1. A method for manufacturing a semiconductor module, the method including:
a first process of forming a conductor on one face of an insulating layer;
a second process of exposing the conductor from the other face of the insulating layer;
a third process of providing a first wiring layer on an exposed area of the conductor and on the other face of the insulating layer;
a fourth process of preparing a substrate on which a circuit element is formed wherein a second wiring is formed on the substrate; and
a fifth process of embedding the conductor in the insulating layer by press-bonding the insulating layer and the substrate in a state where the conductor on which the first wiring layer is provided by said third process is disposed counter to the second wiring layer.
2. A method for manufacturing a semiconductor module, the method including:
a first process of forming a conductor on one face of an insulating layer which contains fibrous filler material whose coefficient of thermal expansion is small than that of the insulating layer, wherein the fibrous filler material is arranged so that a direction of fibers thereof intersects with a thickness direction of the insulating layer;
a second process of exposing the conductor from the other face of the insulating layer;
a third process of providing a first wiring layer on an exposed area of the conductor and on the other face of the insulating layer;
a fourth process of preparing a substrate on which a circuit element is formed wherein a second wiring is formed on the substrate; and
a fifth process of embedding the conductor in the insulating layer by press-bonding the insulating layer and the substrate in a state where the conductor on which the first wiring layer is provided by said third process is disposed counter to the second wiring layer.
3. A method for manufacturing a semiconductor module according to claim 1, wherein a means for roughening an exposed face of the conductor is used in said second process.
4. A method for manufacturing a semiconductor module according to claim 3, wherein laser is used as the roughing means,
a via hole having a larger diameter than a spot diameter of the laser is formed from the other face of the insulating layer and
the exposed face of the conductor is roughened by a plurality of laser irradiations.
5. A method for manufacturing a semiconductor module according to claim 3, wherein in said second process an opening is formed from the other face of the insulating layer in a manner such that an arithmetic mean roughness of the exposed face of the conductor is 2 to 50 \u03bcm.
6. A method for manufacturing a semiconductor module according to claim 1, wherein in said first process the height of the conductor in a direction vertical to the face of the insulating layer is smaller than a length of the conductor in a direction parallel to the face of the insulating layer.
7. A method for manufacturing a packaging board, the method including:
a first process of forming a conductor on one face of an insulating layer;
a second process of exposing the conductor from the other face of the insulating layer; and
a third process of providing a wiring layer on an exposed area of the conductor and on the other face of the insulating layer,
wherein a means for roughening an exposed face of the conductor is used in said second process.
8. A method for manufacturing a packaging board according to claim 7, wherein in said first process the insulating layer contains fibrous filler material whose coefficient of thermal expansion is smaller than that of the insulating layer, the fibrous filler material being arranged so that a direction of fibers thereof intersects with a thickness direction of the insulating layer.
9. A method for manufacturing a packaging board according to claim 8, wherein laser is used as the roughing means,
a via hole having a larger diameter than a spot diameter of the laser is formed from the other face of the insulating layer and
the exposed face of the conductor is roughened by a plurality of laser irradiations.
10. A method for manufacturing a packaging hoard according to claim 7, wherein in said second process an opening is formed from the other face of the insulating layer in a manner such that an arithmetic mean roughness of the exposed face of the conductor is 2 to 50 \u03bcm.
11. A method for manufacturing a packaging board according to claim 7, wherein in said first process the height of the conductor in a direction vertical to the face of the insulating layer is smaller than a length of the conductor in a direction parallel to the face of the insulating layer.
12-18. (canceled)
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A golf club head, comprising:
a bottom face having a periphery formed with an arc-shaped face;
the bottom face of the golf club head having a center formed with a receiving recess for receiving an elastic bushing made of rubber material;
the receiving recess having a determined slope; and
the receiving recess having a width slightly greater than a diameter of the golf ball.
2. The golf club head in accordance with claim 1, wherein the golf club head has an inside formed with a plurality of transverse holes each communicating with the receiving recess for adjusting the weight of the golf club head.
3. The golf club head in accordance with claim 1, wherein the slope of the receiving recess is ranged between four degrees and twelve degrees, and the optimum slope of the receiving recess is equal to eight degrees.