1. A method for forming a region of low dielectric constant nanoporous material, said method comprising the steps of:
a) preparing a microemulsion;
b) applying said microemulsion to a surface above which it is desired to form said region of low dielectric constant nanoporous material; and
c) subjecting said microemulsion, which has been applied to said surface, to a thermal process such that said region of low dielectric constant nanoporous material is formed above said surface.
2. The method for forming a region of low dielectric constant nanoporous material as recited in claim 1 wherein step a) comprises preparing a microemulsion containing polydiorganosiloxane material.
3. The method for forming a region of low dielectric constant nanoporous material as recited in claim 1 wherein step a) comprises preparing a microemulsion containing particles of which the biggest particle has a size of less than approximately 0.15 microns in diameter.
4. The method for forming a region of low dielectric constant nanoporous material as recited in claim 1 wherein step a) comprises preparing a microemulsion comprised of water, a surfactant, and a catalyst.
5. The method for forming a region of low dielectric constant nanoporous material as recited in step a) of claim 3 wherein said surfactant is selected from the group consisting of anionic, cationic, and nonionic surfactants.
6. The method for forming a region of low dielectric constant nanoporous material as recited in claim 1 wherein step b) comprises applying said microemulsion, using a spin-on-process, to said surface above which it is desired to form said region of low dielectric constant nanoporous material.
7. The method for forming a region of low dielectric constant nanoporous material as recited in claim 1 wherein said thermal process of step c) comprises subjecting said microemulsion, which has been applied to said surface, to a first thermal treatment stage and to a second thermal treatment stage.
8. The method for forming a region of low dielectric constant nanoporous material as recited in step c) of claim 7 wherein said first thermal treatment stage is performed to remove water and surfactant from said microemulsion such that pores are formed.
9. The method for forming a region of low dielectric constant nanoporous material as recited in step c) of claim 7 wherein said second thermal treatment stage is performed to harden said emulsion and improve adhesion of said emulsion to said surface above which it is desired to form said region of low dielectric constant nanoporous material.
10. The method for forming a region of low dielectric constant nanoporous material as recited in step c) of claim 7 wherein said first thermal treatment stage comprises subjecting said emulsion to a temperature of approximately 200 degrees Celsius.
11. The method for forming a region of low dielectric constant nanoporous material as recited in step c) of claim 7 wherein said second thermal treatment stage comprises subjecting said microemulsion, which has been applied to said surface, to a temperature of approximately 350 degrees Celsius.
12. A method for forming a region of low dielectric constant nanoporous material, said method comprising the steps of:
a) preparing a microemulsion;
b) applying said microemulsion to a surface above which it is desired to form said region of low dielectric constant nanoporous material; and
c) subjecting said microemulsion, which has been applied to said surface, to a thermal process such that said region of low dielectric constant nanoporous material is formed above said surface, thermal process comprising:
a first thermal treatment stage, said first thermal treatment stage performed to remove water and surfactant from said microemulsion such that pores are formed, and
a second thermal treatment stage, said second thermal treatment stage performed to harden said emulsion and improve adhesion of said emulsion to said surface above which it is desired to form said region of low dielectric constant nanoporous material.
13. The method for forming a region of low dielectric constant nanoporous material as recited in claim 12 wherein step a) comprises preparing a microemulsion containing polydiorganosiloxane material.
14. The method for forming a region of low dielectric constant nanoporous material as recited in claim 12 wherein step a) comprises preparing a microemulsion containing particles of which the biggest particle has a size of less than approximately 0.15 microns in diameter.
15. The method for forming a region of low dielectric constant nanoporous material as recited in claim 12 wherein step a) comprises preparing a microemulsion comprised of water, a surfactant, and a catalyst.
16. The method for forming a region of low dielectric constant nanoporous material as recited in step a) of claim 15 wherein said surfactant is selected from the group consisting of anionic, cationic, and nonionic surfactants.
17. The method for forming a region of low dielectric constant nanoporous material as recited in claim 12 wherein step b) comprises applying said microemulsion, using a spin-on-process, to said surface above which it is desired to form said region of low dielectric constant nanoporous material.
18. The method for forming a region of low dielectric constant nanoporous material as recited in step c) of claim 12 wherein said first thermal treatment stage comprises subjecting said emulsion to a temperature of approximately 200 degrees Celsius.
19. The method for forming a region of low dielectric constant nanoporous material as recited in step c) of claim 12 wherein said second thermal treatment stage comprises subjecting said microemulsion, which has been applied to said surface, to a temperature of approximately 350 degrees Celsius.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A machine tool, comprising:
a contact module including a first contact region, a second contact region, and a third contact region;
an electric drive motor directly electrically connected only to the contact module, the electric drive motor being directly physically and electrically connected to the first contact region;
an electronics unit connected to the contact module at the second contact region, the electronics unit controlling the drive motor; and
a switch external to the contact module and connected to the contact module at the third contact region, the switch controlling an onoff state of the electric drive motor,
wherein the electronics unit is electrically connected to the switch by first cables, and the switch is electrically connected to the electric drive motor through the contact module by second cables.
2. The machine tool as claimed in claim 1, wherein the second contact region of the contact module is connected to the electronics unit by the first cables.
3. The machine tool as claimed in claim 1, wherein the second contact region of the contact module is fixedly connected to the electronics unit.
4. A machine tool, comprising:
a contact module including a first contact region, a second contact region, and a third contact region;
an electric drive motor directly electrically connected only to the contact module, the electric drive motor being directly physically and electrically connected to the first contact region;
an electronics unit connected to the contact module at the second contact region, the electronics unit controlling the drive motor; and
a switch connected to the contact module at the third contact region, the switch controlling an onoff state of the electric drive motor,
wherein the electronics unit is electrically connected to the second contact region by first cables, and the switch is electrically connected to the electric drive motor through the contact module by second cables, and
wherein the switch and the third contact region of the contact module are connected to one another by a releasable plug connection.
5. The machine tool as claimed in claim 1, wherein the drive motor is connected to the first contact region of the contact module by a releasable cable connection.
6. The machine tool as claimed in claim 1, wherein the contact module includes additional electronic components.
7. The machine tool as claimed in claim 1, wherein the contact module is designed in two parts with two housing parts configured to be connected.
8. The machine tool as claimed in claim 7, wherein the housing parts of the contact module are connected to one another by an interlocking connection.
9. The machine tool as claimed in claim 7, further comprising a separating wall arranged between the two housing parts and configured to provide electrical and mechanical insulation between the two housing parts.
10. The machine tool as claimed in claim 1, wherein the contact module is filled with an encapsulation compound.
11. The machine tool as claimed in claim 6, wherein the additional electronic components include a printed circuit.
12. The machine tool as claimed in claim 6, wherein the additional electronic components include a diode.