1. A printed wiring board comprising:
an outermost inter resin insulating layer;
an outermost conductor circuit formed on the outermost inter resin insulating layer and having a part extending on an upper surface of the outermost inter resin insulating layer;
an insulating solder resist disposed on the outermost inter resin insulating layer and the outermost conductor circuit;
at least one opening portion formed in the solder resist and partially exposing said part of the outermost conductor circuit extending on the upper surface of the outermost inter resin insulating layer; and
a single metal layer of tin or noble metal provided on a topmost exposed section of the outermost conductor circuit.
2. The printed wiring board according to claim 1, wherein said noble metal is one of gold, silver, platinum and palladium.
3. The printed wiring board according to claim 1, wherein said metal layer has a thickness of 0.01 to 3 \u03bcm.
4. The printed wiring board according to claim 1, wherein a surface of said conductor circuit is roughened.
5. The printed wiring board according to claim 1, further comprising:
a solder bump connected to the metal layer and comprising eutectic metals including at least one of SnPb, SnSb, SnAg, and SnAgCu.
6. The printed wiring board according to claim 1, further comprising:
a solder bump connected to the metal layer and comprising eutectic metals including at least one of SnPb, SnSb, SnAg, and SnAgCu, wherein said metal layer comprises tin.
7. The printed wiring board according to claim 1, further comprising:
a solder bump connected to the metal layer and-comprising eutectic metals including at least one of SnAg and SnAgCu, wherein said metal layer comprises silver.
8. The printed wiring board according to claim 5, wherein the solder bump is formed over the topmost exposed section of the conductor circuit.
9. The printed wiring board according to claim 1, wherein said conductor circuit comprises a sputtering layer and an electroplating layer.
10. The printed wiring board according to claim 7, wherein the solder bump is formed over the exposed section of the conductor circuit.
11. The printed wiring board according to claim 1, wherein the conductor circuit comprises a solder pad extending on a part of the inter resin insulating layer.
12. A printed wiring board comprising:
a first inter resin insulating layer;
a first conductor circuit formed on the first inter resin layer;
a second inter resin insulating layer disposed on the first inter resin insulating layer and the first conductor circuit;
a second conductor circuit formed on the second inter resin insulating layer;
a via hole electrically connecting the first conductor circuit and the second conductor circuit;
a part of the second conductor connected to the via hole and extending on an upper surface of the second inter resin insulating layer;
an insulating solder resist layer disposed on the second inter resin insulating layer and the second conductor circuit;
at least one opening portion formed in the insulating solder resist , partially exposing said part of the second conductor circuit extending on the upper surface of the second inter resin insulating layer, and exposing a surface of the via hole; and
a single metal layer of tin or noble metal provided on a topmost exposed section of the second conductor circuit and the via hole.
13. The printed wiring board according to claim 12, wherein said noble metal is one of gold, silver, platinum and palladium.
14. The printed wiring board according to claim 12, wherein said metal layer has a thickness of 0.01 to 3 \u03bcm.
15. The printed wiring board according to claim 12, wherein surfaces of the first and second conductor circuits and the via hole are roughened.
16. The printed wiring board according to claim 12, further comprising:
a solder bump comprising eutectic metals including at least one of SnPb, SnSb, SnAg, and SnAgCu.
17. The printed wiring board according to claim 16, wherein the solder bump is formed over the topmost exposed section of the second conductor circuit and the via hole.
18. The printed wiring board according to claim 12, wherein the conductor circuit comprises a solder pad extending on a part of the second inter resin insulating layer.
19. The printed wiring board according to claim 18, wherein the solder bump connects to the solder pad.
20. The printed wiring board according to claim 12, wherein the metal layer comprises at least one of tin and silver.
21. The printed wiring board according to claim 1, further comprising a solder bump formed on the single metal layer to mount an IC chip.
22. The printed wiring board according to claim 12, further comprising a solder bump formed on the single metal layer to mount an IC chip.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of producing compounds of the formula
XPR2(OR1)\u2003\u2003Ia
where X is chlorine, bromine or iodine and R1 is an organic radical which comprises reacting a compound of the a formula
X2PR2\u2003\u2003II,
in which X has the meaning given above and R2 is an organic radical, with a compound of the formula
R1OH\u2003\u2003III,
in which R1 has the meaning given above, to give a mixture IV, wherein
a) the postreaction is carried out at a temperature of from 50 to 240\xb0 C. and a pressure of from 0.001 to 0.9 bar,
b) from the mixture IV the compound Ia is separated off from the compound
PR2(OR1)2\u2003\u2003Ib
and, optionally the compounds II and
c) compounds Ib and optionally unreacted compounds II are returned to the synthesis stage.
2. The method according to claim 1, wherein the postreaction is carried out above the boiling points of compounds II and III under reflux of some of the reaction mixture.
3. The method according to claim 1, wherein the postreaction is carried out below the boiling points of compounds Ia and Ib under reflux of some of the reaction mixture.
4. The method according to claim 1, wherein the organic radicals R1 and R2 used are, independently of one another, C1- to C18-alkyl radicals or aromatic radicals.
5. The method according to claim 4, wherein R1 and R2 are phenyl or naphthyl radicals which may be substituted in the o-, m- andor p-position by alkyl or alkoxy groups.
6. The method according to claim 1, wherein R1 is ortho-tert-butylphenyl.
7. The method according to claim 1, wherein X is chlorine.
8. The method according to claim 1, wherein R2 is phenyl.
9. The method according to claim 1, wherein the reaction is carried out at a temperature of from 120 to 200\xb0 C.
10. The method according to claim 1, wherein the reaction is carried out at a pressure of from 0.005 to 0.4 bar.
11. The method according to claim 6, wherein X is chlorine.
12. The method according to claim 11, wherein R2 is phenyl.
13. The method according to claim 12, wherein the reaction is carried out at a temperature of from 120 to 200\xb0 C.
14. The method according to claim 13, wherein the reaction is carried out at a pressure of from 0.005 to 0.4 bar.
15. The method according to claim 1, wherein the reaction is carried out continuously.
16. The method according to claim 1, wherein the reaction is carried out as a batch process.
17. The method according to claim 1, wherein the reaction is carried out at a temperature of from 80 to 210\xb0 C.