1. A lighting package, comprising:
a solid state light source on a submount;
a wavelength conversion material layer covering said solid state light source and the top surface of said submount;
an encapsulant over said conversion material layer, said encapsulant having one or more planar surfaces, wherein said planar surfaces cause total internal reflection (TIR) of at least some light from said light source.
2. The lighting package of claim 1, wherein said solid state light source comprises one or more light emitting diodes (LEDs).
3. The lighting package of claim 1, wherein said solid state light source comprises one or more solid state lasers.
4. The lighting package of claim 1, wherein said encapsulant comprises a planar top surface and planar side surfaces.
5. The lighting package of claim 1, wherein said encapsulant comprises a horizontal planar surface and vertical planar surface.
6. The lighting package of claim 1, further comprising two or more solder pads on the backside of said submount.
7. The lighting package of claim 1, wherein said light source comprises a single LED.
8. The lighting package of claim 1, wherein said light source comprising multiple LED chips.
9. The lighting package of claim 8, wherein said LED chips are connected in series.
10. The lighting package of claim 8, wherein at least some of said LED chips are connected in parallel.
11. The lighting package of claim 8, wherein said LED chips are connected in a series and parallel combination.
12. The lighting package of claim 1, wherein said encapsulant comprises a flat top and vertical sidewalls with planar surfaces.
13. The lighting package of claim 1, wherein said encapsulant shape is from the group comprising cubic, prismatic, cylindrical, triangle, pentagon, hexagon and octagon.
14. The lighting package of claim 1, wherein said encapsulant comprises a horizontal surface and vertical surfaces numbering in the range of 3 to 12.
15. The lighting package of claim 1, comprising an emission pattern greater than 120\xb0 full width at half maximum.
16. The lighting package of claim 1, wherein said one or more planar surfaces comprise features having a root mean square (RMS) size greater than the wavelength of light emitting from said LED light source.
17. The lighting package of claim 1, further comprising a polarity indicator.
18. The lighting package of claim 17, wherein the polarity indicator is on the top or bottom surface of said submount, or both.
19. The lighting package of claim 1, having an emission profile that is wider than a package with identical features aside from an encapsulant not having planar surfaces.
20. The lighting package of claim 1, having a submount footprint area of less than 12 mm square.
21. The lighting package of claim 1, wherein the ratio of the footprint of said submount to the footprint of said one or more LEDs is in the range of just over 1 to approximately 20.
22. The lighting package of claim 1, wherein the ratio of the footprint of said submount to the footprint of said one or more LEDs is in the range of about 2.5.
23. The lighting package of claim 1, wherein said submount has a footprint ratio of approximately 1 by 1, with a corresponding height ratio in the range of approximately 0.5 to 5.
24. The lighting package of claim 1, wherein said light source comprises one or more LEDs, further comprising a plurality of die attach pads on said submount and below said encapsulant, said one or more LEDs mounted to said die attach pads.
25. The lighting package of claim 24, wherein said one or more LEDs comprise a plurality of LEDs chip mounted to said die attach pads in series.
26. The lighting package of claim 24, wherein said LEDs chip are mounted to said die attach pads in parallel.
27. The lighting package of claim 24, wherein said LED light source comprises a plurality of LED chips mounted to said die attach pads in a series and parallel combination.
28. The lighting package of claim 1, wherein said solid state light source comprises a violet to UV emitting light source.
29. The lighting package of claim 28, wherein said wavelength conversion material layer converts at least some of said violet to UV light to blue andor yellow light.
30. The lighting package of claim 28, wherein said wavelength conversion material layer comprises a combination of red, green and blue phosphors.
31. An emitter package, comprising:
a solid state light source on a submount;
a encapsulant on said submount, said encapsulant having one or more planar surfaces; and
a wavelength conversion material layer covering said solid state light source and the top surface of said submount; a polarity indicator on the bottom surface of said submount.
32. The emitter package of claim 31, wherein said solid state light source is selected from the group consisting of an LED and a laser.
33. The emitter package of claim 32, wherein said polarity indicators are visible by cameras in solid state manufacturing equipment.
34. The emitter package of claim 32, further comprising one or more contact pads on said submount.
35. The emitter package of claim 32, wherein said polarity indicator is in or on one of said contact pads.
36. The emitter package of claim 32, wherein said polarity indicator near the middle of one of the edges of one of said contact pads.
