1. A heat radiator having a thermo-electric cooler and multiple heat radiation modules, comprising:
a first heat radiation module having a first heat radiating fin set and a first heat conducting pipe connected to each fin of said first heat radiating fin set, said first heat conducting pipe having one end extended close to a heat source;
a thermo-electric cooler attached to said heat source for delivering heat from a contact surface with said heat source to an opposite upper surface; and
a second heat radiation module having a second heat radiating fin set and a second heat conducting pipe connected to each fin of said second heat radiating fin set, said second heat conducting pipe having one end extended close to said thermo-electric cooler.
2. The heat radiator having a thermo-electric cooler and multiple heat radiation modules of claim 1 wherein a first end of said first heat conducting pipe is embedded in a base that is in turn connected with said heat source.
3. The heat radiator having a thermo-electric cooler and multiple heat radiation modules of claim 1 wherein a second end of said first heat conducting pipe is extended to a place of good ventilation.
4. The heat radiator having a thermo-electric cooler and multiple heat radiation modules of claim 1 wherein a first end of said second heat conducting pipe is extended close to said upper surface of said thermo-electric cooler wherein heat is released.
5. The heat radiator having a thermo-electric cooler and multiple heat radiation modules of claim 1 wherein a second end of said second heat conducting pipe is extended to a place of good ventilation.
6. The heat radiator having a thermo-electric cooler and multiple heat radiation modules of claim 1 wherein said thermo-electric cooler is enclosed within a heat conducting component for absorbing heat from said thermo-electric cooler; said second heat conducting pipe delivering heat from said thermo-electric cooler to said second heat radiating fin set.
7. The heat radiator having a thermo-electric cooler and multiple heat radiation modules of claim 1 wherein a fan is installed on a lateral side of any of said first and second heat radiating fin sets.
8. The heat radiator having a thermo-electric cooler and multiple heat radiation modules of claim 1 wherein said first heat radiation module is provided with at least an extra heat conducting pipe with one end attached to one face of said thermo-electric cooler and another end going through said first heat radiating fin set for enhancing heat dissipation.
9. The heat radiator having a thermo-electric cooler and multiple heat radiation modules of claim 1 wherein said second heat radiation module is provided with at least an extra heat conducting pipe with one end attached to one face of said thermo-electric cooler and another end going through said second heat radiating fin set for enhancing heat dissipation.
10. A heat radiation method using said heat radiator of claim 1, comprising the steps of:
(1) said thermo-electric cooler attached to said heat source delivering heat from a contact surface with said heat source up to an opposite upper surface thereon;
(2) said first heat conducting pipe conducting heat from said thermo-electric cooler and said heat source to said first heat radiating fin set;
(3) said second heat conducting pipe conducting heat from said thermo-electric cooler to said second heat radiating fin set; and
(4) producing a cold airflow onward said first heat radiating fin set and second heat radiating fin set to achieve heat dissipation through heat exchange.
11. The heat radiation method of claim 10 wherein a space accommodating said heat radiation modules further includes a wind exit, enhancing air convection.
12. The heat radiation method of claim 10 further including the step of using at least a fan located aside a heat radiating fin set to facilitate a cold airflow passing through said fins.
13. The heat radiation method of claim 12 further including the step of using second fan to work with a first fan so as to produce an effect of airflow convection.
14. The heat radiation method of claim 10 wherein said heat source is an electronic circuit element.
15. The heat radiation method of claim 14 wherein said electronic circuit element is a central processing unit.
16. A heat radiator having a thermo-electric cooler and multiple heat radiation modules, comprising:
a first heat radiation module having a first heat radiating fin set and a heat sink connected to said first heat radiating fin set, said heat sink having one end extended close to a heat source;
a thermo-electric cooler attached to said heat source for delivering heat from a contact surface with said heat source to an opposite upper surface; and
a second heat radiation module having a second heat radiating fin set and a heat sink connected to said second heat radiating fin set, said heat sink having one end connected to said said upper surface of said thermo-electric cooler.
17. The heat radiator having a thermo-electric cooler and multiple heat radiation modules of claim 16 further including a fan installed on a lateral side of any of said first and second heat radiating fin sets.
18. The heat radiator having a thermo-electric cooler and multiple heat radiation modules of claim 16 wherein said first heat radiation module, said heat sink of said second heat radiation module and said heat radiating sets are directly connected.
