqueous composition in the presence of a silicon oxide or a silicon oxynitride.
10. The method of claim 1, wherein exposing polysilicon to an aqueous composition comprising nitric acid, poly-carboxylic acid and ammonium fluoride comprises exposing a boron-doped polysilicon to the aqueous composition.
11. The method of claim 10, further comprising exposing the boron-doped polysilicon to the aqueous composition in the presence of a silicon oxide or a silicon oxynitride.
12. A method of forming NAND string of memory cells, comprising:
forming alternating instances of polysilicon and oxide;
forming an opening through the alternating instances of polysilicon and oxide;
removing portions of the instances of polysilicon selective to the instances of oxide; and
for at least one of the instances of polysilicon, following removal of the portions of the instances of polysilicon, forming a data-storage structure between the at least one instance of polysilicon and a semiconductor;
wherein removing portions of the instances of polysilicon selective to the instances of oxide comprises:
exposing the instances of polysilicon to an aqueous composition comprising nitric acid, poly-carboxylic acid and ammonium fluoride;
wherein the aqueous composition comprises a water content of less than 39 wt %.
13. The method of claim 12, wherein exposing the instances of polysilicon to an aqueous composition comprising nitric acid, poly-carboxylic acid and ammonium fluoride comprises exposing the instances of polysilicon to the aqueous composition, wherein the aqueous composition comprises 65-70 wt % nitric acid, 0.06-0.6 wt % ammonium fluoride, and oxalic acid at 0.4 wt % or less.
14. The method of claim 12, wherein exposing the instances of polysilicon to an aqueous composition comprising nitric acid, poly-carboxylic acid and ammonium fluoride comprises exposing the polysilicon to the aqueous composition, wherein the aqueous composition consists essentially of nitric acid, poly-carboxylic acid, ammonium fluoride, and water.
15. The method of claim 12, further comprising:
forming a first dielectric between the data-storage structure and the semiconductor; and
forming a second dielectric between the data-storage structure and the at least one instance of polysilicon.
16. The method of claim 15, wherein forming the second dielectric comprises forming a thermal oxide on the at least one instance of polysilicon and forming another dielectric on the thermal oxide.
17. The method of claim 12, wherein forming a data-storage structure between the at least one instance of polysilicon and a semiconductor comprises forming a second polysilicon and exposing the second polysilicon to an aqueous composition comprising nitric acid, poly-carboxylic acid and ammonium fluoride.
18. The method of claim 4, further comprising exposing the polysilicon to the aqueous composition, wherein the aqueous composition further comprises hydrofluoric acid at 0.08 wt % or less.
19. The method of claim 4, further comprising exposing the polysilicon to the aqueous composition, wherein the aqueous composition further comprises poly-carboxylic acid at 0.4 wt % or less.
20. The method of claim 13, wherein exposing the instances of polysilicon to an aqueous composition comprising nitric acid, poly-carboxylic acid and ammonium fluoride comprises exposing the instances of polysilicon to the aqueous composition, wherein the aqueous composition further comprises hydrofluoric acid at 0.08 wt % or less.
21. A method, comprising:
exposing polysilicon to an aqueous composition comprising nitric acid, poly-carboxylic acid and ammonium fluoride;
wherein the aqueous composition comprises 65-70 wt % nitric acid;
wherein the aqueous composition comprises 0.06-0.6 wt % ammonium fluoride; and
wherein the aqueous composition comprises poly-carboxylic acid at 0.4 wt % or less.
22. The method of claim 21, further comprising exposing the polysilicon to the aqueous composition, wherein the aqueous composition further comprises hydrofluoric acid.
23. The method of claim 22, further comprising exposing the polysilicon to the aqueous composition, wherein the aqueous composition further comprises hydrofluoric acid at 0.08 wt % or less.
24. The method of claim 23, further comprising exposing the polysilicon to the aqueous composition, wherein the aqueous composition consists essentially of nitric acid, ammonium fluoride, poly-carboxylic acid, hydrofluoric acid and water.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An apparatus for lifting a panel in a cargo area, comprising, a frame member adapted to be rigidly attached relative to an interior surface of the cargo area;
a guide member rigidly attached to said frame member and adapted to receive a tensile lifting member selected from the group consisting of a strap, chain, cord, or rope, said tensile lifting member having a first end adapted to be secured to a panel member to be raised into an elevated position and a second end adapted to be manually manipulated by an operator; and
a lock mechanism having a mobile locking member which translates between a locked position in which the mobile locking member cooperates with an opposing locking member to inhibit movement of the tensile lifting member and an unlocked position in which the tensile lifting member is permitted to pass between said mobile locking member and said opposing locking member substantially uninhibited by said locking members, the mobile locking member being movable from the locked position to the unlocked position by manual manipulation of the second end of the tensile lifting member away from the first end.
