1. A stacked microelectronic package, comprising:
a molded package body having an external vertical package sidewall;
a plurality of singulated microelectronic devices embedded within the molded package body
package edge conductors electrically coupled to the plurality of microelectronic devices and extending to the external vertical package sidewall;
a cavity formed in an external surface of the molded package body between a first one of the package edge conductors and a second one of the package edge conductors; and
electrically conductive material in the cavity and in electrical contact with a first and a second one of the package edge conductors, wherein the conductive material in the cavity is within planform dimensions of the microelectronic package and sidewalls of the cavity cover all side edges of the electrically conductive material.
2. A stacked microelectronic package according to claim 1 wherein the package edge conductors are formed to electrically couple the plurality of microelectronic devices embedded within the molded package body.
3. A stacked microelectronic package according to claim 1 wherein the plurality of microelectronic devices comprises a first microelectronic device and a second microelectronic device located in different levels of the molded package body, and wherein the package edge conductors are formed to electrically couple the first microelectronic device to the second microelectronic device.
4. A stacked microelectronic package according to claim 3 wherein the cavity is formed in a step configuration that includes a run portion over a major surface of one of the levels of the molded package body, the run portion extending between and in contact with the external vertical package sidewall of a first level of the different levels and the external vertical package sidewall of a second level of the different levels.
5. A stacked microelectronic package according to claim 1 wherein a portion of the first and second one of the package edge conductors form part of the cavity.
6. A stacked microelectronic package according to claim 5 wherein the cavity extends beyond at least one of the first and second one of the package edge conductors.
7. A stacked microelectronic package according to claim 5 wherein the cavity extends to an intermediate location over at least one of the first and second one of the package edge conductors.
8. A stacked microelectronic package, comprising:
a molded package body having an external vertical package sidewall;
a first singulated microelectronic device embedded within a first level of the molded package body;
a second singulated microelectronic device embedded within a second level of the molded package body;
a first package edge conductor electrically coupled to the first microelectronic device and extending to the external vertical package sidewall, and a second package edge conductor electrically coupled to the second microelectronic device and extending to the external vertical package sidewall;
a cavity formed in an external surface of the molded package body between the first package edge conductor and the second package edge conductor; and
electrically conductive material in the cavity and in electrical contact with the first and second package edge conductors, wherein sidewalls of the cavity overlap all side edges of the electrically conductive material.
9. A stacked microelectronic package according to claim 8 wherein the first and second package edge conductors are formed to electrically couple the first and second microelectronic devices embedded within the molded package body.
10. A stacked microelectronic package according to claim 3 wherein the cavity is formed in a step configuration that includes a run portion over a major surface of one of the levels of the molded package body, the run portion extending between and in contact with the external vertical package sidewall of a first level of the different levels and the external vertical package sidewall of a second level of the different levels.
11. A stacked microelectronic package, comprising:
a molded package body having an external vertical package sidewall, a plurality of singulated microelectronic devices embedded within the molded package body, and package edge conductors electrically coupled to the plurality of microelectronic devices and extending to the external vertical package sidewall;
a cavity in an external surface of the molded package body between a first one of the package edge conductors and a second one of the package edge conductors, wherein the cavity is filled with electrically conductive material and top, bottom and side edges of the electrically conductive material are covered by the cavity.
12. A stacked microelectronic package as claimed in claim 11 wherein the first and second one of the package edge conductors are formed to electrically couple the plurality of microelectronic devices embedded within the molded package body.
13. A stacked microelectronic package as claimed in claim 11 wherein the plurality of microelectronic devices comprises a first microelectronic device and a second microelectronic device located in different levels of the molded package body, and wherein the first and second one of the package edge conductors are formed to electrically couple the first microelectronic device to the second microelectronic device.
14. A stacked microelectronic package as claimed in claim 11 wherein the cavity is formed between the first and second one of the package edge conductors and the conductive material is in contact with the first and second ones of the package edge conductors.
