1. A method for a configuration management program transmitting a system information, comprising:
providing a first memory, wherein the first memory records at least one system information;
enabling an interrupt from the configuration management program, wherein the interrupt has a command information; and
processing the interrupt by an interrupt processing program, so as to perform a corresponding configuration setting operation according to the command information or to return the corresponding system information in the first memory to the configuration management program according to the command information.
2. The method for the configuration management program transmitting the system information of claim 1, further comprising:
testing a computer system to obtain at least a system information; and
recording the system information in the first memory.
3. The method for the configuration management program transmitting the system information of claim 2, wherein the step of testing the computer system comprises:
performing a power-on self-test procedure; and
in the power-on self-test procedure, testing a configuration of the computer system by a basic input output system to obtain the system information.
4. The method for the configuration management program transmitting the system information of claim 1, wherein the interrupt is a system management interrupt, and the interrupt processing program is a system management interrupt handler.
5. The method for the configuration management program transmitting the system information of claim 1, wherein the command information comprises a command, and the step of enabling the interrupt from the configuration management program comprises:
writing the command to an interrupt control port,
wherein the interrupt processing program executes the command in the interrupt control port, so as to perform the corresponding configuration setting operation according to the command or to return the corresponding system information in the first memory to the configuration management program according to the command.
6. The method for the configuration management program transmitting the system information of claim 1, wherein the command information comprises a command and a first parameter, and the step of enabling an interrupt from the configuration management program comprises:
writing the first parameter to an interrupt data port; and
writing the command to an interrupt control port,
wherein the interrupt processing program executes the command in the interrupt control port according to the first parameter in the interrupt data port, so as to perform the corresponding configuration setting operation according to the first parameter and the command or to write the corresponding system information in the first memory to the interrupt data port according to the first parameter and the command.
7. The method for the configuration management program transmitting the system information of claim 6, further comprising:
reading the system information from the interrupt data port by the configuration management program.
8. The method for the configuration management program transmitting the system information of claim 6, wherein the interrupt data port is an input output port having an address of B3h.
9. The method for the configuration management program transmitting the system information of claim 6, wherein the interrupt control port is an input output port having an address of B2h.
10. The method for the configuration management program transmitting the system information of claim 6, further comprising:
writing a second parameter to a second memory,
wherein the interrupt processing program executes the command in the interrupt control port according to the first parameter in the interrupt data port and the second parameter in the second memory, so as to perform the corresponding configuration setting operation according to the first parameter, the second parameter and the command or to write the corresponding system information in the first memory to the second memory according to the first parameter, the second parameter and the command.
11. The method for the configuration management program transmitting the system information of claim 10, further comprising:
reading the system information from the second memory by the configuration management program.
12. The method for the configuration management program transmitting the system information of claim 10, wherein the second memory is an extended basic input output system data area.
13. The method for the configuration management program transmitting the system information of claim 1, wherein the first memory is a system management mode memory.
14. The method for the configuration management program transmitting the system information of claim 1, wherein the configuration management program is a program of an advanced configuration and power interface.
15. A computer accessible storage medium used for storing a computer program, wherein the computer program is used to be loaded to a computer system so that the computer system executes the method for the configuration management program transmitting the system information of claim 1.
16. A product of a computer program used for a configuration management program transmitting a system information, after a computer loads and executes the computer program, completing the method for the configuration management program transmitting the system information of claim 1.
17. A computer system, comprising:
a first memory, for recording a system information;
a configuration management program module, for executing a configuration management program, so as to enable an interrupt, wherein the interrupt has a command information; and
an interrupt processing program module, for executing an interrupt processing program to process the interrupt, so as to perform a corresponding configuration setting operation according to the command information or to return the corresponding system information in the first memory to the configuration management program module according to the command information.
18. The computer system of claim 17, further comprising a testing module used to test the computer system, so as to obtain at least one system information and to record the system information in the first memory.
19. The computer system of claim 18, wherein the testing module performs a power-on self-test procedure, and in the power-on self-test procedure, a basic input output system tests a configuration of the computer system, so as to obtain the system information.
20. The computer system of claim 17, wherein the interrupt is a system management interrupt, and the interrupt processing program is a system management interrupt handler.
21. The computer system of claim 17, wherein the command information comprises a command, the computer system further comprising an interrupt control port used to store the command, wherein the interrupt processing program module executes the command in the interrupt control port, so as to perform the corresponding configuration setting operation according to the command or to return the corresponding system information in the first memory to the configuration management program module according to the command.
22. The computer system of claim 17, wherein the command information comprises a command and a first parameter, the computer system further comprising:
an interrupt data port, for storing the first parameter; and
an interrupt control port, for storing the command,
wherein the interrupt processing program module executes the command in the interrupt control port according to the first parameter in the interrupt data port, so as to perform the corresponding configuration setting operation according to the first parameter and the command or to write the corresponding system information in the first memory to the interrupt data port according to the first parameter and the command.
23. The computer system of claim 22, wherein the configuration management program module reads the system information from the interrupt data port.
24. The computer system of claim 22, wherein the interrupt data port is an input output port having an address of B3h.
25. The computer system of claim 22, wherein the interrupt control port is an input output port having an address of B2h.
26. The computer system of claim 22, further comprising a second memory used to store a second parameter, wherein the interrupt processing program module executes the command in the interrupt control port according to the first parameter in the interrupt data port and the second parameter in the second memory, so as to perform the corresponding configuration setting operation according to the first parameter, the second parameter and the command or to write the corresponding system information in the first memory to the second memory according to the first parameter, the second parameter and the command.
