1. A tire monitoring system comprising:
a vehicle body side controller able to transmit a wireless signal to each tire through a vehicle body side antenna arranged near each tire in a vehicle in which tires are mounted on both transversal sides orthogonal to a running direction so as to form a pair; and
a sensor unit arranged in each tire and measuring a state of each tire and able to transmit information based on its measuring result as a wireless signal,
wherein said vehicle body side controller respectively transmits a request signal to each sensor unit through each vehicle body side antenna, and the tire monitoring system has each sensor unit able to receive this request signal through a tire side antenna arranged in each tire;
said vehicle body side antenna and the tire side antenna are constructed by a coil antenna;
said tire side antenna is arranged in each tire such that a coil axis of said tire side antenna approximately becomes parallel to a rotating axis of each tire; and
said vehicle body side antenna is arranged near each tire such that no coil axis of said vehicle body side antenna becomes parallel to the rotating axis of each tire.
2. The tire monitoring system according to claim 1, wherein said vehicle body side antenna is arranged above each tire so as to incline the coil axis of said vehicle body side antenna with respect to the rotating axis of each tire; and
an inclination direction of the coil axis of said vehicle body side antenna is set so as to incline the coil axis of said vehicle body side antenna on a transversal outside of the vehicle toward a downward direction.
3. The tire monitoring system according to claim 1, wherein a central position of said vehicle body side antenna is arranged outside a central position of said tire side antenna in a transversal direction of the vehicle.
4. The tire monitoring system according to claim 2, wherein a central position of said vehicle body side antenna is arranged outside a central position of said tire side antenna in a transversal direction of the vehicle.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A sample inspection apparatus comprising:
a sample stage to hold a wafer to be inspected,
an electron optical system to direct electrons to the sample,
a power source connected to the sample stage,
an image detector that detects the reflected electrons, and
an image processor that inspects the sample based on image signal from the image detector,
wherein said power source applies a potential to the sample stage so that the directed electrons are substantially reflected before the directed electrons reach a surface of the sample.
2. A sample inspection apparatus, according to claim 1, wherein,
said electron optical system directs electrons to an area of the sample.
3. A sample inspection apparatus, according to claim 1, wherein, said image detector is comprised of TDI sensor.
4. A sample inspection apparatus, according to claim 1, said electron optical system further comprising:
a Schottky electron source.
5. A sample inspection apparatus comprising:
means for holding a sample to be inspected,
means for directing electrons to the sample,
means for reflecting the electrons directed to the sample before the electrons reach a surface of the sample,
means for detecting at least the reflected electrons,
and
means for inspecting the sample based on output signal from the means for detecting.
6. A sample inspection apparatus comprising:
an electron optic system to direct electrons to an area of a sample to be inspected,
a power source to apply a predetermined voltage to the sample to be inspected, and
an image detector to detect an image of the reflected electrons from the sample,
a signal processor,
wherein the directed electrons are substantially reflected just before reaching a surface of the sample, and
said signal processor analyzes the image signal to detect a defect in the sample.
7. A sample inspection apparatus comprising:
a sample stage to hold a wafer to be inspected,
an electron optical system to direct electrons to the sample,
a power source that gives a potential to the sample,
an image detector that detects an image due to the electrons reflected from the sample before the directed electrons reach a surface of the sample,
an image signal processor that inspects the sample by comparing image signals obtained in the image detector.
8. A sample inspection apparatus comprising:
a sample stage to hold a wafer to be inspected,
an electron optical system to direct electrons to the sample,
a power source that gives a potential to the sample,
an image detector that creates an image signal based on detection of least electrons which are reflected from the sample before the directed electrons reach a surface of the sample, and
a signal processor that inspects the sample based on the output of the image detector.
9. A sample inspection apparatus comprising:
means for holding a sample to be inspected,
means for decelerating a directed electron beam before the sample,
means for detecting the reflected electrons turned before impinging on the sample,
means for creating an image attributed to the reflected electrons, and
means for inspecting the sample by comparing obtained images.