We claim:
1. An improved electronics component assembly in a tire comprising:
a tire;
an electronics package for communicating information from said tire to a remote location, said electronics package incorporated in said tire;
at least a first antenna wire incorporated in said tire, and connected to said electronics package;
wherein said at least first antenna wire is connected to said electronics package such that tension in said at least first antenna wire imparts compression on said electronics package.
2. The improved electronics component assembly of claim 1, wherein:
said at least first antenna wire passes across a first side of said electronics package and is connected to a first end of said electronics package.
3. The improved electronics component assembly of claim 1, further comprising:
a second antenna wire incorporated in said tire, and connected to said electronics package;
wherein said first and second antenna wires are connected to said electronics package such that tension in said first and second antenna wires imparts compression and torsion on said electronics package.
4. The improved electronics component assembly of claim 3, wherein:
said first antenna wire is offset from said electronics package and is located proximate to said electronics package on one side of said electronics package, said first antenna wire is connected to a first end of said electronics package; and
said second antenna wire is offset from said electronics package and is located proximate to said electronics package on a side of said electronics package opposite from said first antenna, said second antenna wire is connected to a second end of said electronics package.
5. The improved electronics component assembly of claim 4, wherein said electronics package has a rectangular face and said first and second antenna wires are connected at opposite corners of said rectangular face of said electronic package.
6. The improved electronics component assembly of claim 1, wherein said electronics package and said at least first antenna wire is located on an inner surface of said tire.
7. The improved electronics component assembly of claim 1, wherein said electronics package and said at least first antenna wire are embedded in said tire.
8. The improved electronics component assembly of claim 1, wherein said electronics package and said at least first antenna wire is located in the sidewall of said tire.
9. The improved electronics component assembly of claim 1, wherein said at least first antenna wire has undulations configured for allowing said at least first antenna wire to flex.
10. The improved electronics component assembly of claim 1, wherein said electronics package is an integrated circuit made up of a silicon chip and a radio frequency device.
11. The improved electronics component assembly of claim 1, wherein said electronics component assembly measures the pressure inside said tire and communicates this pressure to the remote location.
12. The improved electronics component assembly of claim 11, wherein said electronics component assembly measures the temperature inside said tire and communicates this temperature to the remote location.
13. The improved electronics component assembly of claim 1, wherein said electronics component assembly communicates identification information to the remote location.
14. An improved electronics component assembly in a tire comprising:
a tire;
an electronics package for communicating a condition of said tire to a remote location, said electronics package incorporated in said tire;
a first antenna wire incorporated in said tire and connected to said electronics package, said first antenna wire used for communication between said electronics package and the remote location;
a second antenna wire incorporated in said tire and connected to said electronics package, said second antenna wire used for communication between said electronics package and the remote location; and
wherein said first and second antenna wires are connected to said electronics package such that tension in said first and second antenna wires imparts compression on said electronics package.
15. The improved electronics component assembly of claim 14, wherein:
said first antenna wire passes across a first side of said electronics package and is connected to a first end of said electronics package; and
said second antenna wire passes across a second side of said electronics package, said first and second sides of said electronics package being opposite from one another, said second antenna wire being connected to a second end of said electronics package.
16. The improved electronics component assembly of claim 14, wherein said electronics package and said first and second antenna wires are located on an inner surface of said tire.
17. The improved electronics component assembly of claim 14, wherein said electronics package and said first and second antenna wires are embedded in said tire.
18. The improved electronics component assembly of claim 14, wherein said electronics package and said first and second antenna wires are located in the sidewall of the tire.
19. The improved electronics component assembly of claim 14, wherein said first and second antenna wires have undulations configured for allowing said first and second antenna wires to flux.
20. The improved electronics component assembly of claim 14, wherein said first and second antenna wires are connected to diagonally opposite corners of said electronics package.
21. The improved electronics component assembly of claim 20, wherein said electronics package is rotated in orientation with respect to said first and second antenna wires such that said diagonally opposite corners of said electronics package are generally aligned with said first and second antenna wires.
22. The improved electronics component assembly of claim 14, wherein said first antenna wire is connected to a second end of said electronics package and said second antenna wire is connected to a first end of said electronics package, the connection points of said first and second antenna wires being at different horizontal and vertical locations with respect to a first side of said electronics package.
23. The improved electronics component assembly of claim 14, wherein said first and second antenna wires are connected to said electronics package such that tension is said first and second antenna wires imparts torsion on said electronics package.
24. The improved electronics component assembly of claim 23, wherein:
said first antenna wire is offset from said electronics package and is connected to a second end of said electronics package at an angle of approximately 135 from a flat edge of said second end; and
said second antenna wire is offset from said electronics package and is connected to a first end of said electronics package at an angle of approximately 135 from a flat edge of said first end.
25. The improved electronics component assembly of claim 14, wherein said first and second antenna wires are connected to said electronics package such that tension in said first and second antenna wires imparts shear on said electronics package.
26. The improved electronics component assembly of claim 14, wherein said electronics package is an integrated circuit made up of a silicon chip and radio frequency device.
27. The improved electronics component assembly of claim 14, wherein said electronics component assembly measures the pressure inside said tire and communicates this pressure to the remote location.
