1. A power train of a hybrid vehicle, comprising:
a first planetary gear set including three elements where an engine, a first motor generator, and an output shaft are separately connected;
a second planetary gear set including three elements, one element of which is directly connected with the element of the first planetary gear set connected with the output shaft and another element of which can be selectively connected from the first motor generator; the other element of which is connected with an element of the third planetary gear set;
a third planetary gear set including three elements, two elements of which are connected with the second planetary gear set and the other element of which is connected with a second motor generator;
a first brake is connected with an element of the third planetary gear sets other than an element of which is connected with the second motor;
a clutch is connected with the first motor generator and an element of the second planetary gear sets other than the element connected with the output shaft and the element connected with the first brake; and
a second brake is connected directly connected an element other than elements of the first planetary gear sets
2. The power train as defined in claim 1, wherein the output shaft is sequentially connected with one element of each of the first planetary gear set, the second planetary gear set, and the third planetary gear set,
the first brake fixes an element of the second planetary gear set by fixing an element of the third planetary gear set directly connected with the element of the second planetary gear set or fixes the element of the third planetary gear set by fixing the element of the second planetary gear set directly connected with the element of the third planetary gear set, and the clutch is provided to simultaneously engage and disengage an element of
the second planetary gear set withfrom an element of the first planetary gear set.
3. The power train as defined in claim 2, wherein the first planetary gear set is a single-pinion type planetary gear set, including a first sun gear connected with the first motor generator, a first carrier connected with the engine, and a first ring gear connected with the output shaft,
the second planetary gear set is a double-pinion type planetary gear set, including a second sun gear connected with the second brake and first clutch and the second brake through the clutch, a second carrier connected with the output shaft through the first ring gear, and a second ring gear connected with the first brake through the third planetary gear set, and
third planetary gear set is a single-pinion type planetary gear set, including a third sun gear connected with the second motor generator, a third carrier connected with the output shaft through the second planetary gear set and the first planetary gear set, and a third ring gear connected with the first brake.
4. The power train as defined in claim 3, wherein the planetary gear sets are coaxially arranged in parallel in the order of the first planetary gear set, the second planetary gear set, and the third planetary gear set,
the engine is connected with the first planetary gear set,
the output shaft is connected with the third planetary gear set through the first planetary gear set and the second planetary gear set,
the second motor generator is connected with the third planetary gear set, and
the first motor generator is connected with the second planetary gear set and the first planetary gear set from the third planetary gear set.
5. The power train as defined in claim 1, wherein the first planetary gear set, in a lever analysis diagram, is arranged on a first straight line in the order of an element connected with the first motor generator, an element connected with the engine, and an element connected with the output shaft,
the second planetary gear set, in a lever analysis diagram, is arranged on a second straight line that crosses the first straight line at at least one point in the order of an element connected with the output shaft, an element directly connected with the third planetary gear set, and an element connected with the first motor generator and the second brake through the clutch, and
the third planetary gear set, in a lever analysis diagram, is arranged on the second straight line in the order of an element connected with the second motor generator, an element connected with the output shaft, and an element directly connected with the second planetary gear set, in which as the clutch is engaged, the first straight line and the second straight line make a single straight line.
6. The power train as defined in claim 5, wherein the elements of the planetary gear sets are arranged on the second straight line in the order of the element of the third planetary gear set connected with the second motor generator, the elements of the second planetary gear set and the third planetary gear set which are directly connected with each other and connected with the output shaft, the elements of the second planetary gear set and the third planetary gear set which are directly connected with each other and connected with the first brake, and the element of the second planetary gear set which is connected with the first motor generator and the second brake through the clutch.
7. The power train as defined in claim 6, wherein, on the single straight line made by the first straight line and the second straight line by engagement of the clutch, the element of the first planetary gear set connected with the engine is disposed between two pairs of the elements, which are directly connected with each other, of the second planetary gear set and the third planetary gear set.
8. A power train of a hybrid vehicle, comprising:
a first planetary gear set including three elements where an engine, a first motor generator, and an output shaft are separately connected;
a second planetary gear set including three elements, one element of which is directly connected with the element of the first planetary gear set connected with the output shaft and another element of which can be selectively connected with first motor generator an element of the first planetary gear set and the other element is directly connected an element other than the first motor generator or a second motor generator;
a third planetary gear set including three elements, two elements of which are connected with the second planetary gear set and the other element of which is connected with a second motor generator;
a first brake that is provided to engage an elements of the second and the third planetary gear sets, both elements of which are directly connected; and
a clutch that selectively engages with the first motor generator and an element of the second planetary gear set other than the element connected with the output shaft and the element connected with the first brake and connected a second brake
9. The power train as defined in claim 8, wherein the output shaft is sequentially connected with one element of each of the first planetary gear set, the second planetary gear set, and the third planetary gear set, a first brake that is provided to engage an elements of the second and the third planetary gear sets, both elements of which are directly connected. an element or elements of the second planetary gear set and the third planetary gear set, which is or are connected with the output shaft through at least one of the three planetary gear sets and engage an element or elements of the second planetary gear set and the third planetary gear set other than an element or elements that is or are connected at least intermittently with the first motor generator or the second motor generator a clutch that intermittently engages with the first motor generator an element of the second planetary gear set other than the element connected with the output shaft and the element connected with the first brake; and
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A stacked package structure for reducing the package volume of an acoustic micro-sensor, comprising:
a recessed protective substrate;
a recessed conductive substrate, formed on the recessed protective substrate;
an integrated circuit (IC) device, connected to the recessed conductive substrate;
an acoustic micro-sensor, stacked on the IC device; and
a lid having a tone hole, the lid covering the acoustic micro-sensor so that the IC device and the acoustic micro-sensor are enveloped by the lid, the protective substrate and the conductive substrate;
wherein a recess is formed on the IC device as a back chamber of the acoustic micro-sensor.
