1460747318-1ea3ed9f-074e-4f90-8aeb-1da272c15c77

1. A projection system, comprising:
a head-shaped figure including a face, the face comprising a translucent material, the face including a face back surface;
an LED projector that is positioned within the head-shaped figure and has an illuminating source comprising one or more light emitting diodes; and
a platform, wherein the head-shaped figure and the LED projector are coupled to the platform so as to maintain consistent alignment of the projector to the face back surface, the LED projector operable to project an image onto the face back surface.
2. The projection system of claim 1, further comprising:
a lens adapted to couple to the LED projector such that an image may be projected from the LED projector through the lens, the LED projector and the lens being mounted inside the head-shaped figure operable to project an image onto the face back surface.
3. The projection system of claim 1, further comprising:
a media controller in communication with the LED projector; and
a touch sensitive conductive layer coupled to the face, the touch sensitive conductive layer operable to produce a signal based on a change in an electrical state that may occur if touched, the touch sensitive conductive layer in electrical communication with the media controller, the media controller being operable to control projection of a particular image based at least in part on an electrical state of the touch sensitive conductive layer.
4. The projection system of claim 1, further comprising:
a projector mount operable to provide lateral side to side optical alignment, horizontal front to back optical adjustment, and vertical up and down optical alignment of the LED projector with respect to the face back surface.
5. A method comprising:
using a projection system to project an image onto a back surface of a rear projection screen having a shape of a face, the projection system comprising a head-shaped figure including the face, the face comprising a translucent material, the face including a face back surface,
an LED projector having an illuminating source comprising one or more light emitting diodes,
a wide angle fisheye lens adapted to couple to the LED projector such that an image may be projected from the LED projector through the wide angle fisheye lens, the LED projector and the wide angle fisheye lens being mounted inside the head-shaped figure operable to project an image onto the face back surface,
and
a platform, wherein the head-shaped figure and the LED projector are coupled to the platform so as to maintain consistent alignment of the LED projector to the face back surface; and
providing a video signal to the LED projector.
6. The method of claim 5, wherein providing a video signal comprises:
filming a face of an actor so as to produce an image;
processing the image so as to conform the image to a size and shape of the face back surface; and
converting the processed image to a video signal.
7. The method of claim 6, wherein filming the face of an actor comprises:
filming an actor’s face using three cameras, a first camera located in front of the face so as to film the front of the face, a second camera located to the right of the face so as to film an oblique view of the right side of the face, a third camera located to the left of the face so as to film an oblique view of the left side of the face,
wherein processing the image further comprises aligning, stabilizing, and merging the images from each of the three cameras together using image processing tools.
8. The method of claim 7, further including processing the image comprising:
creating a warp mesh;
distorting the image with the warp mesh so as to conform the image to the shape and size of the face back surface; and
processing the image using the warp mesh so as to align features of the image of the face to corresponding features of the face back surface.
9. The vending machine of claim 4, wherein the panel and the LED projector are coupled in a manner so as to maintain consistent alignment of the projector to the panel back surface.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A spacer for a sensor of a thermal flow measuring device, having:
hold-down means;
a first cavity for accommodating a resistance thermometer;
at least a first planar area which faces said first; and
a second cavity, through which the resistance thermometer can be pressed by means of said hold-down onto said first planar area.
2. The spacer for a sensor of a thermal flow measuring device as claimed in claim 1, wherein:
said first cavity has, at least in certain regions, an essentially rectangular cross section.
3. The spacer for a sensor of a thermal flow measuring device as claimed in claim 1, wherein:
at least said first cavity can be manufactured with a machining manufacturing method.
4. The spacer for a sensor of a thermal flow measuring device as claimed in claim 1, wherein:
said first cavity is a blind bore.
5. The spacer for a sensor of a thermal flow measuring device as claimed in claim 1, wherein:
said second cavity is approximately perpendicular to said first planar area of the spacer.
6. The spacer for a sensor of a thermal flow measuring device as claimed in claim 1, wherein:
the spacer is a body which extends along a longitudinal axis, and which has a circularly shaped cross section;
the longitudinal axis of said first cavity is approximately parallel to the longitudinal axis of the spacer;
said first planar area of the spacer is a lateral surface of said first cavity.
7. A thermal flow measuring device for determining andor monitoring flow of a measured medium through a measuring tube, having:
a first sensor; and
a second sensor, said first sensor has a first housing secured in a sensor holder and a first resistance thermometer, and said second sensor has a second housing secured in the sensor holder and a second resistance thermometer, wherein:
at least said first resistance thermometer is embodied in such a manner that it can be heated;
said first resistance thermometer is at least partially inserted into a first cavity of a first spacer in said first housing, and said second resistance thermometer is at least partially inserted into a first cavity of a second spacer in said second housing; and
the first spacer and the second spacer have:
hold-down means;
a first cavity for accommodating a resistance thermometer;
at least a first planar area which faces said first; and
a second cavity, through which the resistance thermometer can be pressed by means of said hold-down onto said first planar area.
8. The thermal flow measuring device as claimed in claim 7, wherein:
at least said first resistance thermometer is a thin-film resistance thermometer, which has a first surface and a second surface which lies opposite the first surface; and
said first surface of said first thin-film resistance thermometer is connected with said first planar area of the first spacer.
9. The thermal flow measuring device as claimed in claim 7, wherein:
at least said first resistance thermometer is soldered onto said first planar area of the first spacer.
10. The thermal flow measuring device as claimed in claim 7, wherein:
said second surface of said first thin-film resistance thermometer is at least partially covered by thermally conductive fill material.
11. A method for manufacture of a sensor of a thermal flow measuring device, comprising the steps of:
a thin-film resistance thermometer, which has a first surface and a second surface, which lies opposite the first surface, is at least partially inserted into the first cavity of a spacer;
is soldered with its first surface onto the first planar area of the spacer; and
at least during the soldering, a hold-down is led through the second cavity of the spacer for pressing the thin-film resistance thermometer onto the first planar area of the spacer.
12. The method for manufacture of a sensor for a thermal flow measuring device as claimed in claim 11, wherein:
preformed solder portions are applied onto the resistance thermometer andor onto the first planar area of the spacer before introduction of the resistance thermometer into the spacer.
13. The method for manufacture of a sensor for a thermal flow measuring device as claimed in claim 11, wherein:
a housing is provided which has a first open end and a second open end;
the first open end can be secured in a sensor holder, and cables for electrical contacting of the thin-film resistance thermometer lead out of the housing through the first open end of the housing; and
the spacer with the soldered-on thin-film resistance thermometer is inserted through the second open end of the housing, which is then closed with a stopper.
14. The method for manufacture of a sensor for a thermal flow measuring device as claimed in claim 11, wherein:
thermally conductive andor thermally insulating fill material is filled into the housing andor at least into the first cavity of the spacer, so that the thermally conductive fill material at least partially covers the second surface of the thin-film resistance thermometer.
15. The method for manufacture of a sensor for a thermal flow measuring device as claimed in claim 11, wherein:
before introduction of the spacer with the thin-film resistance thermometer into the housing, the second cavity of the spacer is at least partially filled with a solid body, which is manufactured from same material as the spacer.