What is claimed is:
1. A porous ink jet recording element comprising a support having thereon an image-receiving layer comprising:
(a) inorganic particles having a primary particle size of from about 7 to about 40 nm in diameter which may be aggregated up to about 500 nm;
(b) colloidal particles having a mean particle size of from about 20 to about 500 nm;
(c) water-insoluble, cationic, polymeric particles comprising at least about 20 mole percent of a cationic mordant moiety; and
(d) inorganic particles encapsulated with an organic polymer having a Tg of less than about 100 C.
2. The recording element of claim 1 wherein said (a) inorganic particles are fumed silica or fumed alumina.
3. The recording element of claim 1 wherein said (b) colloidal particles are silica, alumina, titania, zirconia, yttria, or hydrated aluminum oxide.
4. The recording element of claim 1 wherein said (b) colloidal particles are organic particles.
5. The recording element of claim 1 wherein said (c) water-insoluble, cationic, polymeric particles are in the form of a latex which contains a polymer having a quaternary ammonium salt moiety.
6. The recording element of claim 1 wherein said (c) water-insoluble, cationic, polymeric particles comprises a mixture of latexes containing a polymer having a (vinylbenzyl)trimethyl quaternary ammonium salt moiety and a polymer having a (vinylbenzyl)dimethylbenzyl quaternary ammonium salt moiety.
7. The recording element of claim 1 wherein said (c) water-insoluble, cationic, polymeric particles have a mean particle size of from about 10 to about 500 nm.
8. The recording element of claim 1 wherein said (d) inorganic particles encapsulated with an organic polymer have a mean particle size of from about 5 nm to about 1000 nm.
9. The recording element of claim 1 wherein the Tg of said organic polymer used to make said encapsulated (d) particles is from about 50 C. to about 65 C.
10. The recording element of claim 1 wherein said organic polymer used to make said encapsulated (d) particles is derived from a cationic, anionic or nonionic monomer.
11. The recording element of claim 10 wherein said monomer contains a quaternary ammonium, pyridinium, imidazolium, sulfonate, carboxylate or phosphonate functionality.
12. The recording element of claim 1 wherein said organic polymer used to make said encapsulated (d) particles is derived from an acrylate- or styrene-containing monomer.
13. The recording element of claim 1 wherein said (d) inorganic particles are encapsulated by polymerizing a monomer in the presence of said inorganic particles to form said organic polymer.
14. The recording element of claim 1 wherein said (d) inorganic particles are encapsulated with said organic polymer by:
(a) modifying the surface of said inorganic particles with a silane-containing material; and
(b) polymerizing a monomer to form said organic polymer.
15. The recording element of claim 1 wherein said (d) inorganic particles are encapsulated with said organic polymer by adsorption of said organic polymer onto the surface of said inorganic particles.
16. The recording element of claim 1 wherein said (d) inorganic particles are encapsulated with said organic polymer by chemical bond formation between said inorganic particles and said organic polymer.
17. The recording element of claim 1 wherein the weight ratio of said inorganic particles to said organic polymer in said (d) particles is from about 20 to about 0.2.
18. The recording element of claim 1 wherein said (a) inorganic particles are present in an amount of from about 10 to about 50 weight % of said image-receiving layer, said (b) colloidal particles are present in an amount of from about 50 to about 80 weight % of said image-receiving layer, said (c) water-insoluble, cationic, polymeric particles are present in an amount of from about 5 to about 30 weight % of said image-receiving layer; and said (d) inorganic particles encapsulated with an organic polymer are present in an amount of from about 2 to about 50 weight % of said image-receiving layer.
19. The recording element of claim 1 wherein a base layer comprising at least about 50% by weight of inorganic particles is coated between said support and said image-receiving layer.
20. The recording element of claim 1 wherein said image-receiving layer also contains a binder in an amount of from about 5 to about 20 weight %.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A structure comprising a substrate and a coating material on a surface of the substrate, wherein the coating material comprises metal ions with radiation sensitive ligands and wherein the coating material has an average thickness from about 5 nm to about 30 nm, wherein exposure of the coating material to UV, EUV andor electron-beam radiation alters the chemical properties of the coating material creating an exposed coating material with differential dissolution rates between exposed and un-exposed regions of the coating material.
