1. A method for transforming pre-existing sales data into an electronic display to be displayed on at least one video monitor, said method comprising the steps of:
a. a service provider acquiring sales data from a subscriber’s database;
b. storing the acquired sales data on the service provider’s database;
c. transforming the acquired sales data into an electronic display resembling a conventional sales tracking white board;
d. transmitting the graphical display to at least one video monitor located at the subscriber’s place of business; and
e. displaying the graphical display on at least one video monitor.
2. The method of claim 1 wherein:
said sales data is acquired from an accounting database.
3. The method of claim 1 further comprising the steps prior to step b of:
said sales data being stored in text files;
said text files being transferred to the service provider from the subscriber’s database via posting to and retrieving from an FTP server; and
said text files being opened by the service provider.
4. The method of claim 1 wherein:
said graphical display is saved as a web page on the service provider’s web server; and
said web pages are displayed on the at least one video monitor via the Internet.
5. The method of claim 4 wherein:
said graphical display has a predetermined life cycle.
6. The method of claim 5 further comprising the steps of:
said predetermined life cycle expiring;
a new graphical display being created using current sales data acquired from the subscriber;
the new graphical display being transmitted to the at least one video monitor located at the subscriber’s place of business; and
displaying the graphical display on the at least one video monitor.
7. The method of claim 1 wherein said sales data further comprises:
inventory information.
8. The method of claim 1 wherein said sales data further comprises:
salesperson information.
9. The method of claim 1 wherein said sales data further comprises:
product information.
10. The method of claim 1 wherein said sales data further comprises:
sales information.
11. The method of claim 1 wherein said graphical display further comprises:
identifying information for at least one sales person.
12. The method of claim 11 wherein said graphical display further comprises:
a month to date sales total for the at least one sales person.
13. The method of claim 11 wherein said graphical display further comprises:
a year to date sales total for the at least one sales person.
14. The method of claim 11 wherein said graphical display further comprises:
an average sales total for a predetermined amount of time for the at least one sales person.
15. The method of claim 11 wherein said graphical display further comprises:
a customer satisfaction index score for the at least one sales person.
16. The method of claim 11 wherein said graphical display further comprises:
an icon for each sale the at least one salesperson made during a predetermined period of time located near the at least one salesperson’s identifying information.
17. The method of claim 16 wherein:
said icon contains information regarding a product sold during the sale the icon represents.
18. A system for transforming pre-existing sales data into an electronic display to be displayed on at least one video monitor, said comprising:
a service provider acquiring sales data from a subscriber’s database;
storing the acquired sales data on the service provider’s database;
transforming the acquired sales data into an electronic display resembling a conventional sales tracking whiteboard;
transmitting the graphical display to at least one video monitor located at the subscriber’s place of business; and
displaying the graphical display on the at least one video monitor.
19. The system of claim 18 wherein:
said sales data is acquired from an accounting database.
20. The system of claim 18 further comprising:
said sales data sales data being stored in text files;
said text files being transferred to the service provider from the subscriber’s database; and
said text files being opened by the service provider.
21. The system of claim 18 wherein:
said graphical display is saved as a web page on the service provider’s web server; and
said web pages are displayed on the at least one video monitor via the Internet.
22. The system of claim 21 wherein:
said graphical display has a predetermined life cycle.
23. The system of claim 22 further comprising:
said predetermined life cycle expiring;
a new graphical display being created using current sales data acquired from the subscriber;
the new graphical display being transmitted to the at least one video monitor located at the subscriber’s place of business; and
displaying the graphical display on the at least one video monitor.
24. The system of claim 18 wherein said sales data further comprises:
inventory information.
25. The system of claim 18 wherein said sales data further comprises:
salesperson information.
26. The system of claim 18 wherein said sales data further comprises:
product information.
27. The system of claim 18 wherein said sales data further comprises:
sales information.
28. The system of claim 18 wherein said graphical display further comprises:
identifying information for at least one sales person.
29. The system of claim 18 wherein said graphical display further comprises:
a month to date sales total for the at least one sales person.
