1. A bump formation method comprising a sequence of:
a first step that forms a ball on a tip end of a wire that passes through a capillary and joins said ball to a conductor to form a press-bonded ball;
a second step that raises and then moves said capillary in a horizontal direction to a first position so that a flat portion on a lower end of said capillary on a side of said capillary opposite to said horizontal-direction movement is positioned to face said press-bonded ball;
a third step that lowers said capillary so that said press-bonded ball is pressed by said flat portion of said capillary to form a first bump;
a fourth step that raises and moves said capillary in an opposite horizontal direction from said horizontal-direction movement of said capillary in said second step to a second position so that a flat portion on said lower end of said capillary on a side of said capillary opposite to said opposite horizontal-direction movement is positioned to face said first bump;
a fifth step that lowers said capillary so that said wire is bent and pressed against a surface of said first bump by said flat portion of said capillary, thus forming a second bump; and
a sixth step that cuts said wire from said second bump.
2. A bump formation method comprising a sequence of:
a first step that forms a ball on a tip end of a wire that passes through a capillary and joins said ball to a conductor to form a press-bonded ball;
a second step that raises and moves said capillary in a horizontal direction so that a flat portion on a lower end of said capillary is positioned to face said press-bonded ball;
a third step that lowers said capillary so that said press-bonded ball is pressed to form a first bump;
a fourth step that raises and lowers said capillary in an opposite horizontal direction from said horizontal-direction movement of said capillary in said second step so that said flat portion on said lower end of said capillary is positioned to face said first bump;
a fifth step that lowers said capillary so that said wire is bent and pressed against a surface of said first bump, thus forming a second bump; and
a sixth step that raises and moves said capillary in an opposite horizontal direction from said horizontal-direction movement in said fourth step so as to cause said flat portion on said lower end of said capillary to be positioned to face said second bump;
a seventh step that lowers said capillary so that said wire is bent and pressed against a surface of said second bump to form a third bump; and
an eighth step that cuts said wire from a uppermost bump.
3. A wire bonding method in which wire bonding between a first conductor aid second conductor is executed by performing primary bonding to a surface of a first conductor and then performing secondary bonding to a surface of a second conductor, said method comprising a sequence of:
a first step that forms a ball on a tip end of a wire that passes through a capillary and joins said ball to a conductor to form a press-bonded ball;
a second step that raises and then moves said capillary in a horizontal direction to a first position so that a flat portion on a lower end of said capillary on a side of said capillary opposite to said horizontal-direction movement is positioned to face said press-bonded ball;
a third step that lowers said capillary so that said press-bonded ball is pressed by said flat portion of said capillary to form a first bump;
a fourth step that raises and moves said capillary in an opposite horizontal direction from said horizontal-direction movement of said capillary in said second step to a second position so that said flat portion on said lower end of said capillary on a side of said capillary opposite to said opposite horizontal-direction movement is positioned to face said first bump;
a fifth step that lowers said capillary so that said wire is bent and pressed against a surface of said first bump by said flat portion of said capillary, thus forming a second bump with a direction of inclination of an inclined wedge oriented toward an opposite side from said first conductor; and
a sixth step that cuts said wire from said second bump, thus forming a two-stage bump; and then
said primary bonding is thereafter performed, after which said wire is looped from the said first conductor with respect to said bump, and said secondary bonding is performed on said inclined wedge on the upper portion of said bump.
