1. A method for treating intervertebral disc degeneration, comprising:
introducing a spinal access device having direct visualization capability into a portion of the spine;
steering the spinal acess device to a position adjacent an outer surface of the spinal dura matter using visualization information provided by the spinal access device;
displacing the spinal dura matter with a portion of the spinal access device to create a working area; and
using the spinal access device to deliver a disc augmentation device for treating intervertebral disc degeneration.
2. The method according to claim 1 wherein the augmentation device provides structural support to the annulus.
3. The method according to claim 1 wherein the augmentation device seals a torn annulus.
4. The method according to claim 1 wherein the augmentation device adds additional material to the nucleus.
5. A method for treating intervertebral disc degeneration, comprising:
introducing a spinal access device having direct visualization capability into a portion of the spine;
steering the spinal acess device to a position adjacent an outer surface of the spinal dura matter using visualization information provided by the spinal access device;
displacing the spinal dura matter with a portion of the spinal access device to create a working area; and
using the spinal access device to deliver a nucleus decompression device for treating intervertebral disc degeneration.
6. The method according to claim 5 wherein the nucleus decompression device removes a portion of the nucleus.
7. The method according to claim 5 wherein the nucleus decompression device shrinks a portion of the nucleus.
8. A system for intervertebral disc augmentation comprising:
a spinal access device configured to deliver a disc augmentation device to an intervertebral disc comprising:
at least one disc augmentation device;
an elongate body;
a direct visualization device; and
a working channel.
9. The system of claim 8 wherein augmentation includes repairing a herniated disc.
10. The system of claim 8 wherein augmentation includes supporting a damaged annulus.
11. The system of claim 8 wherein augmentation includes sealing an annulus.
12. The system of claim 8 wherein augmentation includes the addition of material to the nucleus.
13. The system of claim 8 wherein the spinal access device includes an expanding structure.
14. The system of claim 13 wherein the expanding structure is mesh, a balloon, or an atraumatic element.
15. The system of claim 13 wherein expanding the expanding structure deforms a portion of the spinal dura matter.
16. The system of claim 13 wherein expanding the structure creates a working area.
17. The system of claim 8 wherein the visualization information is provided from an image generated by a sensor located on the instrument.
18. The system of claim 8 wherein the augmentation device further comprises at least one mesh, cage, barrier, patch, scaffold, sealing means, hydrogels, silicones, or growth factors.
19. The system of claim 8 wherein the augmentation device is an ablation device.
20. A system for intervertebral nuclear decompression comprising:
a spinal access device configured to deliver a nuclear decompression device to an intervertebral disc comprising:
a nuclear decompression device;
an elongate body;
a direct visualization device;
a working channel; and
a dissection tip.
21. The system according to claim 20 wherein the decompression device further comprises a temperature-controlled energy element.
22. The system according to claim 21 wherein the energy element may be a thermal energy device that delivers resistive heat, radiofrequency, coherent and incoherent light, microwave, ultrasound or liquid thermal jet energies to the nucleus.
23. The system of claim 20 wherein the spinal access device includes an expanding structure.
24. The system of claim 23 wherein the expanding structure is mesh, a balloon, or an atraumatic element.
25. The system of claim 23 wherein expanding the expanding structure deforms a portion of the spinal dura matter.
26. The system of claim 23 wherein expanding the structure creates a working area.
27. The system of claim 20 wherein the visualization information is provided from an image generated by a sensor located on the instrument.
28. A method of diagnosing disc degeneration in a patient, said method comprising:
introducing a spinal access device having direct visualization capability into a portion of the spine;
steering the spinal access device using visualization information provided by the spinal access device;
displacing the spinal dura matter with a portion of the spinal access device to create a working area; and
assessing the condition of one or more intervertebral discs.
29. The method according to claim 28 wherein the spinal access device comprises a material or marker to enhance visualization of the structure using an imaging modality outside of the body.
30. The method according to claim 29 further comprising receiving visualization information from an imaging modality outside of the body.
31. The method according to claim 30 wherein the imaging modality comprises fluoroscopy.
32. The method according to claim 30 wherein the imaging modality comprises magnetic resonance imaging.
33. The method according to claim 28 wherein the visualization information is provided from an image generated by a sensor located on the instrument.
34. The method according to claim 28 wherein the spinal access device includes a sensor for collecting diagnostic data.
35. A kit for augmenting the intervertebral disc, the kit comprising:
at least one disc augmentation device;
a spinal access device having direct visualization capabilities; and
instructions for implanting the at least one disc augmentation device using the spinal access device.