28. The improved electronics component assembly of claim 27, wherein said electronics component assembly measures the temperature inside said tire and communicates this temperature to the remote location.
29. The improved electronics component assembly of claim 14, wherein said electronics component assembly communicates identification information to the remote location.
30. An improved electronics component assembly for use in a tire of a vehicle, comprising:
an electronics package for communicating the pressure of a tire to a remote location, said electronics package located inside of the tire and connected to tire on the side of the tire bead of the tire;
a first antenna wire located inside of the tire and connected to the tire on the sidewall of the tire proximate to the bead of the tire and connected to said electronics package, said first antenna wire is connected to a second end of said electronics package opposite a direction in which said first antenna extends relative to the electronics package;
a second antenna wire located inside of the tire and connected to the tire on the sidewall of the tire proximate to the bead of the tire and connected to said electronics package, said second antenna wire is connected to a first end of said electronics package, opposite a direction in which said second antenna extends relative to the electronics package.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method comprising:
forming a 3D investment mold using a layer-by-layer construction for receipt of a molten alloy having a composition configured to form a bulk metallic glass (BMG) on cooling,
wherein the mold is configured to be filled with a molten amorphous alloy to form a housing of an electronic device.
2. The method of claim 1, wherein the 3D investment mold comprises a hollow interior between inner and outer walls, and wherein the hollow interior is configured to receive the molten amorphous alloy for molding the molten amorphous alloy between the inner and outer walls.
3. The method of claim 1, wherein the layer-by-layer construction comprises a selective laser sintering (SLS) technique.
4. The method of claim 1, wherein the layer-by-layer construction comprises a direct metal laser sintering (DMLS) technique.
5. The method of claim 1, wherein the layer-by-layer construction comprises a selective laser melting (SLM) technique.
6. The method of claim 1, wherein the layer-by-layer construction comprises an electron beam melting (EBM) technique.
7. The method of claim 1, wherein a layer of the layer-by-layer construction is deposited from a plurality of outlets.
8. The method of claim 1, further comprising, after forming, filling the formed 3D investment mold with the molten amorphous alloy;
removing bubbles from the molten amorphous alloy;
quenching the molten amorphous alloy in the 3D investment mold, and then
removing the 3D investment mold from the molded housing of the electronic device.
9. A method comprising:
filling a 3D investment mold formed by a layer-by-layer construction process with molten alloy;
quenching the molten alloy in the 3D investment mold, and then
removing the 3D investment mold from the quenched, molded alloy,
wherein the 3D investment mold is configured to form a bulk metallic glass (BMG) part that is part of an electronic device.
10. The method of claim 9, further comprising removing bubbles from the molten alloy.
11. The method of claim 9, further comprising vibrating the 3D investment mold, and wherein the mold is at least vibrated during the filling.
12. The method of claim 11, wherein the vibrations applied to the 3D investment mold are ultrasonic.
13. The method of claim 9, further comprising applying a vacuum via a vacuum source to at least the 3D investment mold, and wherein the molten alloy is filled under vacuum.
14. The method of claim 9, further comprising heating the 3D investment mold.
15. The method of claim 9, further comprising heating the 3D investment mold before filling and applying a vacuum via a vacuum source to at least the 3D investment mold, wherein the mold is filled with the molten alloy under vacuum.
16. The method of claim 9, further comprising vibrating the 3D investment mold and applying a vacuum via a vacuum source to at least the 3D investment mold, wherein the mold is at least vibrated during the filling and wherein the mold is filled with the molten alloy under vacuum.
17. The method of claim 16, wherein the vibrations applied to the 3D investment mold are ultrasonic.
18. The method of claim 9, wherein the 3D investment mold comprises a hollow interior provided between inner and outer walls, and wherein the hollow interior is configured to receive the molten alloy when filling the mold with the molten alloy between the inner and outer walls.
19. The method of claim 9, wherein the 3D investment mold includes at least one portion therein formed via the layer by layer construction process configured to form at least one undercut or overhang feature in the bulk metallic glass (BMG) part, and wherein the filling of the 3D investment mold includes filling the 3D investment mold with the molten alloy to form the at least one undercut or overhang feature in the bulk metallic glass (BMG) part of the electronic device.
20. The method of claim 9, wherein the removing of the 3D investment mold comprises mechanically or chemically removing the 3D investment mold from the quenched, molded alloy.
21. The method of claim 9, further comprising polishing the BMG part after removing the 3D investment mold.
22. A method comprising:
supplying molten amorphous alloy to a mold comprising a layer-by-layer construction, the molten amorphous alloy having a composition configured to form a bulk metallic glass (BMG) product on cooling, and
removing the BMG product from the mold after cooling of the molten amorphous alloy,
wherein the mold comprises a cavity between two walls for receiving the molten amorphous alloy therein.
23. The method of claim 22, wherein the BMG product is a part of an electronic device.
24. The method of claim 23, wherein the mold includes at least one portion therein formed via the layer by layer construction process configured to form at least one undercut or overhang feature in the BMG product part, and wherein the supplying of the mold includes supplying the mold with the molten amorphous alloy to form the at least one undercut or overhang feature in the BMG product of the electronic device.
25. The method of claim 22, further comprising vibrating the mold.