4. A wire bonding method in which wire bonding between a first conductor and second conductor is executed by performing primary bonding to a surface of a first conductor and then performing secondary bonding to a surface of a second conductor, said method comprising a sequence of:
a first step that forms a ball on a tip end of a wire that passes through a capillary and joins said ball to a conductor to form a press-bonded ball;
a second step that raises and moves said capillary in a horizontal direction so that a flat portion on a lower end of said capillary is positioned to face said press-bonded ball;
a third step that lowers said capillary so that said press-bonded ball is pressed to form a first bump;
a fourth step that raises and lowers said capillary in an opposite horizontal direction from said horizontal-direction movement of said capillary in said second step so that said flat portion on said lower end of said capillary is positioned to face said first bump;
a fifth step that lowers said capillary so that said wire is bent and pressed against a surface of said first bump, thus forming a second bump; and
a sixth step that raises and moves said capillary in an opposite horizontal direction from said horizontal-direction movement of said capillary in said fourth step so as to cause said flat portion on said lower end of said capillary to be positioned to face said second bump;
a seventh step that lowers said capillary so that said wire is bent and pressed against a surface of said second bump to form a third bump; and
an eighth step that forms an inclined wedge on a final uppermost bump so that a direction of inclination of said inclined wedge is oriented toward an opposite side from said first conductor, said eighth step further cutting said wire from said final uppermost bump, thus forming a multi-stage bump; and then
said primary bonding is thereafter performed, after which said wire is looped from said first conductor with respect to said bump, and said secondary bonding is performed on said inclined wedge on the upper portion of said bump.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An apparatus for kneading a rubber material comprising:
one internal mixer arranged to an upstream side of a group of at least two kneading lines provided side by side, which kneads a rubber material with a non-vulcanization compounding agent, each line of the kneading lines having therein at least two open roll mixers serially connected with each other, and each of the open roll mixers being provided with a pair of kneading rolls, a rekneading conveyor, and a delivery conveyor;
one final mixer arranged to a downstream side of the group of kneading lines, which kneads intermediate kneaded rubber discharged from the group of kneading lines with a vulcanization compounding agent;
measuring means arranged between the internal mixer and the group of kneading lines;
distribution means arranged between the internal mixer and the group of kneading lines, which distributes, by selectively moving among the kneading lines, to at least one kneading line of the group of kneading lines, preparatory kneaded rubber measured by the measuring means; and
transport means, arranged between the group of kneading lines and the final mixer, which transports the intermediate kneaded rubber to the final mixer.
2. The apparatus for kneading a rubber material according to claim 1, wherein the final mixer further comprises a pair of kneading rolls, a rekneading conveyor, and a delivery conveyor.
3. The apparatus for kneading a rubber material according to any one of claims 1 and 2, wherein the measuring means includes a measuring conveyor and a cutting unit, and the distribution means includes a transport conveyor.
4. The apparatus for kneading a rubber material according to claim 3, wherein each of the open roll mixers is provided with roll gap adjusting means along with driving means for the pair of kneading rolls, and additionally provided with: a roll gap sensor; a rubber temperature sensor for a temperature of kneaded rubber; an operating unit, which controls the driving means for the kneading rolls and the roll gap adjusting means based on data detected by the roll gap sensor and the rubber temperature sensor.
5. The apparatus for kneading a rubber material according to claim 4, wherein each of the open roll mixers is further provided with cooling means for kneaded rubber, which is controlled by the operating unit.
6. The apparatus for kneading a rubber material according to claim 4, wherein, by further providing each of the open roll mixers with a bank amount sensor for a bank amount of rubber retained on the pair of kneading rolls, data detected by the bank amount sensor is inputted into the operating unit.
7. A method of kneading a rubber material using the kneading apparatus according to any one of claims 1 and 2, comprising the steps of;
preliminarily kneading a rubber material with a non-vulcanization compounding agent by use of the internal mixer; and
kneading preparatory kneaded rubber, which is discharged from the internal mixer, in at least one of the kneading lines of the roll mixers in a manner that a temperature of the kneaded rubber is controlled to be in a range of 40 to 90\xb0 C. while a roll gap of the pair of the kneading rolls is set in a range of 0.5 to 3.0 mm.
8. A method of kneading a rubber material using the kneading apparatus according to any one of claims 1 and 2, comprising the steps of;
preliminarily kneading a rubber material with a non-vulcanization compounding agent by use of the internal mixer; and
at the time when preparatory kneaded rubber, which is discharged from the internal mixer, is charged from the internal mixer into the first roll mixer in at least one of the kneading lines of the roll mixers, controlling a temperature of the preparatory kneaded rubber to be at least 90\xb0 C.; and
at the time when the kneaded rubber is discharged from the first roll miser into the second roll mixer, controlling a temperature of the kneaded rubber to be in a range of 60 to 80\xb0 C.
9. The method of kneading a rubber material according to claim 8, further comprising the step of controlling a temperature of the kneaded rubber, which has been kneaded in and is discharged from the second roll mixer, to be in a range of 40 to 75\xb0 C.
10. The method of kneading a rubber material according to claim 8, further comprising the steps of:
inputting data detected by the roll gap sensor and the rubber temperature sensor into the operating unit; and
controlling at least any one of the driving means for the kneading rolls, the roll gap adjusting means, and the cooling means based on a difference between a viscosity, which is calculated by the operating unit by way of a preset viscosity estimation formula, and a target viscosity.
11. The method of kneading a rubber material according to claim 10, further comprising the steps of:
inputting data detected by the bank amount sensor into the operating unit; and
controlling at least any one of a transport speed of the rekneading conveyor, and a position thereof based on a difference between the calculated viscosity obtained by the operating unit and a target viscosity.