1. A simulation model for simulating an integrated circuit (IC) in a ball grid array package, the simulation model implemented using a simulator, comprising:
an inputoutput model comprising mathematical elements enabled to model input and output characteristics of the integrated circuit:
a bump model enabled to simulate parasitic characteristics of a solder bump connection, the bump model comprising a resistance coupled in series with an inductance, the bump model connected to the inputoutput model; and
a package planes model enabled to simulate effects of package planes on operation of the integrated circuit, the package planes model connected to the bump model;
wherein the package planes model comprises:
a first inductor connecting signal planes to ground; and
a second inductor connecting the signal planes to power, wherein the package planes model represents power, ground and signal planes in the IC of the package.
2. The simulation model of claim 1, further comprising a package bypass capacitor model wherein the model comprises a capacitor connected between the ground plane and the power plane.
3. The simulation model of claim 1, wherein the package bypass capacitor model further comprises an inductor connected in series with the capacitor between the ground plane and the power plane.
4. The simulation model of claim 3, wherein the package bypass capacitor model further comprises a resistor connected in series with the capacitor and the inductor.
5. The simulation model of claim 1, wherein the series connected inductor and resistor of the bump model further represents the inductance and resistance of solder bumps in the integrated circuit package.
6. The simulation model of claim 1, further comprising a ball model configured to simulate parasitic characteristics of a solder ball connection, the ball model comprising a plurality of series connected resistor and inductors, the ball model being connected to the package planes model.
7. The simulation model of claim 6, wherein the series connected inductor and resistor of the ball model further represents the inductance and resistance of solder balls in the IC package.
8. The simulation model of claim 1, wherein the package comprises a flip-chip ball grid array (FCBGA).
9. The simulation model of claim 1, wherein the first and second inductors are represented by a coupling factor.
10. The simulation model of claim 1, further comprising elements with values set to simulate the effect of power supply droop, ground bounce and cross talk.
11. The simulation model of claim 10, wherein the elements further comprise an inputoutput buffer used with the bump model.
12. The simulation model of claim 1, further comprising a printed circuit board (PCB) model comprising transmission lines for connecting to the ball model, the PCB model representing a board on which the integrated circuit package is mounted.
13. The simulation model of claim 12, wherein the PCB model further comprises a plurality of pairs of series connected inductors and resistors to represent vias in a PCB.
14. A method for simulating electrical properties of a system including an integrated circuit (IC) provided in a package with external connections to the package formed by a ball grid array, the method comprising:
modeling, using a simulator, balls of the ball grid array comprising a plurality of series connected resistor and inductor pairs, each series-connected pair representing a ball of the ball grid array; and
modeling package planes comprising transmission lines connected to the plurality of series-connected resistor and inductor pairs of the ball model, the modeling of the package planes representing power, ground and signal planes in the integrated circuit package;
wherein modeling of the package planes comprises generating a first inductance value representing the inductor connecting the signal planes to the ground plane and a second inductance value representing the inductor connecting the signal planes to the power plane.
15. The simulation method of claim 14, further comprising:
modeling bumps of the IC comprising a plurality of series connected resistor and inductor, each series representing a bump of the IC.
16. A non-transitory computer-readable medium having instructions which when executed on a computer perform a method comprising:
modeling balls of the ball grid array comprising a plurality of series connected resistor and inductor pairs, each series-connected pair representing a ball of the ball grid array; and
modeling package planes comprising transmission lines connected to the plurality of series-connected resistor and inductor pairs of the ball model, the modeling of the package planes representing power, ground and signal planes in the integrated circuit package;
wherein modeling of the package planes comprises generating a first inductance value representing the inductor connecting the signal planes to the ground plane and a second inductance value representing the inductor connecting the signal planes to the power plane.
17. The medium of claim 16, further comprising:
modeling bumps of the IC comprising a plurality of series connected resistor and inductor, each series representing a bump of the IC.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A composition having biocidal properties comprising:
pre-fabricated elastomeric particles,
a biocidal agent, and
an adhesive phase combining the pre-fabricated elastomeric particles and the biocidal agent,
wherein the pre-fabricated elastomeric particles and the adhesive phase are made of different materials, and
wherein the biocidal agent is present in the adhesive phase but is substantially absent from the pre-fabricated elastomeric particles.
