What is claimed is:
1. A method of forming nanoparticle-sized material components, comprising the steps of:
providing a semiconductor oxide substrate comprised of nanoparticles of said semiconductor oxide;
depositing a modifier onto said nanoparticles;
depositing a source of metal ions in association with said semiconductor and said modifier, said modifier enabling electronic hole scavenging and chelation of said metal ions; and
illuminating said metal ions and modifier to cause reduction of said metal ions to metal onto said semiconductor nanoparticles.
2. The method as defined in claim 1 wherein said semiconductor comprises a metal oxide.
3. The method as defined in claim 1 wherein said nanoparticles have a diameter of about 20-70 .
4. The method as defined in claim 1 wherein said semiconductor oxide is selected from the group consisting of TiO2, WO2, VO2 and doped forms thereof.
5. The method as defined in claim 1 wherein said modifier comprises a bidentate ligand.
6. The method as defined in claim 1 wherein said modifier is selected from the group consisting of aminophosphoric acid, glycine and lucine.
7. The method as defined in claim 1 wherein said metal is selected from the group consisting of copper, silver and gold.
8. The method as defined in claim 1 wherein the step of illuminating said metal ions comprises at least one of applying a laser beam and applying a particle beam.
9. The method as defined in claim 1 wherein the step of illuminating comprises applying an electron beam.
10. The method as defined in claim 9 wherein the step of applying an electron beam arises from a scanning transmission microscope.
11. An article of manufacture comprised of a semiconductor of nanoparticles, a modifier coating on said nanoparticles for electron hole scavenging and chelation and metal ions disposed on at least one of said semiconductor and said modifier, said metal ions enabling electron hole scavenging and chelation of said metal ions to said semiconductor.
12. The article of manufacture as defined in claim 11 wherein said modifier is selected from the group consisting of alanine, aminophosphoric acid, glycine and lucine.
13. The article of manufacture as defined in claim 11 wherein said semiconductor is selected from the group consisting of TiO2, VO2 and WO2.
14. The method as defined in claim 11 wherein said metal ions are selected from the group consisting of copper, silver and gold.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A thermal protection module, comprising:
a surge absorber;
a switch unit, comprising a casing, a first conductive pin, a moving part, and a first conductive portion, wherein the moving part is stuck in the casing movably, the first conductive pin is stuck in the casing, the first conductive portion is disposed on the moving part, and the first conductive portion is in contact with or separated from the first conductive pin; and
a pyrocondensation belt, connected to the surge absorber and the moving part.
2. The thermal protection module as claimed in claim 1, wherein the pyrocondensation belt is configured to shrink according to a heat conduction from the surge absorber, so that the first conductive portion is in contact with or separated from the first conductive pin.
3. The thermal protection module as claimed in claim 2, wherein when the pyrocondensation belt is shrunk to move the moving part, a moving direction of the moving part is the same as a moving direction of the first conductive portion.
4. The thermal protection module as claimed in claim 1, wherein the switch unit further comprises a second conductive pin, a third conductive pin, a fourth conductive pin, and a second conductive portion; the second conductive pin, the third conductive pin and the fourth conductive pin are stuck in the casing and coupled to the surge absorber; the second conductive portion is disposed on the moving part; the third conductive pin is in contact with or separated from the first conductive portion; and the second conductive portion is in contact with or separated from the second conductive pin and the fourth conductive pin.
5. The thermal protection module as claimed in claim 4, wherein the first conductive portion and the second conductive portion are a plurality of conductive sheets with physical resilience.
6. The thermal protection module as claimed in claim 1, wherein the pyrocondensation belt is a pyrocondensation sleeve.
7. The thermal protection module as claimed in claim 1, wherein the casing has an opening, and the moving part has a protruding portion, the moving part passes through the opening, and the protruding portion is stuck out from the opening.
8. The thermal protection module as claimed in claim 7, wherein the casing is located between the protruding portion and the surge absorber, and the pyrocondensation belt encircles the casing, the protruding portion, and the surge absorber.
9. The thermal protection module as claimed in claim 8, wherein the switch unit further comprises a guide rail disposed on the outside of the casing, and the pyrocondensation belt passes through the guide rail.
10. The thermal protection module as claimed in claim 7, wherein the protruding portion is located between the surge absorber and the casing.
11. The thermal protection module as claimed in claim 10, wherein the protruding portion has a guide rail, and the pyrocondensation belt encircles the surge absorber and passes through the guide rail.
12. The thermal protection module as claimed in claim 1, wherein the moving part has a slot, and the casing has a projection hook disposed therein, the projection hook is accommodated in the slot when the first conductive portion is separated from the first conductive pin.
13. The thermal protection module as claimed in claim 1, wherein the moving part has a projection hook, and the casing has a slot disposed therein, the projection hook is accommodated in the slot when the first conductive portion is separated from the first conductive pin.
14. The thermal protection module as claimed in claim 1, wherein the moving part has a salient point, and the casing has a first stopping hole and a second stopping hole both located in the casing; when the first conductive portion is in contact with the first conductive pin, the salient point is disposed in the first stopping hole; when the first conductive portion is separated from the first conductive pin, the salient point is disposed in the second stopping hole.