1. A method for skiving a first work piece and a second work piece having rotationally-symmetric, periodic structures utilizing a skiving tool, the method comprising the following steps:
moving a skiving tool into a first relative position in relation to a first work piece,
executing a first skiving machining action of the first work piece, wherein one of (i) all right flanks and (ii) all left flanks of the periodic structure of the first work piece are finish machined, and the other of the all right flanks and the all left flanks are premachined,
moving the skiving tool into a second relative position in relation to the first work piece,
executing a second skiving machining action of the first work piece, wherein the flanks premachined during the first skiving machining action are finish machined,
moving the skiving tool into a third relative position in relation to a second work piece,
executing a third skiving machining action of the second work piece, wherein one of (i) all right flanks and (ii) all left flanks of the periodic structure of the second work piece that are opposite to the one of the all right flanks and all left flanks finish machined during the first skiving action, are finish machined, and the other of the all right flanks and all left flanks of the second work piece are premachined,
moving the skiving tool into a fourth relative position in relation to the second work piece, and
executing a fourth skiving machining action of the second work piece, wherein the flanks premachined during the third skiving machining action are finish machined.
2. A method according to claim 1, wherein the first and second skiving machining actions of the first work piece comprise the following steps:
rotating the skiving tool about a first rotational axis,
coupledly rotating the first work piece about a second rotational axis, and
executing an axial feed movement of the skiving tool relative to the first work piece in a direction parallel to the second rotational axis.
3. A method according to claim 1, wherein the third and fourth skiving machining actions of the second work piece comprise the following steps:
rotating the skiving tool around a first rotational axis,
coupledly rotating the second work piece around a second rotational axis, and
executing an axial feed movement of the skiving tool relative to the second work piece in a direction parallel to the second rotational axis.
4. A method according to claim 1, wherein the skiving tool comprises multiple cutting teeth, each comprising a first flank cutting edge for cutting right flanks of a work piece, a second flank cutting edge for cutting left flanks of a work piece, and a head cutting edge, which lies in a transition region between the first flank cutting edge and the second flank cutting edge.
5. A method according to claim 4, including performing the skiving machining actions wherein the total number of cuts executed with the first flank cutting edges during the skiving machining actions of the first work piece and the second work piece are approximately equal to the total number of cuts executed with the second flank cutting edges during the skiving machining actions of the first work piece and the second work piece.
6. A method according to claim 4, wherein the first and second work pieces define gaps to be finished, and the head cutting edges define widths that are smaller than a respective width at a base of the gaps.
7. A method according to claim 6, wherein the widths of the head cutting edges define widths that are less than or equal to approximately \u2154 of the respective width at the base of the gaps.
8. A method according to claim 1, wherein at least two of the first, second, third and fourth relative positions differ from one another with respect to an angle of rotation of the first work piece or the second work piece relative thereto.
9. A method according to claim 1, wherein the second relative position of the skiving tool with respect to the first work piece corresponds to the third relative position of the skiving tool with respect to the second work piece and the first relative position of the skiving tool with respect to the first work piece corresponds to the fourth relative position of the skiving tool with respect to the second work piece.
10. A method accord to claim 1, including executing the skiving machining actions on soft or unhardened work pieces.
11. A machine having a CNC controller, programmed and adapted to execute the following steps:
moving a skiving tool into a first relative position in relation to a first work piece,
executing a first skiving machining action of the first work piece, wherein one of (i) all right flanks and (ii) all left flanks of the periodic structure of the first work piece are finish machined, and the other of the all right flanks and the all left flanks are premachined,
moving the skiving tool into a second relative position in relation to the first work piece,
executing a second skiving machining action of the first work piece, wherein the flanks premachined during the first skiving machining action are finish machined,
moving the skiving tool into a third relative position in relation to a second work piece,
executing a third skiving machining action of the second work piece, wherein one of (i) all right flanks and (ii) all left flanks of the periodic structure of the second work piece that are opposite to the one of the all right flanks and all left flanks finish machined during the first skiving action, are finish machined, and the other of the all right flanks and all left flanks of the second work piece are premachined,
moving the skiving tool into a fourth relative position in relation to the second work piece, and
executing a fourth skiving machining action of the second work piece, wherein the flanks premachined during the third skiving machining action are finish machined.
12. A machine according to claim 11, further comprising a software module programmed and adapted to execute predefined alternating semi-completing skiving to effect substantially uniform cutting load of cutting edges of the skiving tool.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. An electron beam exposure apparatus for exposing a wafer with a plurality of electron beams, comprising a multi-axis that comprises:
a plurality of magnetic conductive member arranged to be substantially parallel to each other, said magnetic conductive members having a plurality of openings; and
a non-magnetic conductive member provided between said plurality of magnetic conductive members, said non-magnetic conductive member having a plurality of through holes,
wherein said plurality of openings of said magnetic conductive members and said plurality of through holes of said non-magnetic conductive members forming together a plurality of lens openings operable to converge said plurality of electron beams independently of each other, by allowing said plurality of electron beams to pass therethrough, respectively.