2. The composition as claimed in claim 1, wherein the composition comprises, by weight,
about 78% to about 98% of the pre-fabricated elastomeric particles;
about 2.0% to about 20% of the adhesive phase; and
about 0.05% to about 2% of the biocidal agent.
3. The composition as claimed in claim 1, wherein the pre-fabricated elastomeric particles are about 0.2 to about 10.0 mm in diameter or length.
4. The composition as claimed in claim 1, wherein the pre-fabricated elastomeric particles comprise at least one selected from the group consisting of natural rubber, butadiene rubber, chloroprene rubber, chlorosulfonylpolyethelene rubber, epichlorohydrin rubber, ethylene-propylene diene rubber, ethylene vinyl acetate rubber, halo-butyl rubber, isobutene-isoprene rubber, nitrile-butadiene rubber, polyisoprene rubber, styrene-butadiene rubber, styrene-isoprene rubber, thermoplastic rubbers based on polyolefins, polyesters, styrene-butadiene polymers, polyurethanes, non-thermoplastic polyurethane rubbers, and plasticized polyvinyl chloride.
5. The composition as claimed in claim 1, wherein the pre-fabricated elastomeric particles are polymerized particles, recycled particles, pigmented particles, or mixtures thereof.
6. The composition as claimed in claim 1, wherein the adhesive phase comprises polyurethane.
7. The composition as claimed in claim 1, wherein the biocidal agent is selected from the group consisting of pyrithione acid, sodium pyrithione, potassium pyrithione, pyrithione disulfide magnesium sulfate, zinc pyrithione, silver in zeolite matrix, zinc in zeolite matrix, copper in zeolite matrix, tributyl tin oxide (TBTO), tributyl tin maleate (TBTM), para-chloro-xylene, hexachlorophene, 2,4,4\u2032 trichloro-2\u2032-hydroxydiphenyl ether (triclosan), imazalil sulphate, 3,5,3\u2032,4\u2032-tetrachlorosalicylanilide, N-nitroso-N-cyclohexyl hydroxylamine, 8-hydroxyquinoline, copper-8-hydroxy quinolinate, thiocarbamates, dithiocarbamates, zinc dimethyldithiocarbamate, 5-chloro-2-(2,4-dichlorophenoxy)phenol, polyhexamethylene biguanide hydrochloride, 2-phenylphenol, diiodomethyl-4-tolylsulfone, zinc-2-mercaptopyridine-N-oxide, N-alkyl-N,N-dimethyl-N-benzylammonium chloride, 3-(4-chlorophenyl)-1-(3,4-dichlorphenyl)urea (triclocarban), 2-(1,3-thiazol-4-yl)-1H-benzoimidazole (thiabendazole), 3-iodo-2-propynyl N-butylcarbamate, 3-benzobthien-2-yl-5,6-dihydro-1,4,2-oxathiazine 4-oxide, 2-(n-octyl)-3(2H)-isothiazolone (OIT), N-butyl-1,2-benzisothiazolin-3-one, 4,5-dichloro-2-octyl-3(2H)-isothiazolone, 2-methyl-4-isothiazoline-3-one cyclopropyl-N\u2032-(1,1-dimethylethyl)-6-methylthio-1,3,5-triazine-2,4-diamine, 1,3-dicyano-2,4,5,6-tetrachlorobenzene, 3,4,4\u2032-trichlorocarbanilide, 3-(3,4-dichlorophenyl)-1,1-dimethylurea (DIURON), 1 2-(2,4-dichlorophenyl)-4-propyl-1,2-dioxolan-2-ylmethyl-1H-1,2,4-triazole (propiconazole), 10,10-oxybisphenoxy arsine (OBPA), 1-(4-chlorophenyl)-4,4-dimethyl-3-(1,2,4-triazol-1-ylmethyl)pentan-3-ol (tebuconazole), 2-(thiocyanomethylthio)benzothiazole, 2,3,5,6 tetrachloro-4-(methyl sulphonyl)pyridine, 2,4,4-tricloro-2-hydroxydiphenylether, 4-chloro-3,5-dimethyl-phenol, 5-hydroxymethoxymethyl-1-1aza-3,7-dioxabicyclo-octane, 2,4,5,6-tetrachloro-1,3-benzenedicarbonitrile (chlorothalonil), bis(tri-n-butyltin)oxide, N-(fluorodichloromethylthio)phthalimide, N-(trichloromethyl-thio)-4-cyclohexene-1,2-dicarboximide, N,N-dimethyl dichlorophenyl urea, p-chloro-m-cresol, o-phenylphenol, pentachlorophenol, silver compounds, sodium-o-phenyl phenoxide, tebuconazole, tetrachloroisophthalonitrile, tetramethylthiuram disulfide and a mixture thereof.
