1-8. (canceled)
9. A semiconductor substrate cutting method for cutting a semiconductor substrate having a front face formed with a plurality of functional devices into the individual functional devices, so as to manufacture a semiconductor device having the functional device, the method comprising the steps of:
attaching a protective member to the front face of the semiconductor substrate, such that the functional devices are covered;
irradiating the semiconductor substrate with laser light while positioning a light-converging point within the semiconductor substrate with a rear face of the semiconductor substrate acting as a laser light incident face after the step of attaching the protective member, so as to form a modified region, and causing the modified region to form a starting point region for cutting along each line along which the semiconductor substrate should be cut, the lines set like a grid running between the neighboring functional devices, inside by a predetermined distance from the laser light incident face;
attaching an expandable holding member to the rear face of the semiconductor substrate by way of a die bonding resin layer after forming the starting point regions for cutting;
cutting the semiconductor substrate and the die bonding resin layer from the starting point regions for cutting along each of the lines in the grid by expanding the holding member after attaching the holding member, so as to obtain a plurality of semiconductor chips each having a front face formed with the functional device and having a cut piece of the die bonding resin layer in close contact with a rear face thereof; and
mounting the semiconductor chip onto a support body by way of the cut piece of the die bonding resin layer in close contact with the rear face thereof, so as to obtain the semiconductor device.
10. A semiconductor substrate cutting method according to claim 9, wherein the support body is a lead frame.
11. A semiconductor substrate cutting method according to claim 9, wherein the holding member is expanded after the protective member is removed from the front face of the semiconductor substrate.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An edge clamp for clamping an elongated edge of a first flat plate to a fixed flat structure, said edge clamp comprising:
an elongated spring element including first and second generally mutually parallel spring plates, said first and second spring plates being elongated in a first direction, namely the direction of elongation of said elongated edge of said flat plate, said first and second spring plates being mechanically interconnected by a plurality of spaced-apart supports extending in a second direction generally orthogonal to said direction of elongation of said first and second spring elements, to define between said supports a plurality of unsupported regions in which said first and second spring plates are not interconnected, and to also define external surfaces of said first and second spring plates on those sides of said first and second spring plates remote from said supports, said first spring plate defining at least a first externally-directed projection from said external surface of said first spring plate in regions overlying at least some of said unsupported regions, and said second spring plate defining at least a first externally-directed projection from said external surface of said second spring plate, centered on at least some of said unsupported regions;
first fixing means coupled to said first spring element and to said fixed flat structure for preventing motion of said first spring element in said first and second directions, and for allowing motion of said externally-directed projections in a third direction generally orthogonal to both said first and second directions;
an elongated first wedging element, said first wedging element being elongated in said first direction, and being juxtaposed with said second spring plate of said spring element, that surface of said first wedging element facing said second spring plate bearing a plurality of wedges having length dimensions parallel with said first direction which are approximately equal to the spacing between said supports, and height dimensions parallel with said third direction, said height of each of said wedges varying from a first value to a second value along the length thereof;
second fixing means coupled to said elongated first wedging element, for preventing motion of said elongated first wedging element as a whole in said third direction, and allowing bidirectional motion of said first wedging element parallel to said first direction;
force application means coupled to said first wedging element, for applying force to said first wedging element parallel to said first direction, for thereby causing motion of said first wedging element in a direction parallel with said first direction to thereby move each of said wedges relative to said externally directed projections of said second spring element to cause motion of said externally directed projections of said second spring element in said third direction relative to said fixed plate, whereby said externally directed projections of said first spring plate are urged against said elongated edge of said first flat plate.
2. An edge clamp according to claim 1, wherein said second fixing means comprises:
a second flat plate defining an elongated edge, and a second fixed flat structure, said elongated edge of said second flat plate extending parallel with said first direction and being juxtaposed with said second fixed flat structure;
a second elongated spring element including third and fourth generally mutually parallel spring plates, said third and fourth spring plates being elongated in said first direction, said third and fourth spring plates being mechanically interconnected by a plurality of spaced-apart second supports extending parallel with said second direction, to define between said second supports a plurality of unsupported regions in which said third and fourth spring plates are not interconnected, and to also define external surfaces of said third and fourth spring plates on those sides of said third and fourth spring plates remote from said second supports, said third spring plate defining at least a first externally-directed projection from said external surface of said first spring plate in regions overlying at least some of said unsupported regions, and said fourth spring plate defining at least a first externally-directed projection from said external surface of said second spring plate, centered on at least some of said unsupported regions, said second spring element being adjacent said elongated edge of said second flat plate in a manner symmetrical with the disposition of said first spring element relative to said edge of said first flat plate;
an elongated second wedging element, said second wedging element being elongated in said first direction and being fixed to said first wedging element for motion therewith parallel with said first direction, and being juxtaposed with said fourth spring plate of said spring element, that surface of said second wedging element facing said fourth spring plate bearing a plurality of wedges having length dimensions parallel with said first direction which are approximately equal to the spacing between said second supports, and height dimensions parallel with said third direction, said height of each of said wedges varying from a first value to a second value, said wedges of said second wedging element and said projections of said second spring element being equal in dimensions and registered with those of said first wedging element and said first spring element to thereby produce equal and oppositely directed forces on said conjoined first and second wedging means when said forcing means moves said first wedging means and conjoined second wedging means relative to said first and second spring elements, respectively.
3. An edge clamp for clamping edges of plates to fixed structures, said edge clamp comprising:
a spring element including first and second spring plates interconnected by a plurality of spaced-apart supports extending between said first and second spring elements, said first spring plate defining at least one externally-directed projection and said second spring plate defining at least one externally-directed projection;
a wedging element including a surface facing said second spring plate, said surface including a plurality of wedges, each of said wedges being of a variable height; and
a force applicator for moving said wedging element to thereby urged said at least one externally directed projection of said first spring plate against a first one of said edges of a corresponding first one of said plates.
4. An edge clamp according to claim 3, wherein the spring element is a first spring element and further comprising:
a second spring element including first and second spring plates interconnected by a plurality of spaced-apart supports extending between said first and second spring elements, said first spring plate defining at least one externally-directed projection and said second spring plate defining at least one externally-directed projection,
wherein said surface of said wedging element is a first surface and wherein said wedging element further includes a second surface facing said second spring plate of said second spring element, said second surface including a plurality of wedges, each of said wedges being of a variable height; and
wherein said force applicator is also for moving said wedging element to thereby urged said at least one externally directed projection of said first spring plate of said second spring element against a second one of said edges of a corresponding second one of said plates.