2. An electron beam exposure apparatus as claimed in claim 1, wherein said multi-axis electron lens further includes a coil part having a coil provided in an area surrounding said magnetic conductive members for generating a magnetic field and a coil magnetic conductive member provided in an area surrounding said coil.
3. An electron beam exposure apparatus as claimed in claim 2, wherein said coil magnetic conductive member is formed from a material having a different magnetic permeability from that of a material for said plurality of magnetic conductive members.
4. An electron beam exposure apparatus as claimed in claim 1, further comprising:
a plurality of electron guns operable to generate said plurality of electron beams; and
a voltage controller, electrically connected to said plurality of electron guns, operable to apply different voltages to said plurality of electron guns.
5. An electron beam exposure apparatus as claimed in claim 4, wherein said voltage controller includes a means operable to apply said different voltages to said plurality of electron guns depending on magnetic filed intensities applied to said plurality of electron guns by said multi-axis electron lens.
6. An electron beam exposure apparatus as claimed in claim 4, wherein said voltage controller includes a means operable to apply said different voltages to said plurality of electron guns in such a manner that sides of cross sections of said plurality of electron beams are substantially parallel to each other.
7. An electron beam exposure apparatus as claimed in claim 4, wherein said voltage controller includes a means operable to apply said different voltages to said plurality of electron guns in such a manner that positions of focal points of said plurality of electron beams are substantially the same.
8. An electron beam exposure apparatus as claimed in claim 4, wherein said voltage controller includes:
a voltage generator operable to generate a predetermined voltage; and
a means operable to increase or reduce said predetermined voltage to apply said different voltages to said plurality of electron guns.
9. An electron beam exposure apparatus as claimed in claim 1, further comprising a further multi-axis electron lens operable to reduce cross sections of said electron beams.
10. An electron beam exposure apparatus as claimed in claim 1, further comprising an electron beam shaping unit that comprises:
a first shaping member having a plurality of first shaping openings operable to shape said plurality of electron beams;
a first shaping-deflecting unit operable to deflect said plurality of electron beams after passing through said first shaping member, independently of each other; and
a second shaping member having a plurality of second shaping openings operable to shape said plurality of electron beams after passing through said first shaping-deflecting unit to have desired shapes.
11. An electron beam exposure apparatus as claimed in claim 10, wherein said electron beam shaping unit further includes a second shaping-deflecting unit operable to deflect said plurality of electron beams deflected by said first shaping-deflecting unit independently of each other toward a direction substantially perpendicular to a surface of said wafer onto which said electron beams are incident,
wherein said electron beam shaping unit allows said plurality of electron beams deflected by said second shaping-deflecting unit to pass through said second shaping member so as to shape said electron beams to have said desired shapes.
12. An electron beam exposure apparatus as claimed in claim 11, wherein said second shaping member includes a plurality of shaping-member illumination areas onto which said electron beams deflected by the second shaping-deflecting unit are incident, and
said second shaping member includes said second shaping openings and other openings having different sizes from sizes of said second shaping openings in said shaping-member illumination area.
13. An electron beam exposure apparatus as claimed in claim 10, further comprising:
a plurality of electron guns operable to generate said plurality of electron beams; and
a further multi-axis electron lens operable to converge said plurality of electron beams generated by said plurality of electron guns to make said converged electron beams incident on said first shaping member,
wherein said first shaping member divides said electron beams after passing through said further multi-axis electron lens.
14. An electron beam exposure apparatus as claimed in claim 1, wherein a plurality of multi-axis electron lenses each having said plurality of magnetic conductive members and said non-magnetic conductive member are provided.
15. An electron lens for converging a plurality of electron beams independently of each other, comprising:
a plurality of magnetic conductive members arranged to be substantially parallel to each other, said magnetic conductive members having a plurality of openings; and
a non-magnetic conductive member provided between said plurality of magnetic conductive members, said non-magnetic conductive member having a plurality of through holes,
wherein said plurality of openings of said magnetic conductive members and said through holes of said non-magnetic conductive member form together a plurality of lens openings allowing said plurality of electron beams to pass therethrough, respectively, to converge said electron beams independently of each other.
16. A fabrication method of a semiconductor device on a wafer, comprising:
performing focus adjustments for said plurality of electron beams independently of each other by using a multi-axis electron lens including a plurality of magnetic conductive members arranged to be substantially parallel to each other, said magnetic conductive members having a plurality of openings that form a plurality of lens openings allowing said plurality of electron beams to pass therethrough, respectively; and
exposing a pattern onto said wafer by illuminating said wafer with said plurality of electron beams.