36. A kit for decompressing the nucleus of an intervertebral disc, the kit comprising:
at least one nucleus decompression device;
a spinal access device having direct visualization capabilities; and
instructions for decompressing the nucleus of an intervertebral disc using the spinal access device.
37. A method for treating intervertebral disc degeneration, comprising:
introducing a spinal access device having direct visualization capability into a portion of the spine;
displacing the spinal column matter with a portion of the spinal access device to create a working area; and
using the spinal access device to deliver a disc augmentation device for treating intervertebral disc degeneration.
38. The method according to claim 37 wherein the spinal access device is steered to a position within the spinal column using the direct visualization capability of the spinal access device.
39. The method according to claim 37 wherein the augmentation device provides structural support to the annulus.
40. The method according to claim 37 wherein the augmentation device seals a torn annulus.
41. The method according to claim 37 wherein the augmentation device adds additional material to the nucleus.
42. A method for treating intervertebral disc degeneration, comprising:
introducing a spinal access device having direct visualization capability into a portion of the spine;
displacing the spinal column matter with a portion of the spinal access device to create a working area; and
using the spinal access device to deliver a nucleus decompression device for treating intervertebral disc degeneration.
43. The method according to claim 42 wherein the spinal access device is steered to a position within the spinal column using the direct visualization capability of the spinal access device.
44. The method according to claim 42 wherein the nucleus decompression device removes a portion of the nucleus.
45. The method according to claim 42 wherein the nucleus decompression device shrinks a portion of the nucleus.
46. A method for treating intervertebral disc degeneration, comprising:
introducing a spinal access device having direct visualization capability into a portion of the spine;
displacing the spinal column matter with a portion of the spinal access device to create a working area; and
using the spinal access device to deliver a stimulation electrode device for treating intervertebral disc degeneration.
47. The method according to claim 46 wherein the spinal access device is steered to a position within the spinal column using the direct visualization capability of the spinal access device.
48. A method for treating intervertebral disc degeneration, comprising:
introducing a spinal access device having direct visualization capability into a portion of the spine;
steering the spinal access device using visualization information provided by the spinal access device;
displacing the spinal column matter with a portion of the spinal access device to create a working area; and
using the spinal access device to deliver a stimulation electrode device for treating intervertebral disc degeneration.
49. A spinal access device configured to deliver a disc augmentation device to an intervertebral disc, said device comprising:
a therapeutic device;
an elongate body;
a direct visualization device; and
at least one working channel.
50. A system for intervertebral nuclear decompression comprising:
a spinal access device configured to deliver a nuclear decompression device to an intervertebral disc comprising:
a nuclear decompression device;
an elongate body;
a direct visualization device; and
a working channel.
51. A method of diagnosing disc degeneration in a patient, said method comprising:
introducing a spinal access device having direct visualization capability into a portion of the spine;
displacing the spinal dura matter with a portion of the spinal access device to create a working area; and
assessing the condition of one or more intervertebral discs.
52. A system for treating spinal disease comprising:
a spinal access device configured to deliver a therapeutic device to a spinal column comprising:
a therapeutic device;
an elongate body;
a direct visualization device; and
at least one working channel.
53. A system for treating spinal disease comprising:
a spinal access device configured to deliver a therapeutic device to a spinal column comprising:
a therapeutic device;
an elongate body;
a direct visualization device;
at least one working channel; and
at least one irrigation or aspiration channel.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A wiring electronic component to be incorporated into an electronic device package in which a circuit element is disposed therein, the circuit element including a semiconductor chip and the electronic device package including vertical wiring connected to the circuit element and external electrodes, the wiring electronic component comprising:
a support portion having a two-layer structure, said two-layer structure having a reinforcement plate bonded to a back side of an insulation material via a separable adhesive; and
a plurality of vertical wiring portions separably connected to the support portion so as to form the vertical wiring.
2. A wiring electronic component according to claim 1, wherein the plurality of vertical wiring portions are formed on the support portion by means of plating.
3. A wiring electronic component according to claim 2, wherein horizontal wiring portions connected to the vertical wiring portions are formed.
4. A wiring electronic component according to claim 3, wherein the support portion is formed by bonding a tape to the entirety of one side of a stainless steel plate, a silicon substrate, or a glass substrate, the tape being formed of the insulation material in the form of thin film.
