1. A deuterium-enriched compound of formula I or a pharmaceutically acceptable salt thereof:
wherein R1-R36 are independently selected from H and D; and
the abundance of deuterium in R1-R36 is at least 3%, provided that when R34-R36 are D, then at least one other R is D.
2. A deuterium-enriched compound of claim 1, wherein the abundance of deuterium in R1-R36 is selected from at least 3%, provided that when R34-R36 are D, then at least one other R is D. The abundance can also be at least 6%, at least 11%, at least 17%, at least 22%, at least 28%, at least 33%, at least 39%, at least 44%, at least 50%, at least 56%, at least 61%, at least 67%, at least 72%, at least 78%, at least 83%, at least 89%, at least 94%, and 100%.
3. A deuterium-enriched compound of claim 1, wherein the abundance of deuterium in R1-R2 is selected from at least 50% and 100%.
4. A deuterium-enriched compound of claim 1, wherein the abundance of deuterium in R3-R16 and R26-R36 is selected from at least 4%, at least 6%, at least 14%, at least 19%, at least 26%, at least 32%, at least 39%, at least 45%, at least 52%, at least 58%, at least 65%, at least 71%, at least 77%, at least 84%, at least 90%, at least 97%, and 100%.
5. A deuterium-enriched compound of claim 1, wherein the abundance of deuterium in R17-R25 is selected from at least 11%, at least 22%, at least 33%, at least 44%, at least 56%, at least 67%, at least 78%, and 100%.
6. A deuterium-enriched compound of claim 1, wherein the compound is selected from compounds 1-4 of Table 1.
7. A deuterium-enriched compound of claim 1, wherein the compound is selected from compounds 5-8 of Table 2.
8. An isolated deuterium-enriched compound of formula I or a pharmaceutically acceptable salt thereof:
wherein R1-R36 are independently selected from H and D; and
the abundance of deuterium in R1-R36 is at least 3%, provided that when R34-R36 are D, then at least one other R is D.
9. An isolated deuterium-enriched compound of claim 8, wherein the abundance of deuterium in R1-R36 is selected from at least 3%, provided that when R34-R36 are D, then at least one other R is D. The abundance can also be at least 6%, at least 11%, at least 17%, at least 22%, at least 28%, at least 33%, at least 39%, at least 44%, at least 50%, at least 56%, at least 61%, at least 67%, at least 72%, at least 78%, at least 83%, at least 89%, at least 94%, and 100%.
10. An isolated deuterium-enriched compound of claim 8, wherein the abundance of deuterium in R1-R2 is selected from at least 50% and 100%.
11. An isolated deuterium-enriched compound of claim 8, wherein the abundance of deuterium in R3-R16 and R26-R36 is selected from at least 4%, at least 6%, at least 14%, at least 19%, at least 26%, at least 32%, at least 39%, at least 45%, at least 52%, at least 58%, at least 65%, at least 71%, at least 77%, at least 84%, at least 90%, at least 97%, and 100%.
12. An isolated deuterium-enriched compound of claim 8, wherein the abundance of deuterium in R17-R25 is selected from at least 11%, at least 22%, at least 33%, at least 44%, at least 56%, at least 67%, at least 78%, and 100%.
13. An isolated deuterium-enriched compound of claim 8, wherein the compound is selected from compounds 1-4 of Table 1.
14. An isolated deuterium-enriched compound of claim 8, wherein the compound is selected from compounds 5-8 of Table 2.
15. A mixture of deuterium-enriched compounds of formula I or a pharmaceutically acceptable salt thereof:
wherein R1-R36 are independently selected from H and D; and
the abundance of deuterium in R1-R36 is at least 3%, provided that when R34-R36 are D, then at least one other R is D.
16. A mixture of deuterium-enriched compound of claim 15, wherein the abundance of deuterium in R1-R36 is selected from at least 3%, provided that when R34-R36 are D, then at least one other R is D. The abundance can also be at least 6%, at least 11%, at least 17%, at least 22%, at least 28%, at least 33%, at least 39%, at least 44%, at least 50%, at least 56%, at least 61%, at least 67%, at least 72%, at least 78%, at least 83%, at least 89%, at least 94%, and 100%.
17. A mixture of deuterium-enriched compound of claim 15, wherein the compound is selected from compounds 1-4 of Table 1.
18. A mixture of deuterium-enriched compound of claim 15, wherein the compound is selected from compounds 5-8 of Table 2.
19. A pharmaceutical composition, comprising: a pharmaceutically acceptable carrier and a therapeutically effective amount of a compound of claim 1 or a pharmaceutically acceptable salt form thereof.
