What is claimed is:
1. A method of manufacturing a semiconductor device in such a manner of forming an upper layer wiring on an inter-layer insulating film covering a lower layer wiring, forming a via-plug in a via-hole formed in said inter-layer insulating film, and interconnecting said lower layer wiring and said upper layer wiring through said via-plug, said method comprising:
a via-hole forming step for forming said via-hole in said inter-layer insulating film in such a manner as to expose said lower layer wiring;
a barrier film forming step for forming a barrier film throughout a surface including said via-hole;
a conductive film forming step for forming a conductive film on said barrier film;
a first polishing step for polishing and removing said conductive film on said barrier film until said barrier film is exposed by a chemical mechanical polishing method using such a polishing liquid that said conductive film may have a higher polishing rate than said barrier film; and
a second polishing step for removing said barrier film on said inter-layer insulating film by a chemical mechanical polishing method using such a polishing liquid that said conductive film may have a lower polishing rate than said barrier film, to leave said conductive film as non-removed only in said via-hole via said barrier film, thus forming said via-plug.
2. The method of manufacturing a semiconductor device according to claim 1, wherein said second polishing step is performed with a pressure of 4-10 Psi (Pounds per square inch) applied on said barrier film on said inter-layer insulating film.
3. The method of manufacturing a semiconductor device according to claim 1, wherein said second polishing step is followed by an upper layer wiring forming step for forming said upper layer wiring on said inter-layer insulating film in such a manner that said upper layer wiring may connect to said via-plug.
4. The method of manufacturing a semiconductor device according to claim 1, wherein said barrier film comprises tantalum-based metal and said conductive film comprises copper-based metal.
5. The method of manufacturing a semiconductor device according to claim 1, wherein said lower layer wiring and said upper layer wiring comprise respectively copper-based metal.
6. A method of manufacturing a semiconductor device in such a manner of forming an upper layer wiring on an inter-layer insulating film covering a lower layer wiring, forming a via-plug in a via-hole formed in said inter-layer insulating film, and interconnecting said lower layer wiring and said upper layer wiring through said via-plug, comprising:
a via-hole forming step for forming said via-hole in said inter-layer insulating film in such a manner as to expose said lower layer wiring;
a barrier film forming step for forming a barrier film throughout a surface including said via-hole;
a conductive film forming step for forming a conductive film on said barrier film;
a first polishing step for polishing and removing said conductive film on said barrier film until said barrier film is exposed by a chemical mechanical polishing method using a polishing liquid to which hydrogen peroxide is added by 1.5 weight-percent or more; and
a second polishing step for removing said barrier film on said inter-layer insulating film by a chemical mechanical polishing method using a polishing liquid to which hydrogen peroxide is added by 0.09-1.5 weight-percent, to leave said conductive film as non-removed only in said via-hole via said barrier film, thus forming said via-plug.
7. The method of manufacturing a semiconductor device according to claim 6, wherein said second polishing step is performed with a pressure of 4-10 Psi applied on said barrier film on said inter-layer insulating film.
8. The method of manufacturing a semiconductor device according to claim 6, wherein said second polishing step is followed by an upper layer wiring forming step for forming said upper layer wiring on said inter-layer insulating film in such a manner that said upper layer wiring may connect to said via-plug.
9. The method of manufacturing a semiconductor device according to claim 6, where said barrier film comprises tantalum-based metal and said conductive film comprises copper-based metal.
10. The method of manufacturing a semiconductor device according to claim 6, wherein said lower layer wiring and said upper layer wiring comprise respectively copper-based metal.
11. A method of manufacturing a semiconductor device in such a manner of forming an upper layer wiring on an inter-layer insulating film covering a lower layer wiring, forming a via-plug in a via-hole formed in said inter-layer insulating film, and interconnecting said lower layer wiring and said upper layer wiring through said via-plug, comprising:
a via-hole forming step for forming said via-hole in said inter-layer insulating film in such a manner as to expose said lower layer wiring;
a barrier film forming step for forming a barrier film throughout a surface including said via-hole;
a conductive film forming step for forming a conductive film on said barrier film;
a first polishing step for polishing and removing said conductive film on said barrier film until said barrier film is exposed by a chemical mechanical polishing method using a polishing liquid to which hydrogen peroxide is added by 1.5 weight-percent or more; and
a second polishing step for removing said barrier film on said inter-layer insulating film by a chemical mechanical polishing method using a polishing liquid containing no hydrogen peroxide, to leave said conductive film as non-removed only in said via-hole via said barrier film, thus forming said via-plug.
12. The method of manufacturing a semiconductor device according to claim 11, wherein said second polishing step is performed with a pressure of 4-10 Psi applied on said barrier film on said inter-layer insulating film.
13. The method of manufacturing a semiconductor device according to claim 11, wherein said second polishing step is followed by an upper layer wiring forming step for forming said upper layer wiring on said inter-layer insulating film in such a manner that said upper layer wiring may connect to said via-plug.
14. The method of manufacturing a semiconductor device according to claim 11, where said barrier film comprises tantalum-based metal and said conductive film comprises copper-based metal.