5. A wiring electronic component according to claim 4, wherein a seed layer of metal is formed on the insulation material, and the vertical wiring portions and the horizontal wiring portions are grown on the seed layer through plating.
6. A wiring electronic component according to claim 3, wherein a stainless steel plate, a silicon substrate, or a glass substrate is used as the support portion, a seed layer is formed on the support portion via a separation assisting layer, and the vertical wiring portions and the horizontal wiring portions are grown on the seed layer through plating.
7. A wiring electronic component according to claim 1, wherein said reinforcement plate is connected to the semiconductor chip in a first state, said reinforcement plate being disconnected from the semiconductor chip in a second state, said insulation material being connected to one or more of said vertical wiring portions in the first state and the second state.
8. A wiring component according to claim 7, wherein said insulation material and the semiconductor chip define a space in a first wiring electronic component configuration, wherein resin fills said space such that said resin engages said insulation material in the second wiring electronic component configuration.
9. A method of manufacturing a wiring electronic component to be incorporated in an electronic device package in which a circuit element is disposed therein, the circuit element including a semiconductor chip and the electronic device package including external electrodes connected to the circuit element via vertical wiring, the method comprising:
providing a support portion comprising a two-layer structure, said two-layer structure comprising reinforcement plate and insulation material, said reinforcement plate being bonded to a back side of the insulation material via a separable adhesive; and
forming a plurality of vertical wiring portions for the vertical wiring through plating such that the vertical wiring portions are detachably connected to the support portion.
10. A method of manufacturing a wiring electronic component according to claim 9, wherein, after horizontal wiring portions are formed on the support portion, the vertical wiring portions to be connected to the horizontal wiring portions are formed.
11. A method of manufacturing a wiring electronic component according to claim 10, wherein a stainless steel plate, a silicon substrate, or a glass substrate is used as the support portion, a seed layer is formed on the support portion via a separation assisting layer, and the vertical wiring portions and the horizontal wiring portions are grown on the seed layer through plating.
12. A method of manufacturing a wiring electronic component according to claim 10, wherein the support portion is formed by bonding a tape to the entirety of one side of a stainless steel plate, a silicon substrate, or a glass substrate, the tape being formed of said insulation material in the form of thin film.
13. A method of manufacturing a wiring electronic component according to claim 12, wherein a seed layer of metal is formed on the insulation material, and the vertical wiring portions and the horizontal wiring portions are grown on the seed layer through plating.
14. A method of manufacturing a wiring electronic component according to claim 9, further comprising:
connecting one or more of the vertical wiring portions to the semiconductor chip with each of the vertical wiring portions connected to the reinforcement plate;
removing said reinforcement plate after said one or more of the vertical wiring portions is connected to the semiconductor chip such that said insulation material remains connected to the semiconductor chip and said one or more of the vertical wiring portions is disconnected from said reinforcement plate.
15. A method of manufacturing a wiring electronic component according to claim 14, further comprising:
filling a space defined by at least the semiconductor chip and said insulation material with resin prior to removing said reinforcement plate, said resin engaging the semiconductor chip and said insulation material.
16. A method of manufacturing a wiring electronic component, the method comprising:
providing a semiconductor chip;
providing a support portion comprising a reinforcement plate, a separable adhesive and insulation material, said reinforcement plate being detachably connected to a rear side of said insulation material via said separable adhesive;
forming a plurality of vertical wiring portions for vertical wiring via plating such that the vertical wiring portions are detachably connected to the support portion;
connecting said support portion to said semiconductor chip, wherein each of said plurality of vertical wiring portions is connected to said semiconductor chip;
removing said reinforcement plate from said insulation material with each of said plurality of vertical wiring portions connected to said semiconductor chip such that said reinforcement plate is disconnected from said insulation material and each of said plurality of said vertical wiring portions, wherein each of said wiring portions remains connected to said insulation material with said reinforcement plate removed from said insulation material.
17. A method of manufacturing a wiring electronic component according to claim 16, further comprising:
filling a space defined by at least said semiconductor chip and said insulation material with resin prior to removing said reinforcement plate, said resin engaging the semiconductor chip and said insulation material.
18. A method of manufacturing a wiring electronic component according to claim 17, further comprising:
forming horizontal wiring portions, each of said horizontal wiring portions engaging one of said vertical wiring portions, said insulation material comprising another side opposite said rear side, each of said horizontal wiring portions engaging said another side, each of said horizontal wiring portions being connected to said semiconductor substrate via one of said vertical wiring portions.