37. The emitter package of claim 32, wherein said polarity indictor is at the corner of one of said contact pads.
38. The emitter package of claim 32, wherein said polarity indicator comprises a notch.
39. The emitter package of claim 32, wherein said notch has a shape from the group comprising V-shaped, U-shaped, I-shaped, W-shaped, square shaped, rectangular shaped, plus shaped, minus shaped, and star shaped.
40. The emitter package of claim 32, wherein said polarity indicator is arranged such that it is visible through holes in LED carrier tape.
41. The emitter package of claim 32, further comprising one or more die attach pads.
42. The emitter package of claim 41, wherein said polarity indicator is in or one of said die attach pads.
43. The emitter package of claim 41, wherein said polarity indictor is along the edge of one of said die attach pads.
44. The emitter package of claim 41, wherein said polarity indicator comprises a notch.
45. The emitter package of claim 41, wherein said polarity indicator has a shape from the group comprising V-shaped, U-shaped, I-shaped, W-shaped, square shaped, rectangular shaped, plus shaped, minus shaped, and star shaped.
46. An emitter package, comprising:
a solid state light source on a submount;
an encapsulant on said submount, said encapsulant having one or more planar surfaces, wherein said package emits an emission profile that is wider than a package with identical features aside from a encapsulant not having planar surfaces.
47. The emitter package of claim 46, wherein said solid state light source is selected from the group consisting of an LED and a laser.
48. The emitter package of claim 47, wherein said encapsulant is cube shaped.
49. The emitter package of claim 47, wherein said package emits an emission profile that is wider than a similar package with a hemispheric encapsulant.
50. The emitter package of claim 47, wherein said emission profile exceeds 120 degrees full width at half maximum (FWHM).
51. The emitter package of claim 47, wherein said emission profile exceeds 130 degrees full width at half maximum (FWHM).
52. The emitter package of claim 47, wherein said emission profile is in the range of 130 to 170 degrees full width at half maximum (FWMH).
53. The emitter package of claim 47, wherein said emission profile is in the range of 130 to 160 degrees full width at half maximum (FWMH).
54. The emitter package of claim 47, wherein said emission profile is in the range of 130 to 150 degrees full width at half maximum (FWMH).
55. The emitter package of claim 47, wherein said emission profile is approximately 150 degrees full width half maximum (FWHM).
56. The emitter package of claim 47, emitting light with substantially the same efficiency as a similar package with an encapsulant not having planar surfaces.
57. The emitter package of claim 47, emitting light with variations in color temperature of less than \u2212300 to +300 Kelvin in a viewing angle range of approximately \u2212100 to +100 degrees.
58. The emitter package of claim 47, emitting light with variations in color temperature of less than \u2212400 to +400 Kelvin and in a viewing angle range of approximately \u2212100 to +100 degrees.
59. The emitter package of claim 47, emitting light with variations in color temperature of less than approximately \u2212200 to +200 Kelvin and in a viewing angle range of approximately \u2212100 to +100 degrees.
60. The emitter package of claim 47, further comprising a blanket conversion material on said submount and below said encapsulant.
61. An emitter package, comprising:
a solid state light source on a submount;
an encapsulant on said submount, said encapsulant having one or more planar surfaces,
a wavelength conversion material layer covering said solid state light source and the top surface of said submount;
wherein said submount has a footprint area of less than 12 mm square per 1 mm square light source area, wherein said encapsulant is cube shaped.
62. The emitter package of claim 61, wherein said solid state light source is selected from the group consisting of an LED and a laser.
63. The emitter package of claim 62, further comprising a blanket conversion material on said submount and below said encapsulant.
64. The emitter package of claim 62, wherein said footprint has an area of less than approximately 9 mm square per 1 mm square light source area.
65. The emitter package of claim 62, wherein said footprint has an area of less than approximately 6 mm square per 1 mm square light source area.
66. The emitter package of claim 62, wherein said footprint has an area of less than approximately 4 mm square per 1 mm square light source area.
67. The emitter package of claim 62, wherein said footprint has an area in the range of 1 to 4 mm square per 1 mm square light source area.