20. A method for treating a disease selected from benign prostatic hyperplasia andor prostate cancer comprising: administering, to a patient in need thereof, a therapeutically effective amount of a compound of claim 1 or a pharmaceutically acceptable salt form thereof.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An integrated circuit (IC) package comprising:
a substrate having a substantially planar upper surface entirely throughout an IC mounting region and a plurality of conductors within the IC mounting region on the upper surface;
at least one capacitor within the IC mounting region, wherein the at least one capacitor comprises top and bottom surfaces, each having a plurality of terminals of first and second polarity types, wherein a selected terminal of first polarity type on the bottom surface is physically and electrically coupled to a first conductor of the plurality of conductors, wherein a selected terminal of second polarity type on the bottom surface is physically and electrically coupled to a second conductor of the plurality of conductors, and wherein the at least one capacitor is mounted atop and at a diagonal to the first and second conductors to which it is electrically coupled; and
an IC comprising a plurality of IC terminals on a surface thereof, wherein the IC terminals are physically and electrically coupled to selected terminals of first and second polarity types on the top surface of the capacitor.
2. The IC package recited in claim 1, wherein the first conductor is to couple to a first potential, and the second conductor is to couple to a second potential.
3. The IC package recited in claim 1, wherein the at least one capacitor is mounted atop at least three conductors.
4. The IC package recited in claim 1, wherein the at least one capacitor is a capacitor array.
5. The IC package recited in claim 1, wherein the plurality of capacitor terminals are disposed over substantially the entire top and bottom surfaces.
6. The IC package recited in claim 1, wherein the plurality of conductors are substantially parallel to one another.
7. The IC package recited in claim 1 and comprising a plurality of capacitors distributed substantially throughout the IC mounting region, each capacitor being in electrical contact with at least one of the conductors.
8. The IC package recited in claim 1, wherein the conductors include pads.
9. An integrated circuit (IC) package comprising:
a substrate having a substantially planar upper surface entirely throughout an IC mounting region and a plurality of conductors within the IC mounting region on the upper surface;
a plurality of capacitors distributed substantially throughout the IC mounting region, wherein each capacitor comprises top and bottom surfaces, each having a plurality of terminals of first and second polarity types, wherein a selected terminal of first polarity type on the bottom surface of each capacitor is physically and electrically coupled to a first conductor of the plurality of conductors, wherein a selected terminal of second polarity type on the bottom surface of each capacitor is physically and electrically coupled to a second conductor of the plurality of conductors; and
an IC comprising a plurality of IC terminals on a surface thereof, wherein the IC terminals are physically and electrically coupled to selected terminals of first and second polarity types on the top surface of the capacitors.
10. The IC package recited in claim 9, wherein the plurality of capacitors comprises a plurality of sets of capacitors, each set comprising one or more capacitors aligned substantially end-to-end.
11. The IC package recited in claim 9, wherein the first conductor is to couple to a first potential, and the second conductor is to couple to a second potential.
12. The IC package recited in claim 9, wherein at least one capacitor is mounted atop at least three conductors.
13. The IC package recited in claim 9, wherein at least one capacitor is a capacitor array.
14. The IC package recited in claim 9, wherein the plurality of capacitor terminals are disposed over substantially, the entire top and bottom surfaces.
15. The IC package recited in claim 9, wherein the plurality of conductors are substantially parallel to one another.
16. The IC package recited in claim 9, wherein the conductors include pads.
17. An integrated circuit (IC) package comprising:
a substrate having a substantially planar upper surface entirely throughout an IC mounting region and a plurality of conductors within the IC mounting region on the upper surface;
a plurality of capacitors within the IC mounting region, wherein each capacitor comprises top and bottom surfaces, each having terminals of first and second polarity types, wherein a terminal of first polarity type on the bottom surface is physically and electrically coupled to a first conductor of the plurality of conductors, wherein a terminal of second polarity type on the bottom surface is physically and electrically coupled to a second conductor of the plurality of conductors; and
an IC comprising a plurality of IC terminals on a surface thereof, wherein the IC terminals are physically and electrically coupled to terminals of first and second polarity types on the top surface of the capacitors.
18. The IC package recited in claim 17, wherein the first conductor is to couple to a first potential, and the second conductor is to couple to a second potential.
19. The IC package recited in claim 17, wherein the at least one capacitor is mounted atop at least three conductors.
20. The IC package recited in claim 17, wherein the at least one capacitor is a capacitor array.
21. The IC package recited in claim 17, wherein the plurality of capacitor terminals are disposed over substantially the entire top and bottom surfaces.
22. The IC package recited in claim 17, wherein the plurality of conductors are substantially parallel to one another.
23. The IC package recited in claim 17 and comprising a plurality of capacitors distributed substantially throughout the IC mounting region, each capacitor being in electrical contact with at least one of the conductors.
24. The IC package recited in claim 17, wherein the conductors include pads.