2. The structure of claim 1 wherein the metal ions comprise metal suboxide ions.
3. The structure of claim 1 wherein the metal of the metal ions comprises Cu, Al, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Zn, Y, Zr, Nb, Mo, In, Sn, Sb, Hf, Ta, W, Ir, Pt, La, Ce, Pr, Nb, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu or a combination thereof.
4. The structure of claim 1 wherein the radiation sensitive ligands comprise peroxide ligands.
5. The structure of claim 1 wherein the coating material further comprises polyatomic anions.
6. The structure of claim 1 wherein the average thickness is from about 5 nm to about 25 nm.
7. The structure of claim 1 wherein the coating material has high absorption of EUV radiation relative to conventional radiation-based resists.
8. A method for forming a patterned structure comprising a substrate and a patterned coating material on a surface of the substrate, the method comprising:
irradiating along a selected pattern, a layer of coating material on the surface of the substrate having an average thickness from about 5 nm to about 30 nm with UV radiation or EUV radiation at a dose of no more than about 100 mJcm2, or with electron-beam radiation at a dose equivalent to no more than about 300 \u03bcCcm2 at 30 kV; and
contacting the irradiated layer with a developing composition to dissolve un-irradiated material to form a patterned coating material.
9. The method of claim 8 wherein the irradiation is performed with EUV at a dose of no more than about 90 mJcm2.
10. The method of claim 8 wherein the irradiation is performed with e-beam radiation with a dose equivalent to no more than about 250 \u03bcCcm2 at 30 kV.
11. The method of claim 8 wherein the developing composition comprises tetramethyl ammonium hydroxide.
12. The method of claim 8 further comprising heating the coated substrate after irradiation to a temperature of at least about 45\xb0 C. prior to contacting the irradiated layer with the developing composition.
13. The method of claim 8 wherein the coating material prior to irradiation comprises metal ions with radiation sensitive ligands and wherein interaction of the coating material with EUV andor e-beam radiation alters the chemical properties of the coating material creating a structure with differential dissolution rates.
14. The method of claim 13 wherein the metal of the metal ions comprises Cu, Al, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Zn, Y, Zr, Nb, Mo, In, Sn, Sb, Hf, Ta, W, Ir, Pt, La, Ce, Pr, Nb, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu or a combination thereof, wherein the radiation sensitive ligands comprise peroxide ligands, and wherein the coating material further comprises polyatomic anions.
15. A method for forming a patterned inorganic material on a substrate, the method comprising:
irradiating a coated substrate with a pattern of radiation wherein the coated substrate comprises a coating with a radiation patternable coating material comprising metal suboxide cations, ligands comprising a peroxide group and inorganic polyatomic anions and wherein irradiation creates a differential dissolution rate between irradiated and un-irradiated locations, wherein the coating material is formed by removing solvent from a deposited precursor solution wherein the peroxide ligand to metal ion ratio is at least about 2; and
heating the coated substrate after irradiation to a temperature of at least about 45\xb0 C. prior to contacting the coating with a developing composition.
16. The method of claim 15 further comprising contacting the coated substrate after heating with a developing composition to remove un-irradiated coating material to form the patterned inorganic material.
17. The method of claim 16 wherein the patterned inorganic material has edges with an average line-width roughness no more than about 2.25 nm at a pitch of no more than about 60 nm or for individual features having an average width of no more than about 30 nm.
18. The method of claim 15 wherein the metal suboxide cations comprise Cu, Al, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Zn, Y, Zr, Nb, Mo, In, Sn, Sb, Hf, Ta, W, Ir, Pt, La, Ce, Pr, Nb, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu or a combination thereof.
19. The method of claim 15 wherein the irradiating step comprises irradiation with extreme ultraviolet light at a dose of no more than about 100 mJcm2 or with an electron beam at a dose equivalent to no more than about 300 \u03bcCcm2 at 30 kV.
20. The method of claim 15 wherein the coating has an average thickness of about 5 nm to about 30 nm.