15. The method of manufacturing a semiconductor device according to claim 11, wherein said lower layer wiring and said upper layer wiring comprise respectively copper-based metal.
16. A method of manufacturing a semiconductor device in such a manner of forming a wiring trench in an insulating film covering a surface of a semiconductor substrate, then forming a barrier film and a conductive film sequentially throughout a surface including said wiring trench, and then sequentially polishing said conductive film and said barrier film exposed above the surface of said wiring trench utilizing a chemical mechanical polishing method to thereby form an embedded wiring, comprising:
a first chemical mechanical polishing step for polishing and removing said conductive film exposed above said surface of said wiring trench; and
a second chemical mechanical polishing step for removing said barrier film exposed above said surface of said wiring trench by using a polishing liquid to which hydrogen peroxide is added by 0.09-1.5 weight-percent, to leave said conductive film as non-removed only in said wiring trench via said barrier film, thus forming said embedded wiring.
17. The method of manufacturing a semiconductor device according to claim 16, wherein said second chemical mechanical polishing step is performed with a pressure of 4-10 Psi applied on said barrier film exposed above said surface of said wiring trench.
18. The method of manufacturing a semiconductor device according to claim 16, wherein said barrier film comprises tantalum-based metal and said conductive film comprises copper-based metal.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1-109. (canceled)
110. An instrument for fastening tissue within a body, comprising:
an elongated tube having a proximal end for extending outside of the body and a distal end for positioning proximate the tissue;
a distal member configured to fold the tissue together, the distal member comprising:
a first member having a proximal end coupled to the distal end of the tube; and
a second member pivotably coupled to the distal end of the first member, wherein the first and second members are configured to install at least one fastener; and
a grasper coupled to at least one of the first member and the second member,
wherein the second member is pivotable between an open position for receiving tissue and a closed position for folding tissue therebetween, and wherein the grasper is configured to project outward from at least one of the first member and the second member when in the open position.
111. The instrument of claim 110, wherein the elongated tube is flexible to insert in the body transorally and extend through the esophagus and into the stomach.
112. The instrument of claim 110, wherein the elongated tube includes a lumen to receive an endoscope.
113. The instrument of claim 110, wherein the grasper is rotatably coupled to at least one of the first member and the second member.
114. The instrument of claim 110, wherein the grasper is configured to project outward from the second member when in the open position.
115. The instrument of claim 110, wherein the first and second members are configured to install multiple fasteners.
116. The instrument of claim 110, wherein one or more flexible wires extend through the elongated tube for manipulating the second member relative to the first member.
117. An instrument for fastening tissue within a body, comprising:
an elongated tube having a proximal end for extending outside of the body and a distal end for positioning proximate the tissue;
a distal member configured to fold the tissue together, the distal member comprising:
a first member having a proximal end at the distal end of the tube; and
a second member pivotably coupled to the distal end of the first member and a free end configured to be positioned distally of the first member during insertion of the elongated tube in the body, wherein the first and second members are configured to receive a fastener for fastening the tissue; and
a grasper to extend from the second member and hold tissue,
wherein the second member is pivotable between an open position for receiving tissue and a closed position for folding tissue therebetween, and wherein the grasper is configured to project outward from the second member when in the open position.
118. The instrument of claim 117, wherein the elongated tube includes a lumen to receive an endoscope, the lumen terminating at an opening proximate a pivot point of the first and second members.
119. The instrument of claim 117, wherein the elongated tube is flexible to insert in the body transorally and extend through the esophagus and into the stomach.
120. The instrument of claim 117, wherein the grasper is rotatably coupled to the second member.
121. The instrument of claim 117, wherein the first and second members are configured to receive a plurality of fasteners.
122. The instrument of claim 117, wherein one or more flexible wires extend through the elongated tube for manipulating the second member relative to the first member.
123. An instrument for fastening tissue within a body, comprising:
an elongated tube having a proximal end and a distal end;
a distal member coupled proximate the distal end of the tube and configured to fold a fundus of a stomach toward an esophageal wall, the distal member including a first member and a second member pivotally coupled to the first member, the distal member being configured to install at least one fastener into the folded fundus and esophageal wall, the second member having a connected end and a free end, the second member being configured to pivot between a first position in which the free end is located distally of the connected end and a second position in which the connected end is located distally of the free end; and
a grasper configured to grasp at least a portion of the fundus or the esophageal wall; wherein the grasper is coupled to one of the elongated tube and the distal member, and wherein the second member has a first surface facing a second surface of the stationary member in the second position, the grasper being disposed between the first and second surfaces in the second position.
124. The instrument of claim 123, wherein the grasper includes a first grasping member rotatably coupled to the first member.
125. The instrument of claim 123, wherein the elongated tube is flexible to insert in the body transorally and extend through the esophagus and into the stomach.
126. The instrument of claim 123, wherein the elongated tube includes a lumen to receive an endoscope.
127. The instrument of claim 123, wherein the grasper is configured to project outward from the second member when in the second position.
128. The instrument of claim 123, wherein the first and second members are configured to install multiple fasteners.
129. The instrument of claim 123, wherein one or more flexible wires extend through the elongated tube for manipulating the second member relative to the first member.