15. A stacked microelectronic package as claimed in claim 11 wherein the cavity is formed by removing a portion of the first and second one of the package edge conductors.
16. A stacked microelectronic package as claimed in claim 15 wherein the cavity is formed by extending the cavity beyond at least one of the first and second one of the package edge conductors.
17. A stacked microelectronic package as claimed in claim 15 wherein the cavity is formed by extending the cavity to an intermediate location over at least one of the first and second one of the package edge conductors.
18. A stacked microelectronic package as claimed in claim 13 wherein the cavity is formed in a step configuration that includes a run portion over a major surface of one of the levels of the molded package body, the run portion extending between and in contact with the external vertical package sidewall of a first level of the different levels and the external vertical package sidewall of a second level of the different levels.
19. A stacked microelectronic package as claimed in claim 18 wherein the conductive material in the cavity is within planform dimensions of the microelectronic package.
20. A stacked microelectronic package as claimed in claim 11 wherein the conductive material comprises one of a group consisting of: an electrically conductive adhesive, conductive polymer, a polymer filled with conductive particles, a metal alloy, metal coated organic particles, metal coated ceramic particles, solder paste, solder-filled adhesive, nanoparticle-filled ink, a metal-containing adhesive, a metal-containing epoxies, electrically-conductive pastes, indium, and bismuth.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A controlled release pharmaceutical formulation consisting essentially of:
(A) a compressed matrix core consisting of:
(i) 10 to 50 weight percent based on the total weight of the matrix core of a decongestant or pharmaceutically acceptable salt thereof;
(ii) 50 to 90 weight percent based on the total weight of the matrix core of a hydrogel forming polymer \u201cselected from the group consisting of hydroxypropyl methylcellulose, carboxymethylcellulose calcium, carboxymethylcellulose sodium, guar gum, hydroxyethyl cellulose, hydroxypropyl cellulose, methyl cellulose, acrylic acid crosslinked with polyalkenyl ethers or divinyl glycol, sodium alginate and polyethylene oxide\u201d;
(iii) 0 to 20 weight percent based upon the total weight of the matrix core of a filler selected from lactose, starch, dextrose or sucrose;
(iv) 0 to 5 weight percent based on the total weight of the matrix core of a glidant;
(v) 0 to 10 weight percent based on the total weight of the matrix core of one or more lubricants;
(B) an immediate release coating on said compressed matrix core which consists essentially of:
(i) 0.01 to 10 weight percent based on the total weight of the formulation of an antihistamine
(ii) 0 to 20 weight percent based upon the total weight of the formulation of a pharmaceutically acceptable binder which allows for immediate release of the antihistamine
(iii) 0 to 10 weight percent based on the total weight of the formulation of a lubricant; and
(iv) 0 to 10 weight percent based on the total weight of the formulation of an antiadherent; and
(C) optionally a polishing agent or color coating that coats the immediate release coating.
2. The formulation as defined in claim 1 wherein the hydrogel forming polymer is hydroxypropyl methylcellulose with an average molecular weight of 180,000 to 220,000.
3. The formulation as described in claim 1 wherein said polishing agent comprises candellila wax.
4. The formulation as described in claim 1 wherein:
(A) the compressed matrix core consists of:
(i) 20 to 40 wt % based on the total weight of the matrix core of a decongestant or pharmaceutically acceptable salt thereof;
(ii) 55 to 75 wt % based on the total weight of the matrix core of a hydrogel forming polymer;
(iii) 5 to 15 wt % based upon the total weight of the matrix core of a filler selected from lactose, starch, dextrose or sucrose;
(iv) 0.01 to 2 wt % based on the total weight of the matrix core of a glidant; and
(v) 0.01 to 5 wt % based on the total weight of the matrix core of a lubricant;
(B) the immediate release coating on said compressed matrix core which consists essentially of:
(i) 0.01 to 5 wt % based on the total weight of the formulation of a non-sedating antihistamine
(ii) 0.01 to 10 wt % based upon the total weight of the formulation of a pharmaceutically acceptable binder forming material which allows for immediate release of the non-sedating antihistamine (iii) 0.1 to 5 wt % based on the total weight of the formulation of a lubricant; and
(iv) 0.1 to 5 wt % based on the total weight of the formulation of an antiadherent.