68. The emitter package of claim 62, wherein said footprint is approximately 2.56 mm square.
69. An emitter package, comprising:
one or more solid state light sources on a submount; and
an encapsulant on said submount, said encapsulant having one or more planar surfaces,
a wavelength conversion material layer covering said one or more solid state light sources and the top surface of said submount;
wherein the ratio of the footprint of said submount to the footprint of said one or more solid state light sources is in the range of just over 1 to approximately 20.
70. The emitter package of claim 69, wherein said one or more solid state light sources are selected from the group consisting of LEDs, lasers and a combination thereof.
71. The emitter package of claim 70, wherein said ratio is in the range of just over 1 to approximately 3.
72. The emitter package of claim 70, wherein said ratio is in the range of just over 1 to approximately 2.
73. The emitter package of claim 70, wherein said ratio is in the range of just over 1 to approximately 15.
74. The emitter package of claim 70, wherein said ratio is in the range of just over 1 to approximately 10.
75. The emitter package of claim 70, wherein said ratio is in the range of just over 1 to approximately 5.
76. An emitter package, comprising:
one or more solid state light sources on a submount; and
a transparent encapsulant on said submount, said encapsulant having one or more planar surfaces,
a wavelength conversion material layer covering said solid state light source and the top surface of said submount;
wherein said submount has a footprint ratio of approximately 1 by 1, with a corresponding height ratio in the range of approximately 0.5 to 5.
77. The emitter package of claim 76, wherein said one or more solid state light sources are selected from the group consisting of LEDs, lasers and a combination thereof.
78. The emitter package of claim 77, wherein said encapsulant has a height in the range of approximately 0.3 mm to 5 mm.
79. The emitter package of claim 77, emitting a wider emission pattern with higher encapsulants.
80. The emitter package of claim 77, wherein said footprint ratio is approximately 1 by 1, with a corresponding height ratio in the range of approximately 0.5 to 2.
81. The emitter package of claim 77, wherein said footprint ratio is approximately 1 by 1, with a corresponding height ratio in the range of approximately 0.5 to 1.5.
82. The emitter package of claim 77, wherein said footprint to height ratios are approximately of 1 by 1 by approximately 1.5 or greater.
83. The emitter package of claim 77, wherein said footprint to height ratios are approximately of 1 by 1 by approximately 2 or greater.
84. The emitter package of claim 77, wherein said footprint to height ratios are approximately of 1 by 1 by approximately 3 or greater.
85. The emitter package of claim 77, wherein said encapsulant has a height in the range of approximately 0.3 mm to 5 mm.
86. The emitter package of claim 77, wherein said encapsulant has a height in the range of approximately 0.3 mm to 2 mm.
87. A solid state luminaire, comprising:
a solid state light source with one or more light emitting diode (LED) packages, comprising:
an LED light source on a submount;
a blanket conversion material layer on said submount;
an encapsulant over said conversion material layer, said encapsulant having one or more planar surfaces, wherein said planar surfaces cause total internal reflection (TIR) of at least some light from said light source.
88. The luminaire of claim 87, comprising a light bulb.
89. The luminaire of claim 87, comprising a troffer.
90. The luminaire of claim 87, comprising a street lamp.
91. The luminaire of claim 87, wherein said encapsulant is cube shaped.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A planar integrated switching device comprising:
at least two CPW-slotline transition units each including an access configured to input andor output a transmission signal;
a slotline connecting said at least two CPW-slotline transition units; and
a switching element arranged on said slotline between said at least two CPW-slotline transition units and configured to switch the transmission signal over said slotline on and off under control of a switch control signal, wherein
said switching element is arranged at a position of said slotline where suppression of the transmission signal is maximum.
2. A planar integrated switching device as claimed in claim 1, wherein
said switching element is adapted for short-circuiting conductor plates of said slotline under control of said switch control signal.
3. A planar integrated switching device as claimed in claim 1, wherein
said switching element is formed by a MEMS switch, a diode or a transistor.
4. A planar integrated switching device as claimed in claim 1, wherein
said switching element is arranged at substantially the same distance from said at least two CPW-slotline transition units.
5. A planar integrated switching device as claimed in claim 1, wherein
the length of said slotline is an odd multiple of a quarter of the guided wavelength of said slotline.
6. A planar integrated switching device as claimed in claim 1, wherein
said switching element is arranged at one quarter wavelength distance on said slotline from the intersection of said slotline and CPW.
