1. A cosmetic case, comprising:
a case body,
an associated lid opening and closing the case body;
an exchangeable cover replaceably attached to either the lid or the case body to cover the lid or the case body, the exchangeable cover being configured to be slidable in a direction substantially parallel to a top surface of either the lid or the case body;
a slide engagement member provided cooperatively between either the lid or the case body and the exchangeable cover to permit the exchangeable cover to slide into an attaching position where the exchangeable cover is detachably attached to either the lid or the case body;
a fastening member provided cooperatively between either the lid or the case body and the exchangeable cover to permit either the lid or the case body to hold and release the exchangeable cover along its sliding direction; and
a dent provided adjacent to the slide engagement member for permitting the exchangeable cover to detach from the lid or the case body,
wherein the slide engagement member has a concave portion provided in either the exchangeable cover or one of the lid or the case body along a sliding direction of the cover, and a convex portion provided in either the lid or the case body or the exchangeable cover and configured to slidably fit in the concave portion,
wherein the fastening member is a detachable projection elastically deformable in the concave portion and detachably mated with the convex portion, and
wherein the concave and convex portions are provided in positions as desired along the sliding direction of the exchangeable cover, and the concave portion has the dent configured to detachably fit in the convex portion.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An electronic device comprising:
an electronic component;
a metal substrate having a recess which is large enough to fully receive the electronic component and which is defined by a metal outer frame and a metal bottom plate; and
a wiring board having a surface area larger than the area of the opening of the recess and having a wiring pattern formed on the top surface thereof,
at least a portion of the surface of the wiring board being fixed to the bottom surface of the metal substrate, and
the electronic component being mechanically fixed to the bottom of the recess while being electrically connected to the wiring pattern,
wherein the metal substrate comprises a window that is opened from the bottom of the recess through to the bottom surface thereof, wherein the wiring board is fixed to the bottom surface of the metal substrate so that a portion of the wiring pattern is exposed in the recess through the window, and wherein the electronic component is electrically connected to the wiring pattern exposed in the recess through the window using a bonding wire.
2. An electronic device as claimed in claim 1, wherein the wiring board comprises another wiring pattern on the bottom surface thereof, and wherein the wiring pattern on the top surface of the wiring board is electrically connected to the wiring pattern on the bottom surface of the wiring board via a contact formed through the wiring board.
3. An electronic device as claimed in claim 1, further comprising a metal lid fixed to close the opening of the recess.
4. An electronic device as claimed in claim 1, wherein the wiring board is fixed to the top surface of the metal substrate in a manner such that the wiring board closes the opening of the recess, and wherein the electronic component is connected to the wiring pattern using flipchip bonding.
5. An electronic device as claimed in claim 1, wherein the wiring board is fixed to the metal substrate using one of diffusion bonding and fusion boding, in which a surface treatment film made of gold, silver, tin, or a combination thereof is formed on each of a surface area of the wiring pattern and a surface area of the metal substrate to be bonded together and the surface treatment film of the wiring pattern and the surface treatment film of the metal substrate are forced into contact under a predetermined condition.
6. An electronic device as claimed in claim 1, wherein the full bottom surface of said electronic component is in contact to define said recess.
7. An electronic device as claimed in claim 1, wherein said metal substrate has a metal plate attached to said electronic component.
8. An electronic device as claimed in claim 4, wherein the metal substrate comprises a main substrate portion having a through hole that is opened from the top surface to the bottom surface, and a metal lid that closes the opening of the through hole on one side of the through hole to produce the recess from the through hole.
9. An electronic device as claimed in claim 7, wherein said metal plate fully covers the bottom surface of said electronic component.
10. An electronic device as claimed in claim 7, wherein said metal plate is wider than said electronic component.