1) A system for monitoring and controlling access or attendance or a combination of access or attendance of individuals comprising of:
i) an identification means for each individual which are characteristic to said individual;
ii) a mobile data collection unit (hereinafter DCU) comprising a controller, one or more readers capable of reading said identification means and transferring it to the controller, a power source, and a data managing software (hereinafter Data Manager) residing on said controller which receives, stores, updates, processes and outputs data regarding each individual;
iii) a management computer;
iv) access control SW Application residing on said management computer
v) a first relay system (hereinafter Mobile Relay) may be employed to transmit data regarding an individual from the DCU to the management computer
vi) a second relay system (hereinafter Relay) may be employed to transmit data regarding an individual from said access control application to a remote client;
vii) Individuals data manager used for individuals enrolment to the system, creation of the access control database and database for the manufacturing of the IDUs
2) A system according to claim 1, in which the identification means is selected from the group that consists of biometric features, fingerprints, hand dimensions, eye characteristics, voice characteristics, face characteristics, body-external means, magnetic cards, optically readable cards, bar codes, magnetic stripe, cards with electronic data transfer capability, cards equipped with memory chips or microcomputer known as smartcards electronic chips, or combinations thereof.
3) A system according to claim 1, in which the reader in the mobile data collection unit is a reader selected from the group that consists of biometric readers, fingerprint readers, hand dimension reader, eye reader, voice reader, face reader, bar code scanner, Contactless smartcard reader, RFID readers magnetic stripe readers or combinations thereof.
4) A system according to claim 1, in which the DCU is a mobile unit comprising of an independent power source.
5) A system according to claim 1, in which the mobile relay connection between the DCU and the management computer is selected from a group that consists of remote means of communication, mobile means of communication, telephone modem, satellite, cable, radio, cellular, wireless LAN, and direct cable connection,
6) A system according to claim 1, in which the controller employed for the purposes of the present invention is selected from a group that consists of a computer capable of supporting the Data Manager and the communication between it and the reader and the management computer.
7) A system according to claim 1 in which the management computer is a single board computer.
8) A system according to claim 1, in which said system is a student-attendance-monitoring system in a school.
9) A system according to claim 1, in which said system is designed for controlling the boarding of passengers on an airplane.
10) A system according to claim 1, in which said system is designed for a conference or exhibition wherein the knowledge and control of the presence of the participants or the visitors is needed.
11) A system according to claim 1, in which said system is applied in a school bus, thus controlling the entry, presence and departure of students to, in and from said school bus.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A method of manufacturing a semiconductor device comprising the steps of:
(a) preparing a semiconductor chip having a plurality of semiconductor elements and a row of external terminals on a main surface thereof;
(b) preparing a wiring substrate having a wiring substrate base, a first array of bump lands, a second array of bump lands, the wiring substrate base being provided with an opening positioned between the first and second array of bump lands, and a plurality of leads respectively forming bridge connections between the first array of bump lands and the second array of bump lands over the opening;
(c) positioning the wiring substrate over the main surface of the semiconductor chip such that the opening is positioned over the row of external terminals;
(d) cutting the plurality of leads at respective portions thereof over the opening and bonding each of the plurality of leads on corresponding one of the external terminals through the opening, respectively.
2. A method of manufacturing a semiconductor device according to claim 1, further comprising the steps of:
(e) sealing the row of external terminals and the plurality of leads bonded with the external terminals by potting method through the opening.
3. A method of manufacturing a semiconductor device according to claim 1,
wherein each of the plurality of leads has a notch located at the bridging portion thereof over the opening, and
wherein, in step (d), each of the plurality of leads is cut at the notch thereof.
4. A method of manufacturing a semiconductor device according to claim 1, wherein the minimum interval of the external terminals is smaller than the minimum interval of the bump lands.
5. A method of manufacturing a semiconductor device according to claim 1, wherein, in step (c), the wiring substrate is positioned over the main surface of the semiconductor chip through an elastic layer.
6. A method of manufacturing a semiconductor device according to claim 1, further comprising a step of:
(e) providing bump electrodes on each of the bump lands of the first and second array of bump lands, respectively.
7. A method of manufacturing a semiconductor device according to claim 5,
wherein each of the plurality of leads has a notch located at the bridging portion thereof over the opening, and
wherein, in step (d), each of the plurality of leads is cut at the notch thereof.
8. A method of manufacturing a semiconductor device according to claim 7, further comprising the steps of:
(e) sealing the row of external terminals and the plurality of leads bonded with the external terminals by potting method through the opening.
9. A method of manufacturing a semiconductor device according to claim 8, further comprising a step of:
(f) providing bump electrodes on each of the bump lands of the first and second array of bump lands, respectively.
10. A method of manufacturing a semiconductor device according to claim 5, wherein the minimum interval of the external terminals is smaller than the minimum interval of the bump lands.
11. A method of manufacturing a semiconductor device comprising the steps of:
(a) preparing a semiconductor chip having a plurality of semiconductor elements and an external terminal on the main surface,
(b) preparing a wiring substrate comprising a wiring substrate base, a bump land, an anchor wiring, the wiring substrate base being provided with an opening between the bump land and the anchor wiring, and a lead forming a bridge connection between the bump land and the anchor wiring over the opening,
wherein the anchor wiring is wider than the lead;
(c) positioning the wiring substrate over the main surface of the semiconductor chip such that the opening is positioned over the external terminal; and
(d) cutting the lead at a portion thereof over the opening and bonding the lead on the external terminal through the opening.
12. A method of manufacturing a semiconductor device according to claim 11, wherein, in step (c), the wiring substrate is positioned over the main surface of the semiconductor chip through an elastic layer.
13. A method of manufacturing a semiconductor device comprising the steps of:
(a) preparing a semiconductor chip having a plurality of semiconductor elements and a row of external terminals on a main surface thereof;
(b) preparing a wiring substrate comprising a wiring substrate base, a plurality of bump lands, a plurality of anchor wirings, the wiring substrate base having an opening positioned between the plurality of bump lands and the plurality of anchor wirings, and a plurality of leads respectively forming bridge connections between the plurality of bump lands and the plurality of anchor wirings, over the opening,
wherein the plurality of anchor wirings are wider than the plurality of leads;
(c) positioning the wiring substrate over the main surface of the semiconductor chip such that the opening is positioned over the row of external terminals; and
(d) cutting the plurality of leads at respective portions thereof over the opening and bonding each of the plurality of leads on corresponding ones of the external terminals through the opening, respectively.
14. A method of manufacturing a semiconductor device according to claim 13,
wherein, in step (c), the wiring substrate is positioned over the main surface of the semiconductor chip through an elastic layer.
15. A method of manufacturing a semiconductor device according to claim 14,
wherein each of the plurality of leads has a notch located at the bridging portion thereof over the opening, and
wherein, in step (d), each of the plurality of leads is cut at the notch thereof.
16. A method of manufacturing a semiconductor device according to claim 15, further comprising a step of:
(e) providing bump electrodes on each of the bump lands of the first and second array of bump lands, respectively.
17. A method of manufacturing a semiconductor device according to claim 16, further comprising a step of:
(e) sealing the row of external terminals and the plurality of leads bonded with the external terminals by potting method through the opening.
18. A method of manufacturing a semiconductor device according to claim 15, further comprising a step of:
(e) sealing the row of external terminals and the plurality of leads bonded with the external terminals by potting method through the opening.
19. A method of manufacturing a semiconductor device according to claim 18, further comprising a step of:
(f) providing bump electrodes on each of the bump lands of the first and second array of bump lands, respectively.