7. A planar integrated switching device as claimed in claim 1, further comprising:
at least two switching elements arranged on said slotline between said at least two CPW-slotline transition units.
8. A planar integrated switching device as claimed in claim 1, further comprising:
at least three CPW-slotline transition units, where each CPW-slotline transition unit is connected to at least one other CPW-slotline transition unit through a slotline.
9. A planar integrated switching device as claimed in claim 8, wherein
at least one switching element is arranged on each slotline.
10. A planar integrated switching device as claimed in claim 1, wherein
each CPW-slotline transition unit comprises a CPW, and
said slotline crosses the CPW at a right angle and extends beyond said CPW.
11. A planar integrated switching device as claimed in claim 10, wherein
said slotline ends in a slotline stub beyond said CPW, said slotline stub being employed as an open circuit.
12. A planar integrated switching device as claimed in claim 10, wherein
said slotline ends in a slotline stub beyond said CPW, said slotline stub being employed as a radial stub.
13. A device for the transmission of microwave signals comprising:
one or more signal input terminals;
one or more signal output terminals;
a planar integrated switching device as claimed in claim 1 for providing switchable connections between said one or more signal input terminals and said one or more signal output terminals; and
a switch control unit for generating a switch control signal for control of said planar integrated switching device.
14. A device as claimed in claim 13, wherein
said device comprises at least one antenna, each antenna being connected to a single one of said terminals.
15. A planar integrated switching device comprising:
at least two CPW-slotline transition units each including an access configured to input andor output a transmission signal;
a slotline connecting said at least two CPW-slotline transition units; and
a switching element arranged on said slotline between said at least two CPW-slotline transition units and configured to switch the transmission signal over said slotline on and off under control of a switch control signal, wherein
each CPW-slotline transition unit comprises a CPW,
said slotline crosses the CPW at a right angle and extends beyond said CPW, and
said CPW extends beyond said slotline and ends in a CPW stub beyond said slotline, said CPW stub being employed as a short circuit and having a length of a natural multiple of a half guided wavelength of said CPW.
16. A planar integrated switching device comprising:
at least two CPW-slotline transition units each including an access configured to input andor output a transmission signal;
a slotline connecting said at least two CPW-slotline transition units; and
a switching element arranged on said slotline between said at least two CPW-slotline transition units and configured to switch the transmission signal over said slotline on and off under control of a switch control signal, wherein
each CPW-slotline transition unit comprises a CPW,
said slotline crosses the CPW at a right angle and extends beyond said CPW, and
said CPW extends beyond said slotline and ends in a CPW stub beyond said slotline, said CPW stub being employed as an open circuit and having a length of an odd multiple of a quarter guided wavelength of said CPW.
17. A planar integrated switching device comprising:
at least two CPW-slotline transition units each including an access configured to input andor output a transmission signal;
a slotline connecting said at least two CPW-slotline transition units; and
a switching element arranged on said slotline between said at least two CPW-slotline transition units and configured to switch the transmission signal over said slotline on and off under control of a switch control signal, wherein
each CPW-slotline transition unit comprises a CPW,
said slotline crosses the CPW at a right angle and extends beyond said CPW, and
said CPW extends beyond said slotline and ends in a CPW stub beyond said slotline, said CPW stub being employed as a radial stub.
18. A planar integrated switching device comprising:
at least two CPW-slotline transition units each including an access configured to input andor output a transmission signal;
a slotline connecting said at least two CPW-slotline transition units; and
a switching element arranged on said slotline between said at least two CPW-slotline transition units and configured to switch the transmission signal over said slotline on and off under control of a switch control signal, wherein
each CPW-slotline transition unit comprises a CPW,
said slotline crosses the CPW at a right angle and extends beyond said CPW, and
said slotline ends in a slotline stub beyond said CPW, said slotline stub being employed as a short circuit and having a length of an odd multiple of a quarter guided wavelength of said slotline.
19. A planar integrated switching device comprising:
at least two CPW-slotline transition means each including an access for inputting andor outputting a transmission signal,
a slotline means connecting said at least two CPW-slotline transition units, and
a switching means arranged on said slotline between said at least two CPW-slotline transition units for switching the transmission signal over said slotline on and off under control of a switch control signal, wherein
said switching means is arranged at a position of said slotline means where suppression of the transmission signal is maximum.