8. The composition as claimed in claim 1, wherein the pre-fabricated elastomeric particles comprise recycled elastomeric particles and pigmented elastomeric particles, and wherein the composition comprises, by weight, about 68% to about 83% of the recycled elastomeric particles;
about 10% to about 15% of the pigmented elastomeric particles;
about 2.0% to about 20% of the adhesive phase; and
about 0.05% to about 2% of the biocidal agent.
9. The composition as claimed in claim 7, wherein
the recycled elastomeric particles comprise SBR;
the pigmented elastomeric particles comprise EPDM;
the polymeric binder comprises polyurethane; and
the biocidal agent is zinc pyrithione, N-butyl-1,2-benzisothiazolin-3-one, or silver.
10. A method for preparing an elastomeric composition, comprising:
(a) preparing elastomeric particles;
(b) mixing a biocidal agent, an adhesive phase and the elastomeric particles together to form a mixture; and
(c) curing or polymerizing the mixture of step (b) to form an elastomeric solid.
11. The method as claimed in claim 10, wherein step (b) is a two-step process comprising:
(i) preparing an adhesive phase solution by mixing an adhesive phase, a liquid carrier and a biocidal agent, and
(ii) adding the adhesive phase solution comprising the biocidal agent to elastomeric particles, and
wherein the curing of step (c) is carried out under compression.
12. The method as claimed in claim 10, wherein the elastomeric particles of step (a) are prepared by granulation of a reclaimed elastomeric product.
13. The method as claimed in claim 10, wherein step (b) is carried out with about 0.05 to about 2 weight % of the biocidal agent, about 2.0 to about 20 weight % of the adhesive phase, and about 78% to about 98% of the elastomeric particles.
14. The method as claimed in claim 10, wherein the elastomeric particles are prepared from rubber selected from the group consisting of natural rubber, butadiene rubber, chloroprene rubber, chlorosulfonylpolyethelene rubber, epichlorohydrin rubber, ethylene-propylene diene rubber, ethylene vinyl acetate rubber, halo-butyl rubber, isobutene-isoprene rubber, nitrile-butadiene rubber, polyisoprene rubber, styrene-butadiene rubber, styrene-isoprene rubber, thermoplastic rubbers based on polyolefins, polyesters, styrene-butadiene polymers, polyurethanes, non-thermoplastic polyurethane rubbers, and plasticized polyvinyl chloride.
15. The method as claimed in claim 10, wherein the elastomeric particles are polymerized particles, recycled particles, pigmented particles or mixtures thereof.
