1. A three-dimensional CAD apparatus comprising:
a judgment unit arranged to judge whether to select an output processing for a 3D model from among a plurality of processings; and
a storage unit arranged to store a mode having a plurality of setting items for making the image processing of data for said 3D model in correspondence to the output processing of said 3D model;
wherein said judgment unit switches said mode in accordance with a selection of the output processing for said 3D model.
2. The apparatus according to claim 1, wherein said plurality of setting items include at least one of hue, brightness and saturation on the face for said 3D model, color of edge line for said 3D model, background color, and presence or absence of gradation.
3. The apparatus according to claim 1, wherein when said judgment unit judges that the selected output processing is performed by a projection device, said judgment unit switches the mode to that of increasing the saturation on the face of said 3D model.
4. The apparatus according to claim 1, wherein when said judgment unit judges that the selected output processing is performed by a printer, said judgment unit switches the mode to that of making a gradation processing on the face of said 3D model.
5. An output processing method for a three-dimensional CAD, comprising the steps of:
when an output processing of a 3D model from among a plurality of processings is selected, switching a mode having a plurality of setting items for making the image processing of data for said 3D model from a table storing the mode in correspondence to the output processing of said 3D model in accordance with a selection of the output processing for said 3D model.
6. The method according to claim 5, wherein said plurality of setting items include at least one of hue, brightness and saturation on the face for said 3D model, color of edge line for said 3D model, background color, and presence or absence of gradation.
7. The method according to claim 5, wherein when the output processing by a projection device is selected, the mode is switched to that of increasing the saturation on the face of said 3D model.
8. The method according to claim 7, wherein when the output processing by a printer is selected, the mode is switched to that of making a gradation processing on the face for said 3D model.
9. A program for executing the output method of the apparatus according to claim 7.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A solder paste transfer process, comprising:
defining an arrangement of solder pad locations on a portion of a non-planar surface;
attaching electrical components to the non-planar surface, the electrical components protruding above a plane of the portion of the non-planar surface;
applying solder paste onto a transfer tool in a pre-defined configuration reflective of the arrangement;
disposing the transfer tool aside the electrical components in an inverted orientation proximate to the portion of the non-planar surface such that a displacement between the transfer tool and the portion of the non-planar surface is greater than a depth of the solder paste below the transfer tool; and
with the transfer tool disposed with the displacement, reflowing the solder paste to flow from the transfer tool to the solder pad locations.
2. (canceled)
3. (canceled)
4. The process according to claim 1, further comprising providing the transfer tool as a glass surface.
5. The process according to claim 1, further comprising machining the transfer tool from an aluminum body.
6. The process according to claim 1, wherein the applying comprises screening the solder paste through a stencil, the process further comprising choosing the stencil from a plurality of different stencils.
7. The process according to claim 6, further comprising mating the stencil with the transfer tool during at least the screening.
8. The process according to claim 7, further comprising removing the stencil from the transfer tool prior to the disposing.
9. The process according to claim 1, wherein the disposing comprises:
calculating the displacement between the transfer tool and the portion of the non-planar surface; and
disposing the transfer tool with the calculated displacement from the portion of the non-planar surface.
10. The process according to claim 1, further comprising cooling the solder paste to form solder joints at the solder pad locations.
11. A solder paste transfer process, comprising:
defining an arrangement of solder pad locations on a portion of a non-planar surface;
attaching electrical components to the non-planar surface, the electrical components protruding above a plane of the portion of the non-planar surface;
screening solder paste through a stencil onto a surface of a transfer tool formed of a material that is non-wettable with respect to the solder paste;
disposing the transfer tool aside the electrical components in an inverted orientation proximate to the portion of the non-planar surface such that the surface of the transfer tool faces the portion of the non-planar surface with a displacement between the surface of the transfer tool and the portion of the non-planar surface that is greater than a depth of the solder paste below the surface of the transfer tool; and
with the transfer tool disposed with the displacement, reflowing the solder paste to flow from the transfer tool to the solder pad locations of the portion of the non-planar surface.
12. The solder paste transfer process according to claim 11, further comprising at least one or more of providing the surface of the transfer tool as a glass surface and machining the transfer tool from an aluminum body.
13. A method of assembling a printed circuit board (PCB), comprising:
attaching electrical components to the PCB such that the electrical components protrude above a plane of the PCB to form the PCB as a non-planar surface;
defining, at a portion of the non-planar surface, an arrangement of solder pad locations where solder joints are to be formed;
applying solder paste onto a transfer tool formed of a material that is non-wettable with respect to the solder paste in a pre-defined configuration reflective of the arrangement of the solder pad locations;
disposing the transfer tool aside the electrical components in an inverted orientation proximate to the portion of the non-planar surface such that a displacement between the transfer tool and the portion of the non-planar surface is greater than a depth of the solder paste below the transfer tool; and
with the transfer tool disposed with the displacement, reflowing the solder paste to flow from the transfer tool to the solder pad locations of the portion of the non-planar surface.
14. The method according to claim 13, further comprising at least one of providing the transfer tool as a glass surface and machining the transfer tool from an aluminum body.
15. The method according to claim 13, wherein the applying comprises screening the solder paste through a stencil and the method further comprises choosing the stencil from a plurality of different stencils.
16. The method according to claim 15, further comprising choosing the stencil from a plurality of stencils each having differing solder paste aperture properties.
17. The method according to claim 15, further comprising mating the stencil with the transfer tool during at least the screening.
18. The method according to claim 17, further comprising removing the stencil from the transfer tool prior to the disposing.
19. The method according to claim 13, wherein the disposing comprises:
calculating the displacement between the transfer tool and the portion of the non-planar surface; and
disposing the transfer tool with the calculated displacement from the portion of the non-planar surface.
20. The method according to claim 13, further comprising cooling the solder paste.
21-24. (canceled)