1. A structure of package on package comprising:
a first package comprising a first substrate and a first chip disposed thereon;
a second package comprising a second substrate and a second chip disposed thereon, the second package disposed under the first package, the second substrate having a plurality of holes; and
a plurality of pins disposed on the first package and inserted in the holes for electrically connecting the first package and the second package.
2. The structure of package on package according to claim 1, wherein the second package further comprises a plurality of conductive receptacles disposed in the holes of the second substrate;
wherein the pins are inserted in the conductive receptacles.
3. The structure of package on package according to claim 1, wherein the second package further comprises:
a second inner circuit formed in the second substrate, wherein the second chip is electrically connected with the second inner circuit;
a second molding material encapsulating at least a portion of the second substrate and the second chip; and
a plurality of solder balls disposed on a lower surface of the second substrate;
wherein the holes are formed on an upper surface of the second substrate and expose the second inner circuit.
4. The structure of package on package according to claim 1, wherein the first package further comprises:
a first inner circuit formed in the first substrate and electrically connected to the first chip; and
a first molding material encapsulating at least a portion of the first substrate and the first chip;
wherein the pins are disposed on a lower surface of the first substrate and electrically connected with the first inner circuit.
5. A structure of package on package comprising:
a first package comprising a first substrate and a first chip disposed thereon;
a second package comprising a second substrate and a second chip disposed thereon, the second package disposed under the first package;
a plurality of first pins disposed on the first package;
a plurality of second pins disposed on the second package; and
a connecting component interposed between the first pins and the second pins for electrically connecting the first package and the second package.
6. The structure of package on package according to claim 5, wherein the connecting component comprises:
a first clamp for clamping the first pins;
a second clamp for clamping the second pins; and
a conductive part disposed between the first clamp and the second clamp for electrically connecting the second pins clamped by the second clamp and the first pins clamped by the first clamp.
7. The structure of package on package according to claim 5, wherein the first package further comprises:
a first inner circuit formed in the first substrate and electrically connected to the first chip; and
a first molding material encapsulating at least a portion of the first substrate and the first chip;
wherein the first pins are disposed on a lower surface of the first substrate and electrically connected with the first inner circuit.
8. The structure of package on package according to claim 5, wherein the second package further comprises:
a second inner circuit formed in the second substrate and electrically connected to the second chip;
a second molding material encapsulating at least a portion of the second substrate and the second chip; and
a plurality of solder balls disposed on a lower surface of the first substrate;
wherein the second pins are disposed on an upper surface of the second substrate and electrically connected with the second inner circuit.
9. A method for fabricating a package on package, the method comprising:
providing a first package, in which a first chip is disposed on and electrically connected to a first substrate;
providing a second package, in which a second chip is disposed on and electrically connected to a second substrate;
disposing a plurality of first pins on the first substrate;
disposing a plurality of second pins on the second substrate;
disposing a connecting component to hold the second pins; and
correspondingly inserting the first pins in the connecting component so as to electrically connect the first package with the second package.
10. The method according to claim 9, wherein the step of providing the first package further comprises:
forming a first inner circuit in the first substrate;
wherein the first pins are electrically connected with the first inner circuit and disposed on a lower surface of the first substrate.
11. The method according to claim 9, wherein the step of providing the first package further comprises:
over molding at least a portion of the first substrate and the first chip by a first molding material.
12. The method according to claim 9, wherein the step of providing the second package further comprises:
forming a second inner circuit in the second substrate;
wherein the second pins are formed on an upper surface of the second substrate, and electrically connected with the second inner circuit.
13. The method according to claim 9, wherein the step of providing the second package further comprises:
over molding at least a portion of the second substrate and the second chip by a second molding material.
14. A method for fabricating a package on package, the method comprising:
providing a first package, in which a first chip is disposed on and electrically connected to a first substrate;
providing a second package, in which a second chip is disposed on and electrically connected to a second substrate;
disposing a plurality of pins on the first substrate;
forming a plurality of holes in the second substrate; and
inserting the pins in the holes for electrically connecting the first package and the second package.
15. The method according to claim 14 further comprising:
forming a second inner circuit in the second substrate, wherein the holes expose the second inner circuit;
forming a plurality of conductive receptacles in the holes; and
inserting the pins in the conductive receptacles;
wherein the pins are electrically connected with the second inner circuit when the pins are inserted in the conductive receptacles.
16. The method according to claim 14, wherein the step of providing the second package further comprises:
over molding at least a portion of the second substrate and the second chips by a second molding material.
17. The method according to claim 14, wherein the step of providing the first package further comprises:
forming a first inner circuit in the first substrate;
wherein the pins are electrically connected with the first inner circuit and disposed on a lower surface of the first substrate.
18. The method according to claim 14, wherein the step of providing the first package further comprises:
over molding at least a portion of the first substrate and the first chip by a first molding material.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A polymeric structure derived from a hydroxyl polymer-containing composition comprising:
a. an aqueous mixture comprising a hydroxyl polymer; and
b. a hydrophile component comprising an organosulfosuccinate.
2. The polymeric structure according to claim 1 wherein the hydroxyl polymer-containing composition further comprises a crosslinking system comprising a crosslinking agent.
3. The polymeric structure according to claim 1 wherein the hydroxyl polymer-containing composition further comprises a lipophile component.
4. The polymeric structure according to claim 3 wherein the hydrophile component facilitates dispersibility of the lipophile component in the aqueous mixture.
5. The polymeric structure according to claim 1 wherein the polymeric structure exhibits a contact angle of less than about 40\xb0 after 1 second.
6. The polymeric structure according to claim 1 wherein the polymeric structure is in the form of a fiber having a diameter of less than about 50 \u03bcm.
7. The polymeric structure according to claim 1 wherein the hydroxyl polymer comprises a hydroxyl polymer selected from the group consisting of: starch, starch derivatives, cellulose derivatives, chitosan, chitosan derivatives, polyvinylalcohols, gums, arabinans, galactans, proteins and mixtures thereof.
8. The polymeric structure according to claim 7 wherein the hydroxyl polymer comprises starch.
9. A fibrous structure comprising one or more polymeric structures according to claim 1 wherein at least one of the polymeric structures is in the form of a fiber form.
10. A single- or multi-ply sanitary tissue product comprising a fibrous structure according to claim 9.
11. The single- or multi-ply sanitary tissue product according to claim 10 wherein the tissue product exhibits a wet yield stress of from about 1000 to about 6000 Pa at a strain of at least about 1 to about 10.
12. The single- or multi-ply sanitary tissue product according to claim 10 wherein the tissue product exhibits a wet bulk of at least about 40% of the dry bulk.
13. A method for making the polymeric structure according to claim 1 comprising the steps of:
a. providing a hydroxyl polymer-containing composition comprising an aqueous mixture comprising a hydroxyl polymer and a hydrophile component comprising a sulfosuccinate; and
b. polymer processing the hydroxyl polymer-containing composition to form the polymeric structure.
14. The method according to claim 13 wherein the aqueous mixture further comprises a crosslinking system comprising a crosslinking agent.
15. The method according to claim 13 wherein the sulfosuccinate comprises an organosulfosuccinate.
16. A polymeric structure in the form of a fiber produced according to the method of claim 13.