5. A once a day, antihistamine and decongestant formulation consisting essentially of:
(A) a compressed matrix core consisting of:
(i) 10 to 50 wt % based on the total weight of the matrix core of pseudoephedrine or a pharmaceutically acceptable salt thereof;
(ii) 50 to 90 wt % based on the total weight of the matrix core of a single hydrogel forming polymer \u201cselected from the group consisting of hydroxypropyl methylcellulose, carboxymethylcellulose calcium, carboxymethylcellulose sodium, guar gum, hydroxyethyl cellulose, hydroxypropyl cellulose, methyl cellulose, acrylic acid crosslinked with polyalkenyl ethers or divinyl glycol, sodium alginate and polyethylene oxide\u201d;
(iii) 0 to 20 wt% based on the total weight of the matrix core of a filler selected from lactose, starch, dextrose or sucrose;
(iv) 0 to 5 wt % based on the total weight of the matrix core of an antiadherent;
(v) 0 to 10 wt % based on the total weight of the matrix core of a lubricant; and
(B) an immediate release coating on said compressed matrix core which consists essentially of;
(i) 0.01 to 10 wt % based on the total weight of the formulation of loratadine;
(ii) 0.1 to 20 wt % based on the total weight of the formulation of a pharmaceutically acceptable binder material which allows for immediate release of the loratadine;
(iii) 0 to 10 wt % of lubricant; and
(iv) 0 to 10 wt % of antiadherent; and
(C) optionally, a polishing agent or color coating that coats the immediate release coating.
6. The formulation described in claim 5 wherein:
(A) the compressed matrix core consists of:
(i) 20 to 40 wt % based on the total weight of the matrix core of pseudoephedrine or a pharmaceutically acceptable salt thereof;
(ii) 55 to 75 wt % based on the total weight of the matrix core of a hydrogel forming polymer;
(iii) 5 to 15 wt % based on the total weight of the matrix core of a filler selected from lactose, starch, dextrose or sucrose;
(iv) 0.01 to 2 wt % based on the total weight of the matrix core of an antiadherent;
(v) 0.01 to 5 wt % based on the total weight of the matrix core of a lubricant; and
(B) the immediate release coating on said compressed matrix core which consists essentially of;
(i) 0.1 to 5 wt % based on the total weight of the matrix core of loratadine;
(ii) 0.1 to 10 wt % based on the total weight of the matrix core of a pharmaceutically acceptable binder which allows for immediate release of the loratadine;
(iii) 0.1 to 5 wt % of lubricant; and
(iv) 0.1 to 5 wt % of antiadherent.
7. The formulation as defined in claim 5 wherein the polishing agent consists essentially of candellila wax.
8. The formulation as defined in claim 5 wherein the hydrogel polymer is hydroxypropyl methylcellulose having average molecular weight of 180,000 to 220,000.
9. The composition of claim 5 which exhibits the following blood level concentration of loratadine when administered under fasting conditions:
(a) from 1.5 to 3.0 ngml of the loratadine after 2.0 hours;
(b) from 0.75 to 1.5 ngml of loratadine after 4.0 hours;
(c) from 0.25 to 0.5 ngml of loratadine after 6.0 hours;
(d) from 0.1 to 0.3 ngml of loratadine after 8.0 hours.
10. The composition of claim 5 which exhibits the following blood level concentration of descarboethoxyloratadine when administered under fasting conditions:
(a) from 1.5 to 2.5 ngml of descarboethoxyloratadine after 6.0 hours;
(b) from 0.75 to 1.5 ngml of descarboethoxyloratadine after 12.0 hours;
(c) from 0.5 to 1.0 ngml of descarboethoxyloratadine after 24.0 hours.
