1-46. (canceled)
47. A lighting device comprising:
a substrate having a first opening in a center of the substrate;
a first electrode layer over the substrate;
a conductive layer over the substrate;
an EL layer over the first electrode layer;
a second electrode layer over the EL layer and electrically connected to the conductive layer;
an insulating film covering the substrate, the first electrode layer, the EL layer, and the second electrode layer, and having a second opening in the center of the substrate; and
a first connecting portion and a second connecting portion over the substrate and in the second opening,
wherein the first connecting portion is formed by the first electrode layer led to the second opening, and
wherein the second connecting portion is formed by the conductive layer provided in the second opening.
48. The lighting device according to claim 47, wherein the first electrode layer and the conductive layer are made of the same material.
49. The lighting device according to claim 47, wherein the substrate has a round shape.
50. The lighting device according to claim 49, wherein the substrate has a diameter of 10 cm to 14 cm.
51. The lighting device according to claim 47, wherein a plurality of the first connecting portions and a plurality of the second connecting portions are provided in the second opening.
52. The lighting device according to claim 47, wherein a base insulating film is provided between the substrate and the first electrode layer.
53. The lighting device according to claim 47, wherein a desiccant layer is provided between the second electrode layer and the insulating film.
54. The lighting device according to claim 47, wherein the EL layer includes a plurality of light-emitting layers.
55. A lighting device comprising:
a substrate having a first opening in a center of the substrate;
a first electrode layer over the substrate, the first electrode layer having a second opening which overlaps the first opening;
an EL layer over the first electrode layer;
a second electrode layer over the EL layer, the second electrode layer having a third opening which overlaps the first opening;
a conductive layer electrically connected to a part of an edge of the second opening; and
an insulating film covering the substrate, the first electrode layer, the EL layer, and the second electrode layer, and having a fourth opening in the center of the substrate,
wherein the conductive layer is provided in the fourth opening, and
wherein a part of the second electrode layer extends beyond an edge of the fourth opening.
56. The lighting device according to claim 55, wherein the second electrode layer and the conductive layer are made of the same material.
57. The lighting device according to claim 55, wherein the substrate has a round shape.
58. The lighting device according to claim 57, wherein the substrate has a diameter of 10 cm to 14 cm.
59. The lighting device according to claim 55, wherein a plurality of the conductive layers and a plurality of the parts of the second electrode layer are provided in the fourth opening.
60. The lighting device according to claim 55, wherein a base insulating film is provided between the substrate and the first electrode layer.
61. The lighting device according to claim 55, wherein a desiccant layer is provided between the second electrode layer and the insulating film.
62. The lighting device according to claim 55, wherein the EL layer includes a plurality of light-emitting layers.
63. A lighting device comprising:
a substrate having a first opening in a center of the substrate;
a first electrode layer over the substrate, the first electrode layer having a second opening which overlaps the first opening;
a conductive layer provided over the substrate;
an EL layer over the first electrode layer;
a second electrode layer over the EL layer, the second electrode layer having a third opening which overlaps the first opening; and
an insulating film covering the substrate, the first electrode layer, the EL layer, and the second electrode layer, and having a fourth opening in the center of the substrate,
wherein the conductive layer is electrically connected to a part of an edge of the third opening and provided in the fourth opening, and
wherein a part of the first electrode layer extends beyond an edge of the fourth opening.
64. The lighting device according to claim 63, wherein the first electrode layer and the conductive layer are made of the same material.
65. The lighting device according to claim 63, wherein the substrate has a round shape.
66. The lighting device according to claim 65, wherein the substrate has a diameter of 10 cm to 14 cm.
67. The lighting device according to claim 63, wherein a plurality of the parts of the second electrode layer and a plurality of the conductive layers are provided in the fourth opening.
68. The lighting device according to claim 63, wherein a base insulating film is provided between the substrate and the first electrode layer.
69. The lighting device according to claim 63, wherein a desiccant layer is provided between the second electrode layer and the insulating film.
70. The lighting device according to claim 80, wherein the EL layer includes a plurality of light-emitting layers.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of manufacturing a printed circuit board for fine circuit formation, comprising:
providing a printing circuit board, including a dielectric layer having a negative pattern for circuit formation containing a via hole and a line, formed on at least one surface thereof;
forming a metal layer on the dielectric layer such that the metal layer is formed excessively thick on the dielectric layer when loaded into the negative pattern of the dielectric layer;
removing a part of the metal layer formed on the dielectric layer through mechanical polishing until the metal layer formed on the dielectric layer has a thickness of 0.1\u02dc20 \u03bcm; and
removing the remaining metal layer formed on the dielectric layer through chemical etching, thus forming a circuit.
2. The method as set forth in claim 1, wherein the chemical etching is performed at an etching speed of 0.1\u02dc20 \u03bcmmin.
3. The method as set forth in claim 1, wherein the mechanical polishing is performed using buffing, sand belt polishing, polishing, or combinations thereof.
4. The method as set forth in claim 1, wherein the negative pattern of the dielectric layer is formed through an imprinting process.
5. The method as set forth in claim 1, wherein the negative pattern of the dielectric layer has a pitch ranging from 20 nm to 200 \u03bcm.
6. The method as set forth in claim 1, wherein the metal layer is formed through electroless metal plating and metal electroplating.
7. The method as set forth in claim 1, wherein the metal layer comprises a conductive metal selected from the group consisting of gold, silver, nickel; aluminum, copper, and alloys thereof.