1. A method for decoding a video signal having at least one frame with a plurality of blocks including a current block, comprising:
generating, for at least a selected pixel in the current block, a predicted value for at least one pixel located in a row i and a column j of the current block using a processor and according to the following equation:
Xij=Li+Aj\u2212C;
wherein Xij is the predicted value, Li is the value of a pixel to the left of the current block, Aj is the value of a pixel in a row above the current block and C is the value of a pixel in the row above and the column to the left of the current block; and
decoding the current block using the predicted value.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor device characterized in comprising:
a flexible circuit substrate having a base region and one or more mounting region continuously provided to a peripheral edge of the base region, wherein each of the mounting regions is folded over the base region;
electronic components mounted in correspondence with the mounting regions;
a stacked layer support body including a thick first region and a foldable thin second region that is formed with the first region in one piece, each of the regions having a specified outer frame provided in a manner to protect each of the electronic components; and
a bonding member for affixing the stacked layer support body with the flexible circuit substrate in one piece in such a manner that the electronic components mounted on the flexible circuit substrate are stacked in layers.
2. A semiconductor device according to claim 1 characterized in that the flexible circuit substrate further includes an external terminal region that is continuously provided along a periphery of the base region.
3. A semiconductor device according to claim 1 characterized in that the flexible circuit substrate further includes an external terminal region that is provided on a surface of the base region on its lower side.
4. A semiconductor device according to any one of claim 1 through claim 3 characterized in that the stacked layer support body has a structure that surrounds a periphery of the electronic component with respect to the first region.
5. A semiconductor device according to any one of claim 1 through claim 3 characterized in that the stacked layer support body has a structure that partially follows along the periphery of the electronic component with respect to the first region.
6. A semiconductor device according to any one of claim 1 through claim 5 characterized in that the stacked layer support body is provided with a bend relieving section with respect to the second region.
7. A semiconductor device according to any one of claim 1 through claim 6 characterized in further comprising a structure in which an electronic component is mounted in the base region.