11. The composition of claim 5 which exhibits the following blood level concentration of pseudoephedrine when administered under fasting conditions:
(a) from 50 to 150 ngml of pseudoephedrine after 3 hours;
(b) from 200 to 300 ngml of pseudoephedrine after 6.0 hours;
(c) from 200 to 250 ngml of pseudoephedrine after 12.0 hours;
(d) from 175 to 225 ngml of pseudoephedrine after 18.0 hours;
(e) from 75 to 125 ngml of pseudoephedrine after 24.0 hours.
12. The formulation as defined in claim 1 wherein the antihistamine is a non-sedating antihistamine.
13. The formulation as defined in claim 1 wherein the antihistamine is a piperidinoalkanol compound.
14. The formulation as defined in claim 1 wherein the antihistamine is loratatdine.
15. The formulation as defined in claim 1 wherein the decongestant is a pseudoephedrine salt selected from the group consisting of sulphate, sodium, calcium, or hydrochloride.
16. The formulation as defined in claim 1 wherein the hydrogel forming polymer is hydroxypropyl methylcelluose with an average molecular weight greater than 180,000.
17. The formulation as defined in claim 1 wherein said filler is lactose.
18. The formulation as defined in claim 1 wherein said glidant in the matrix core is colloidal silicon dioxide.
19. The formulation as defined in claim 1 wherein said lubricant in the matrix core is a mixture of magnesium stearate and glyceryl monostearate.
20. The formulation as defined in claim 1 wherein said binder in the immediate release coating comprises hydroxypropyl methylcellulose.
21. The formulation as defined in claim 1 wherein said lubricant in the immediate release coating is talc.
22. The formulation as defined in claim 1 wherein the antiadherent in the immediate release coating is sodium lauryl sulfate.
23. The formulation as defined in claim 1 which exhibits the following antihistamine dissolution profile when tested in 900 ml of simulated gastric fluid buffer, pH 1.2, using a USP Type I apparatus at 100 rpm, 37\xb0 C..
a) from 40 to 80 wt % of the antihistamine is released after 0.25 hours;
b) from 65 to 95 wt % of the antihistamine is released after 0.5 hour;
c) not less than to 85 wt % of the antihistamine is released after 1.0 hour.
24. The formulation as defined in claim 1 which exhibits the following antihistamine dissolution profile when tested in 900 ml of simulated gastric fluid buffer, pH 1.2, using a USP Type I apparatus at 100 rpm, 37\xb0 C.
a) not less than 50 wt % of antihistamine released after 0.25 hour;
b) not less than 75 wt % of antihistamine released after 0.5 hour;
c) not less than 90 wt % of antihistamine released after 1.0 hour.
25. The formulation as defined in claim 1 which exhibits the following decongestant dissolution profile when tested in 900 ml of simulated gastric fluid buffer, pH 1.2, using a USP Type I apparatus at 100 rpm, 37\xb0 C.
(a) from 0 to 50 wt % of the decongestant is released after 1.0 hour;
(b) from 10 to 60 wt % of the decongestant is released after 2.0 hours;
(c) from 20 to 70 wt % of the decongestant is released after 4.0 hours;
(d) from 30 to 85 wt % of the decongestant is released after 8.0 hours;
(e) not less than 45 wt % of the decongestant is released after 12.0 hours;
(f) not less than 60 wt % of the decongestant is released after 20.0 hours.
26. The formulation as defined in claim 1 which exhibits the following decongestant dissolution profile when tested in 900 ml of simulated gastric fluid buffer at pH 1.2 using a USP Type I apparatus at 100 rpm at 37\xb0 C.
(a) from 10 to 40 wt % of the decongestant is released after 1.0 hours;
(b) from 15 to 45 wt % of the decongestant is released after 2.0 hours;
(c) from 25 to 60 wt % of the decongestant is released after 4.0 hours;
(d) from 35 to 80 wt % of the decongestant is released after 8.0 hours;
(e) not less than 50 wt % of the decongestant is released after 12.0 hours;
(f) not less than 70 wt % of the decongestant is released after 20.0 hours.