2. The stacked package structure as recited in claim 1, wherein the lid is a glass substrate or a planar substrate.
3. The stacked package structure as recited in claim 1, wherein a metal material layer is deposited on each of the protective substrate and the conductive substrate.
4. The stacked package structure as recited in claim 1, wherein the protective substrate and the conductive substrate are formed of a polymer material, a metal material or an alloy by injection molding or compression molding.
5. The stacked package structure as recited in claim 1, wherein the protective substrate is electrically conductive with at least a conductive wire formed thereon.
6. The stacked package structure as recited in claim 1, wherein the conductive substrate is a printed circuit board or a flexible printed circuit board.
7. The stacked package structure as recited in claim 1, wherein an adhesive or at least a solder ball is used between the conductive substrate and the IC device and between the IC device and the acoustic micro-sensor for connection.
8. The stacked package structure as recited in claim 1, wherein the stacked package structure is capable of being used in a pressure sensor, an accelerometer sensor or an ultrasonic sensor.
9. A stacked package structure for reducing the package volume of an acoustic micro-sensor, comprising:
a recessed protective substrate;
a recessed conductive substrate, formed on the recessed protective substrate;
an integrated circuit (IC) device, connected to the recessed conductive substrate;
an acoustic micro-sensor, stacked on the IC device; and
a lid having a tone hole, the lid covering the acoustic micro-sensor;
wherein the IC device is enveloped by the protective substrate and the conductive substrate;
wherein a recess is formed on the IC device as a back chamber of the acoustic micro-sensor.
10. A stacked package structure for reducing the package volume of an acoustic micro-sensor, comprising:
a recessed protective substrate;
a recessed conductive substrate, formed on the recessed protective substrate;
an integrated circuit (IC) device, connected to the recessed conductive substrate;
an acoustic micro-sensor, stacked on the IC device; and
a lid having a tone hole, the lid covering the acoustic micro-sensor so that the IC device and the acoustic micro-sensor are enveloped by the lid, the protective substrate and the conductive substrate;
wherein a recess is formed on the IC device as a back chamber of the acoustic micro-sensor, and at least a conductive frame between the IC device and the acoustic micro-sensor is formed on the sidewall of the conductive substrate to define the height and the volume of the back chamber and to electrically connect the acoustic micro-sensor and the conductive substrate.
11. The stacked package structure as recited in claim 10, wherein the lid is a glass substrate or a planar substrate.
12. The stacked package structure as recited in claim 10, wherein a metal material layer is deposited on each of the protective substrate and the conductive substrate.
13. The stacked package structure as recited in claim 10, wherein the protective substrate and the conductive substrate are formed of a polymer material, a metal material or an alloy by injection molding or compression molding.
14. The stacked package structure as recited in claim 10, wherein the protective substrate is electrically conductive with at least a conductive wire formed thereon.
15. The stacked package structure as recited in claim 10, wherein the conductive substrate is a printed circuit board or a flexible printed circuit board.
16. The stacked package structure as recited in claim 10, wherein an adhesive or at least a solder ball is used between the conductive substrate and the IC device and between the IC device and the acoustic micro-sensor for connection.
17. The stacked package structure as recited in claim 10, wherein the stacked package structure is capable of being used in a pressure sensor, an accelerometer sensor or an ultrasonic sensor.
18. A stacked package structure for reducing the package volume of an acoustic micro-sensor, comprising:
a recessed protective substrate;
a recessed conductive substrate, formed on the recessed protective substrate;
an integrated circuit (IC) device, connected to the recessed conductive substrate;
an acoustic micro-sensor, stacked on the IC device; and
a lid having a tone hole, the lid covering the acoustic micro-sensor;
wherein the IC device is enveloped by the protective substrate and the conductive substrate;
wherein a recess is formed on the IC device as a back chamber of the acoustic micro-sensor, and at least a conductive frame between the IC device and the acoustic micro-sensor is formed on the sidewall of the conductive substrate to define the height and the volume of the back chamber and to electrically connect the acoustic micro-sensor and the conductive substrate.