30. The system of claim 18 wherein said graphical display further comprises:
a year to date sales total for the at least one sales person.
31. The system of claim 18 wherein said graphical display further comprises:
an average sales total for a predetermined amount of time for the at least one sales person.
32. The system of claim 18 wherein said graphical display further comprises:
a customer satisfaction index score for the at least one sales person.
33. The system of claim 18 wherein said graphical display further comprises:
an icon for each sale the at least one salesperson made during a predetermined period of time located near the at least one salesperson’s identifying information.
34. The system of claim 16 wherein:
said icon contains information regarding a product sold during the sale the icon represents.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An apparatus configured for releasing a thermal stress within a semiconductor chip, comprising:
a first means comprising a semiconductor chip;
a second means for framing the first means; and
a third means for connecting the first and second means, the third means comprising a diffusion solder layer and a buffer layer, the buffer layer comprising a material, which is ductile and soft in comparison to a material of the diffusion solder layer,
wherein the third means is arranged between the first means and the second means, and wherein the buffer layer comprises a layer thickness that is greater than 500 nm and such that thermal stresses in the first means remain below a predetermined value during temperature fluctuations within a temperature range.
2. The apparatus of claim 1, wherein the predetermined values comprises 6 GPa or 50 MPa and the temperature range is between minus 55\xb0 C. and 320\xb0 C.
3. The apparatus of claim 1, wherein the buffer layer comprises a layer thickness between 500 nm and 50 \u03bcm.
4. The apparatus of claim 1, wherein the buffer layer comprises a layer thickness between 800 nm and 2.5 \u03bcm.
5. A method for manufacturing a device, comprising:
providing a lead frame;
depositing a diffusion solder layer onto the lead frame;
depositing a buffer layer onto the diffusion solder layer, the buffer layer comprising a ductile material, which is soft in comparison to a material of the diffusion solder layer, the buffer layer and the diffusion solder layer forming a layer structure;
arranging a semiconductor chip onto the layer structure; and
diffusion soldering the semiconductor chip onto the lead frame by heating and subsequent cooling down,
wherein the buffer layer comprises a thickness such that thermal stresses in the semiconductor chip remain below a predetermined value during the heating and the subsequent cooling down.
6. The method of claim 5, wherein the deposition of the buffer layer is performed such that the layer thickness of the buffer layer is at least 0.8 \u03bcm or more than 1 \u03bcm.
7. The method of claim 5, wherein the deposition of the buffer layer is performed such that the buffer layer comprises aluminum or aluminum magnesium.
8. The method of claim 5, wherein the deposition of the buffer layer is performed such that the buffer layer comprises a layer thickness that is greater than 500 nm.
9. The method of claim 8, wherein the deposition of the buffer layer is performed such that the buffer layer comprises a predetermined layer thickness of more than 1 \u03bcm and the buffer layer comprises aluminum.
10. The method of claim 8, wherein the deposition of the buffer layer is performed such that the buffer layer comprises a predetermined layer thickness between 1.8 and 50 \u03bcm.
11. The method of claim 5, wherein the device comprises an integrated circuit.
12. An apparatus configured for releasing a thermal stress within a semiconductor chip, comprising:
a first means comprising a semiconductor chip;
a second means comprising a lead frame; and
a third means for connecting the first and second means, the third means comprising a diffusion solder layer and a buffer layer, the buffer layer comprising a material, which is ductile and soft in comparison to a material of the diffusion solder layer,
wherein the third means is arranged between the first means and the second means, and wherein the buffer layer comprises a layer thickness such that thermal stresses in the first means remain below a predetermined value during temperature fluctuations within a temperature range, and
wherein the semiconductor chip and the lead frame are thermally and electrically connected via the diffusion solder layer and the buffer layer, the diffusion solder layer and the buffer layer directly contact each other and the lead frame has metal atoms of the diffusion solder layer diffused into itself.
13. The apparatus of claim 12, wherein the third means consists of the diffusion solder layer and the buffer layer.
14. The apparatus of claim 12, wherein the third means forms a diffusion solder connection.