2. The apparatus of claim 1, wherein the guide member includes a pin, sleeve, or roller mounted to the frame member and having a substantially smooth circumferential surface.
3. The apparatus of claim 1, wherein the mobile locking member comprises a movable locking pin mounted to the frame member such that the locking pin is substantially parallel to the guide member.
4. The apparatus of claim 2, wherein the opposing locking member comprises a stationary locking pin having a generally coarse surface.
5. The apparatus of claim 4, wherein the tensile lifting member is a strap.
6. The device of claim 5, wherein the mobile locking member is operable to transition to the unlocked position when the second end of the strap is pulled.
7. The apparatus of claim 1, wherein the mobile locking member is adapted to shift to the locked position when a force is applied to the first end of the tensile lifting member.
8. The apparatus of claim 7, wherein the mobile locking member is adapted to shift to the unlocked position when a force is applied to the second end of the tensile lifting member.
9. The apparatus of claim 1, wherein the panel member is operable to be raised and lowered via the tensile lifting member when the tensile lifting member is secured to the panel member and when the mobile locking member is in an unlocked condition.
10. The apparatus of claim 1, wherein the lock mechanism is operable to automatically lock when a force is applied to the first end of the tensile lifting member and substantially no force is applied to the second end of the tensile lifting member.
11. An apparatus for adjusting a panel to an operational position or to a stowed position in a cargo area, the apparatus comprising:
a frame member mountable in the cargo area;
a guide member to receive a flexible member having a first end connectable to the panel, the guide member being attached to the frame member; and
a lock mechanism having a movable locking member which translates between a locked position and an unlocked position, the movable locking member being adjustable to the locked position from the unlocked position by manual manipulation of a second end of the flexible member toward the first end.
12. The apparatus of claim 11, wherein the flexible member comprises a strap, chain, cord, or rope.
13. The apparatus of claim 11, wherein when the flexible member is received by the guide member and when the movable locking member is in the locked position, the movable locking member cooperates with an opposing locking member to inhibit movement of the flexible member relative to the lock mechanism.
14. The apparatus of claim 13, wherein when the flexible lifting member is received by the guide member and when the movable locking member is in the unlocked position, the flexible lifting member is permitted to move relative to the lock mechanism.
15. The apparatus of claim 11, wherein the guide member includes a pin, sleeve, or roller mounted to the frame member and having a substantially smooth circumferential surface.
16. The apparatus of claim 11, wherein the movable locking member comprises an adjustable pin engaged with the frame member such that the adjustable pin is substantially parallel to the guide member.
17. The apparatus of claim 16, wherein the lock mechanism further comprises an opposing locking member that cooperates with the movable locking member, the opposing locking member including a stationary locking pin having a generally coarse surface.
18. The apparatus of claim 11, wherein the movable locking member adjusts to the locked position when the flexible member is received by the guide member and a force is applied to the first end of the flexible member.
19. The apparatus of claim 18, wherein the movable locking member adjusts to the unlocked position when a force is applied to the second end of the flexible member.
20. The apparatus of claim 11, wherein the lock mechanism automatically locks when the flexible member is received by the guide member and a force is applied to the first end of the flexible member while substantially no force is applied to the second end of the flexible member.
21. An apparatus for adjusting a panel to an operational position or to a stowed position in a cargo area, the apparatus comprising:
a frame member mountable in the cargo area;
a guide member to receive a flexible member having a first end connectable to the panel, the guide member being attached to the frame member; and
a lock mechanism having a movable locking member which translates between a locked position and an unlocked position, the movable locking member being adjustable between the locked and unlocked positions by manual manipulation of a second end of the flexible member,
wherein the movable locking member comprises an adjustable pin engaged with the frame member such that the adjustable pin is substantially parallel to the guide member, and
wherein the lock mechanism further comprises an opposing locking member that cooperates with the movable locking member, the opposing locking member including a stationary locking pin having a generally coarse surface.
22. The apparatus of claim 21, wherein when the flexible member is received by the guide member and when the movable locking member is in the locked position, the movable locking member cooperates with the opposing locking member to inhibit movement of the flexible member relative to the lock mechanism.
23. The apparatus of claim 22, wherein when the flexible lifting member is received by the guide member and when the movable locking member is in the unlocked position, the flexible lifting member is permitted to move relative to the lock mechanism.
24. The apparatus of claim 21, wherein the movable locking member adjusts to the locked position when the flexible member is received by the guide member and a force is applied to the first end of the flexible member.
25. The apparatus of claim 24, wherein the movable locking member adjusts to the unlocked position when a force is applied to the second end of the flexible member.
26. The apparatus of claim 21, wherein the guide member, the movable locking member, and the opposing locking member are all engaged with at least one wall of the frame member.
27. The apparatus of claim 21, wherein the movable locking member moves within a pathway slot formed in the frame member, the pathway slot having a greater width than the movable locking member.