19. A heat radiation method using said heat radiator of claim 16, comprising the steps of:
(1) said thermo-electric cooler attached to said heat source delivering heat from a contact surface with said heat source up to an opposite upper surface thereon;
(2) said first heat sink conducting heat from said thermo-electric cooler and said heat source to said first heat radiating fin set; and
(3) said second heat sink conducting heat from said thermo-electric cooler to said second heat radiating fin set.
20. The heat radiation method of claim 19 further including the step of driving a cold airflow onward said first heat radiating fin set and second heat radiating fin set to achieve heat dissipation through heat exchange.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A system comprising:
an emitting device and a frequency splitter, wherein:
the frequency splitter includes:
at least one component with a Mach-Zehnder topology, and, in a case of plural components, the plural components are daisy chained, wherein
the at least one component with the Mach-Zehnder topology comprising:
an input port to receive an input signal;
an extracting port to output a band of the input signal corresponding to a nominal wavelength of the at least one component;
an output port to output the input signal except for the outputted band, the output port being connected to the input port of a next component if any or being unused for a last component of the daisy chain or an only component;
an add port which is unused; and
all unused ports of the at least one component with the Mach-Zehnder topology of the frequency splitter include a reflecting member;
the emitting device configured to use one operating level or a set of operating levels for transmitting signals to a receiving device via the frequency splitter, and
the emitting device is connected to the input port or the extracting port of one of the plural components with the Mach-Zehnder topology or the at least one component with the Mach-Zehnder topology, and the emitting device is configured to determine at least one operating level by measuring a signal reflected by the frequency splitter.
2. A method for coupling an emitting device to a frequency splitter, the emitting device using one operating level or a set of operating levels for transmitting signals to a receiving device via the frequency splitter, the frequency splitter comprising:
at least one component with a Mach-Zehnder topology, and, in a case of plural components, the plural components are daisy chained, wherein
the at least one component with the Mach-Zehnder topology comprising:
an input port to receive an input signal;
an extracting port to output a band of the input signal corresponding to a nominal wavelength of the at least one component;
an output port to output the input signal except for the outputted band, the output port being connected to the input port of a next component if any or being unused for a last component of the daisy chain or an only component;
an add port which is unused;
all unused ports of the at least one component with a the Mach-Zehnder topology of the frequency splitter include a reflecting member in order to reflect all incoming signals; and
the emitting device is connected to the input port or the extracting port of one of the plural components with the Mach-Zehnder topology or the at least one component with the Mach-Zehnder topology, the emitting device being further configured to determine at least one operating level by measuring a signal reflected by the frequency splitter.
3. The method according to claim 2, wherein:
the emitting device performs a first set of operations including:
initializing an operating level to a first wavelength;
sending a signature signal toward the receiving device using the operating level; and
measuring power of a signal received in response to the signature signal, to estimate a presence of a signal reflected by the frequency splitter, the first set of operations being repeated over a band of operating levels; and
the emitting device further performs:
determining the operating level, or the set of operating levels, for which the power of the received signal is minimum; and
setting the operating level, or the set of operating levels, to the determined operating level, or operating levels, for which the power of the received signal is minimum.
4. The method according to claim 3, wherein the measuring the power of the received signal is performed by modulation and filtering.
5. The method according to claim 3, wherein the measuring the power of the received signal is performed by synchronous detection.
6. The method according to claim 3, wherein the measuring the power of the received signal comprises:
defining a temporal sliding window;
measuring the power of the received signal over the temporal sliding window; and
moving the temporal sliding window in a range from an origin to a maximum corresponding to a round trip time of a total transmission path between the emitting device and the receiving device, the moving of the temporal sliding window being coupled with an automatic gain control in order to get the signal reflected by the frequency splitter.
7. The method according to claim 6, wherein a width of the temporal sliding window is chosen to be equal to a duration of the sent signature signal.
8. The method according to claim 6, wherein a power splitter is placed between the frequency splitter and the emitting device, and a gain corresponding to an attenuation due to the power splitter is applied for a position of the sliding window corresponding to a reflection point behind the power splitter relatively to a position of the emitting device on the total transmission path.
9. A method for tracking over time variation of at least one nominal wavelength of at least one respective component with a Mach-Zehnder topology in a frequency splitter, wherein a coupling method according to claim 2 is applied on a regular basis.