16. The method as claimed in claim 10, wherein the adhesive phase comprises polyurethane.
17. The method as claimed in claim 10, wherein the biocidal agent is selected from the group consisting of pyrithione acid, sodium pyrithione, potassium pyrithione, pyrithione disulfide magnesium sulfate, zinc pyrithione, silver in zeolite matrix, zinc in zeolite matrix, copper in zeolite matrix, tributyl tin oxide (TBTO), tributyl tin maleate (TBTM), para-chloro-xylene, hexachlorophene, 2,4,4\u2032 trichloro-2\u2032-hydroxydiphenyl ether (triclosan), imazalil sulphate, 3,5,3\u2032,4\u2032-tetrachlorosalicylanilide, N-nitroso-N-cyclohexyl hydroxylamine, 8-hydroxyquinoline, copper-8-hydroxy quinolinate, thiocarbamates, dithiocarbamates, zinc dimethyldithiocarbamate, 5-chloro-2-(2,4-dichlorophenoxy)phenol, polyhexamethylene biguanide hydrochloride, 2-phenylphenol, diiodomethyl-4-tolylsulfone, zinc-2-mercaptopyridine-N-oxide, N-alkyl-N,N-dimethyl-N-benzylammonium chloride, 3-(4-chlorophenyl)-1-(3,4-dichlorphenyl)urea (triclocarban), 2-(1,3-thiazol-4-yl)-1H-benzoimidazole (thiabendazole), 3-iodo-2-propynyl N-butylcarbamate, 3-benzobthien-2-yl-5,6-dihydro-1,4,2-oxathiazine 4-oxide, 2-(n-octyl)-3(2H)-isothiazolone (OIT), N-butyl-1,2-benzisothiazolin-3-one, 4,5-dichloro-2-octyl-3(2H)-isothiazolone, 2-methyl-4-isothiazoline-3-one cycloprop yl-N\u2032-(1,1-dimethylethyl)-6-methylthio-1,3,5-triazine-2,4-diamine, 1,3-dicyano-2,4,5,6-tetrachlorobenzene, 3,4,4\u2032-trichlorocarbanilide, 3-(3,4-dichlorophenyl)-1,1-dimethylurea (DIURON), 12-(2,4-dichlorophenyl)-4-propyl-1,2-dioxolan-2-ylmethyl-1H-1,2,4-triazole (propiconazole), 10,10-oxybisphenoxy arsine (OBPA), 1-(4-chlorophenyl)-4,4-dimethyl-3-(1,2,4-triazol-1-ylmethyl)pentan-3-ol (tebuconazole), 2-(thiocyanomethylthio)benzothiazole, 2,3,5,6 tetrachloro-4-(methyl sulphonyl)pyridine, 2,4,4-tricloro-2-hydroxydiphenylether, 4-chloro-3,5-dimethyl-phenol, 5-hydroxymethoxymethyl-1-1aza-3,7-dioxabicyclo-octane, 2,4,5,6-tetrachloro-1,3-benzenedicarbonitrile (chlorothalonil), bis(tri-n-butyltin)oxide, N-(fluorodichloromethylthio)phthalimide, N-(trichloromethyl-thio)-4-cyclohexene-1,2-dicarboximide, N,N-dimethyl dichlorophenyl urea, p-chloro-m-cresol, o-phenylphenol, pentachlorophenol, silver compounds, sodium-o-phenyl phenoxide, tebuconazole, tetrachloroisophthalonitrile, tetramethylthiuram disulfide and a mixture thereof.
18. The method as claimed in claim 10, wherein the elastomeric particles comprises recycled elastomeric particles and pigmented elastomeric particles, and wherein the elastomeric composition is prepared with, by weight,
about 68% to about 83% of the recycled elastomeric particles;
about 10% to about 15% of the pigmented elastomeric particles;
about 2.0% to about 20% of the adhesive phase; and
about 0.05% to about 2% of the biocidal agent.
19. The method as claimed in claim 18, wherein
the recycled elastomeric particles comprise SBR,
the pigmented elastomeric particles comprise EPDM,
the polymeric binder comprises polyurethane, and
the biocidal agent is zinc pyrithione, N-butyl-1,2-benzisothiazolin-3-one, or silver.
20. An elastomeric sheet having biocidal properties fabricated from a composition comprising, by weight,
about 78% to about 98% of pre-fabricated elastomeric particles;
about 2.0% to about 20% of an adhesive phase; and
about 0.05% to about 2% of a biocidal agent,
wherein the pre-fabricated elastomeric particles and the adhesive phase are made of different materials, and
wherein the biocidal agent is present in the adhesive phase but is substantially absent from the pre-fabricated elastomeric particles.
21. The elastomeric sheet as claimed in claim 20, wherein the pre-fabricated elastomeric particles are about 0.2 to about 10.0 mm in diameter or length.
22. The elastomeric sheet as claimed in claim 20, wherein the pre-fabricated elastomeric particles are recycled crumb rubber.
23. The elastomeric sheet as claimed in claim 20, wherein
the pre-fabricated elastomeric particles comprise recycled elastomeric particles prepared from SBR and pigmented elastomeric particles prepared from EPDM;
the adhesive phase comprises polyurethane; and
the biocidal agent is zinc pyrithione, N-butyl-1,2-benzisothiazolin-3-one, or silver.
24. The elastomeric sheet as claimed in claim 20, wherein the elastomeric sheet is used as supporting medium, protective cover or decorative pad.
25. The elastomeric sheet as claimed in claim 24, wherein the supporting medium is a resilient elastomeric flooring mat.