1. A method for manufacturing a cartridge-type housing for a ball and socket joint in a vehicular suspension system, said method comprising the steps of:
inserting a housing blank into a forging tool die;
deforming the housing blank within the forging tool die using a forging tool punch; and
forming knurls on an exterior surface of the housing during said expanding step.
2. The method of claim 1 further including the step of heating the housing blank above ambient temperature during said expanding step.
3. The method of claim 1 further including the step of maintaining the housing blank at generally ambient temperature during said expanding step.
4. The method of claim 1 wherein said deforming step includes a plurality of progressive forming procedures each successively expanding the blank toward a final shape.
5. The method of claim 1 further including the step of forming a non-knurled portion on the exterior surface of the housing simultaneously with said step of forming knurls.
6. The method of claim 5 wherein said step of forming a non-knurled portion includes forming a shoulder contiguous to the knurls.
7. A ball and socket joint assembly for a vehicular suspension, said assembly comprising:
a housing having an interior socket and an exterior surface at least partially knurled for press fit into a mating first suspension part;
a ball rotatably seated within said socket;
a shank fixedly joined to said ball and extending outwardly from said housing for attaching to a second suspension component;
and wherein said housing includes an uninterrupted negative impression of a forging die distributed uniformly over said exterior surface and said knurls.
8. An assembly as set forth in claim 7 wherein said exterior surface of said housing includes a non-knurled portion.
9. An assembly as set forth in claim 8 wherein said non-knurled portion of said housing includes a shoulder contiguous to said knurls.
10. An assembly as set forth in claim 7 wherein each of said knurls have a longitudinal length and a generally triangular cross-section in directions perpendicular to said longitudinal length.
11. An assembly as set forth in claim 7 wherein said interior socket of said housing includes a frusto-spherical portion.
12. An assembly as set forth in claim 7 wherein said interior socket of said housing includes an uninterrupted negative impression of a forging die distributed uniformly there over.
13. An improved ball joint housing forging die tool configured to control formation of the exterior surface of a ball joint housing, said die comprising:
a forging die body;
an inner circumference formed within said forging die body;
a plurality of knurls disposed at least partially about said inner circumference, said knurls configured to form a mirror image plurality of knurls on an exterior surface of a forged ball joint housing during a forging process.
14. A forging die as set forth in claim 13 wherein said inner circumference of said die body includes a surface texture, and said knurls have a surface texture substantially similar to said surface texture of said inner circumference.
15. A forging die as set forth in claim 13 wherein said inner circumference of said die body includes a non-knurled portion.
16. A forging die as set forth in claim 15 wherein said non-knurled portion of said inner circumference includes a shoulder contiguous to said knuris configured to form a mirror image shoulder on an exterior surface of the forged ball joint housing during the forging process.
17. A forging die as set forth in claim 13 wherein each of said knurls have a longitudinal length and a generally triangular cross-section in directions perpendicular to said longitudinal length.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor multi-chip module, comprising:
a substrate;
at least one first chip mounted on one side of substrate, the first chip sending and receiving one part of data being sent and received by the semiconductor multi-chip module, and
at least one second chip mounted on the other side of said substrate, the second chip sending and receiving the other part of the data being sent and received by the semiconductor multi-chip module.
2. A semiconductor multi-chip module according to claim 1, wherein a plurality of lines includes first lines provided exclusively on the one side of said substrate and second lines provided exclusively on the other side of said substrate,
wherein said first lines are connected to said first chip, and
wherein said second lines are connected to said second chip.
3. A semiconductor multi-chip module according to claim 2, wherein said plurality of lines is data lines.