1. A curable silicone composition for sealing an optical semiconductor element, the composition comprising:
(A) an organopolysiloxane that has a viscosity at 25\xb0 C. of 50 to 100,000 mPa\xb7s, that has at least two silicon-bonded vinyl groups in one molecule, that has C1-10 alkyl for the other silicon-bonded organic groups therein, and that lacks a siloxane unit represented by the following formula: SiO42;
(B) an organopolysiloxane represented by the following average unit formula:
(ViR2SiO12)a (R3SiO12)b (SiO42)c (HO12)d
wherein Vi is a vinyl group; each R is independently a C1-10 alkyl group; and a, b, c, and d are each positive numbers that satisfy: a+b+c=1, a(a+b)=0.15 to 0.35, c(a+b+c)=0.53 to 0.62, and d(a+b+c)=0.005 to 0.03, at from 15 to 35 mass % of the total of components (A) and (B);
(C) an organopolysiloxane that has at least three silicon-bonded hydrogen atoms in one molecule, that has C1-10 alkyl for the silicon-bonded organic groups therein, and that contains from 0.7 to 1.6 mass % of silicon-bonded hydrogen atoms, in a quantity that provides from 0.8 to 2.0 moles silicon-bonded hydrogen atoms in this component per 1 mole of the total vinyl groups in components (A) and (B); and
(D) a hydrosilylation reaction catalyst, in a quantity sufficient to cure the composition;
wherein a viscosity at 25\xb0 C. of the composition lacking component (D) is from 3,000 to 10,000 mPa\xb7s and, letting \u03b725\xb0 C. be this viscosity in mPa\xb7s and letting \u03b7100\xb0 C. be a viscosity in mPa\xb7s at 100\xb0 C. of the composition lacking component (D), a value of the following formula: Log10 \u03b7100\xb0 C.Log10 \u03b725\xb0 C.
is 0.830 to 0.870.
2. The composition according to claim 1, that cures to form a silicone cured product that has a type A durometer hardness as specified in JIS K 6253 of from 60 to 80.
3. A method of producing a resin-sealed optical semiconductor element, the method comprising resin-sealing an optical semiconductor element using the composition according to claim 1 to produce the resin-sealed optical semiconductor element, wherein resin-sealing occurs at a temperature that yields a gel time of 30 to 120 seconds by the hot plate method specified in JIS C 2105.
4. A resin-sealed optical semiconductor element produced by the method according to claim 3.
5. The method according to claim 3, wherein resin-sealing is accomplished by transfer molding the composition according to claim 1.
6. The method according to claim 3, wherein resin-sealing is accomplished by compression molding the composition according to claim 1.
7. The method according to claim 3, wherein the optical semiconductor element is a light emitting diode (LED).
8. The composition according to claim 1, wherein component (A) comprises at least one of the following organopolysiloxanes, with Vi representing a vinyl group and Me representing a methyl group:
ViMe2SiO(Me2SiO)160SiMe2Vi;
ViMe2SiO(Me2SiO)310SiMe2Vi;
ViMe2SiO(Me2SiO)515SiMe2Vi;
ViMe2SiO(Me2SiO)800SiMe2Vi;
Me3SiO(Me2SiO)140(MeViSiO)20SiMe3;
ViMe2SiO(Me2SiO)500(MeViSiO)15SiMe2Vi;
ViMe2SiO(Me2SiO)780(MeViSiO)20SiMe2Vi;
MeSi{O(Me2SiO)80SiMe2Vi}3; and
Si{O(Me2SiO)60SiMe2Vi}4.
9. The composition according to claim 8, wherein component (B) comprises at least one of the following organopolysiloxanes, with Vi representing a vinyl group and Me representing a methyl group:
(ViMe2SiO12)0.10(Me3SiO12)0.32(SiO42)0.58(HO12)0.02;
(ViMe2SiO12)0.15(Me3SiO12)0.29(SiO42)0.56(HO12)0.01; and
(ViMe2SiO12)0.11(Me3SiO12)0.33(SiO42)0.56(HO12)0.01.
10. The composition according to claim 9, wherein component (C) comprises at least one of the following organopolysiloxanes, with Me representing a methyl group:
Me3SiO(Me2SiO)5(MeHSiO)5SiMe3;
Me3SiO(MeHSiO)14SiMe3; and
Me3SiO(MeHSiO)50SiMe3.
11. The composition according to claim 1, wherein component (B) comprises at least one of the following organopolysiloxanes, with Vi representing a vinyl group and Me representing a methyl group:
(ViMe2SiO12)0.10(Me3SiO12)0.32(SiO42)0.58(HO12)0.02;
(ViMe2SiO12)0.15(Me3SiO12)0.29(SiO42)0.56(HO12)0.01; and
(ViMe2SiO12)0.11(Me3SiO12)0.33(SiO42)0.56(HO12)0.01.
12. The composition according to claim 1, wherein component (C) comprises at least one of the following organopolysiloxanes, with Me representing a methyl group:
Me3SiO(Me2SiO)5(MeHSiO)5SiMe3;
Me3SiO(MeHSiO)14SiMe3; and
Me3SiO(MeHSiO)50SiMe3.
13. The composition according to claim 1, wherein Log10 \u03b7100\xb0 C.Log10 \u03b725\xb0 C. is 0.840 to 0.860.
14. The composition according to claim 1, further comprising:
i) a reaction inhibitor;
ii) an adhesion promoter; or
iii) both i) and ii).
15. A silicone cured product formed from the composition according to claim 1, wherein the product has a type A durometer hardness as specified in JIS K 6253 of from 60 to 80.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method performed by one or more computing systems comprising:
determining a population of users performing online actions;
selecting from the population of users, a group of users that have performed particular time-based user actions that relate to a user behavior;
predicting a subsequent user action based at least in part upon the user behavior.