27. The computer system of claim 26, wherein the configuration management program module reads the system information from the second memory.
28. The computer system of claim 26, wherein the second memory is an extended basic input output system data area.
29. The computer system of claim 17, wherein the first memory is a system management mode memory.
30. The computer system of claim 17, wherein the configuration management program is a program of an advanced configuration and power interface.
31. A method for a configuration management program transmitting a system information, comprising:
performing a power-on self-test procedure;
in the power-on self-test procedure, testing a configuration of the computer system by a basic input output system to obtain at least one system information;
providing a first memory to records the at least one system information;
writing the first parameter to an interrupt data port;
writing the command to an interrupt control port;
writing a second parameter to a second memory, wherein the interrupt processing program executes the command in the interrupt control port according to the first parameter in the interrupt data port and the second parameter in the second memory, so as to perform the corresponding configuration setting operation according to the first parameter, the second parameter and the command or to write the corresponding system information in the first memory to the second memory according to the first parameter, the second parameter and the command; and
reading the system information from the second memory by the configuration management program.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor package comprising:
a semiconductor chip;
a substrate attached to the semiconductor chip;
a wire electrically connecting the semiconductor chip to the substrate;
an external connection terminal electrically connecting the semiconductor chip to the outside; and
an encapsulant encapsulating the wire and surroundings of the wire, the encapsulant being formed of a plurality of insulators having different physical properties from each other.
2. The semiconductor package of claim 1, wherein the physical properties are moduli of the insulators.
3. The semiconductor package of claim 2, wherein the insulators comprise a first insulator and a second insulator covering the first insulator, and the first insulator has a modulus less than that of the second insulator.
4. The semiconductor package of claim 3, wherein the insulators further comprises a third insulator interposed between the first and second insulators and having a modulus greater than that of the first insulator and less than that of the second insulator.
5. A semiconductor package comprising:
a semiconductor chip;
a substrate attached to the semiconductor chip and including a window exposing a portion of the semiconductor chip;
a wire electrically connecting the semiconductor chip to the substrate through the window;
an external connection terminal attached to the substrate to electrically connect the semiconductor chip to the outside; and
an encapsulant including a plurality of insulators with different moduli from each other, the encapsulant encapsulating the window.
6. The semiconductor package of claim 5, wherein the insulators comprise:
a first insulator covering a central portion of the semiconductor chip exposed through the window and having a first modulus; and
a second insulator covering the first insulator and having a second modulus greater than the first modulus.
7. The semiconductor package of claim 6, wherein the first insulator comprises a thermosetting resin having a modulus ranging from 3 MPa to 300 MPa, and the second insulator comprises a thermosetting resin having a modulus ranging from 5 GPa to 10 GPa.
8. The semiconductor package of claim 7, wherein the thermosetting resin of the first insulator comprises a silicon resin, and the thermosetting resin of the second insulator comprises an epoxy resin.
9. The semiconductor package of claim 6, wherein the insulators further comprise a third insulator interposed between the first and second insulators and having a third modulus greater than the first modulus and less than the second modulus.
10. The semiconductor package of claim 5, wherein the first insulator occupies 50% through 70% of the total volume of the window.
11. The semiconductor package of claim 5, wherein the semiconductor chip comprises an active surface to which the substrate is attached and an inactive surface opposite to the active surface, a central portion of the active surface comprising a first pad electrically connected to the wire.
12. The semiconductor package of claim 11, wherein the substrate comprises a bottom surface attached to the active surface of the semiconductor chip and a top surface opposite to the bottom surface, the top surface comprising a second pad electrically connected to the first pad.
13. The semiconductor package of claim 12, wherein the external connection terminal is attached to the top surface of the substrate so that the external connection terminal is disposed in an outside of the semiconductor chip.
14. The semiconductor package of claim 12, wherein the bottom surface of the substrate comprises a third pad disposed in an outside of the semiconductor chip.
15. A method for manufacturing a semiconductor package, the method comprising:
attaching a substrate including a window to the semiconductor chip;
electrically connecting the semiconductor chip to the substrate through the window;
primarily encapsulating a portion of the window with a first insulator having a first modulus;
secondarily encapsulating the first insulator with a second insulator having a second modulus greater than the first modulus; and
attaching an external connection terminal to the substrate.
16. The method of claim 15, wherein the attaching of the substrate including the window to the semiconductor chip comprises;
interposing an adhesive between the active surface of the semiconductor chip and the bottom surface of the substrate to adhere an active surface of the semiconductor chip to a bottom surface of the substrate so that a portion of the active surface of the semiconductor chip is exposed through the window.
17. The method of claim 16, wherein the electrically connecting of the semiconductor chip to the substrate comprises;
electrically connecting the portion of the active surface of the semiconductor chip exposed through the window to a top surface of the substrate using a conductive wire passing through the window.
18. The method of claim 16, wherein the primary encapsulating comprises:
selecting a silicon resin as the first insulator;
forming the silicon resin on the active surface of the semiconductor chip exposed through the window, so as to fill 50% through 70% of the total volume of the window with the silicon resin; and
curing the silicon resin.
19. The method of claim 18, wherein the secondary encapsulating comprises:
selecting an epoxy resin as the second insulator;
forming the epoxy resin on the silicon resin; and
curing the epoxy resin.
20. The method of claim 15, wherein the attaching of the external connection terminal comprises;
attaching the external connection terminal to a top surface of the substrate so that the external connection terminal is disposed in the outside of the semiconductor chip.
21. The method of claim 15, further comprising encapsulating the first insulator with a third insulator having a third modulus greater than the first modulus and less than the second modulus, after the primary encapsulating and before the second encapsulating.