1. An assembly of a device for cooling a mold (1), and a mold (1), said device comprising an annular channel system which surrounds the mold (1), the channel system comprising a channel (3) having at least one entrance (14) for supplying a cooling medium to the interior of the channel (3), the channel (3) having at least one mold-facing outlet aperture (9) for the cooling medium, characterized in that the channel (3) is adapted for substantially one tangential flow direction of the cooling medium around the mold.
2. An assembly as claimed in claim 1, in which the channel (3) has a supply channel (12) for the cooling medium, characterized in that the supply channel (12) substantially tangentially connects to the channel (3).
3. An assembly as claimed in claim 1 or 2, characterized in that the supply channel (12) connects to the channel (3) proximate to a side of the channel (3) remote from the mold.
4. An assembly as claimed in claim 1, 2 or 3, characterized in that the outlet aperture (9) is located proximate to a side of the channel (3) facing the center of the annular channel system.
5. An assembly as claimed in claim 1, 2, 3 or 4, characterized in that the channel (3) has an exit (15) for the cooling medium, with outlet apertures (9) being located between the entrance (14) and the exit (15) of the channel (3), and with the surface area of the crosssection of the channel (3) decreasing from the entrance (14) to the exit (15).
6. An assembly as claimed in claim 5, characterized in that the exit (15) of the channel (3) connects to the entrance (14) of the channel (3).
7. An assembly as claimed in claim 5 or 6, characterized in that the surface area of the cross-section of the channel (3) continuously decreases in size between the entrance (14) and the exit (15) of the channel (3).
8. An assembly as claimed in claim 1, characterized in that the channel system comprises a further channel (4) on a side of the channel (3) facing the mold, with the outlet aperture (9) of the channel (3) terminating in the further channel (4), the further channel (4) having at least one further outlet aperture (10) on a side facing the mold.
9. A device for cooling a mold (1), which device comprises an annular channel system having at least one channel (3), the channel (3) having at least one entrance (14) for supplying a cooling medium to the interior of the channel (3), the channel (3) having at least one outlet aperture (9) for the cooling medium, characterized in that the channel (3) is adapted for a substantially tangential flow direction of the cooling medium.
10. A device for cooling a mold (1) as claimed in claim 9, characterized in that the channel (3) is adapted for a gaseous cooling medium.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A hole-blocking layer disposed between an organic semiconductor layer and an electrode electrically connected to the organic semiconductor in an element comprising the organic semiconductor layer and the electrode, the hole-blocking layer suppressing electrical conduction between the organic semiconductor layer and the electrode from being carried by holes,
wherein the hole-blocking layer is produced by a process that has a step of bringing an aqueous solution containing hydrogen peroxide and titanium (IV) oxysulfate into contact with the surface of a member on which the hole-blocking layer is to be formed, and holding the contact between the aqueous solution and the surface of the member at 50 to 120\xb0 C., so that an amorphous titanium oxide precursor precipitates on the surface of the member; and a step of drying the amorphous titanium oxide precursor that has precipitated on the surface of the member,
wherein the method does not comprise electroreductive precipitation.
2. The hole-blocking layer according to claim 1, wherein the aqueous solution contains 0.005 molL to 1 molL of the titanium (IV) oxysulfate and 0.005 molL to 1 molL of the hydrogen peroxide.
3. The hole-blocking layer according to claim 1, wherein the hole-blocking layer has a surface roughness (Ra) equal to or smaller than a surface roughness of the member on which the hole-blocking layer is to be formed.
4. A hole-blocking layer disposed between an organic semiconductor layer and an electrode electrically connected to the organic semiconductor in an element comprising the organic semiconductor layer and the electrode, the hole-blocking layer suppressing electrical conduction between the organic semiconductor layer and the electrode from being carried by holes,
wherein the hole-blocking layer is produced by a process that has a step of bringing a nonaqueous solution containing a diethylamine and an organic titanium compound represented by formula (i) below, into contact with the surface of a member on which the hole-blocking layer is to be formed, to thereby form a liquid layer of the nonaqueous solution on the surface; a step of hydrolyzing the organic titanium compound included in the liquid layer of the nonaqueous solution, to thereby form a hydrolysis product of the organic titanium compound in the liquid layer of the nonaqueous solution; and a step of drying the liquid layer of the nonaqueous solution containing the hydrolysis product of the organic titanium compound:
Ti(OR1)4\u2003\u2003(i)
wherein R1 denotes identical or different substituents selected from the group consisting of alkyl groups having from 1 to 8 carbon atoms, cycloalkyl groups, and aryl groups, as well as hydroxy, alkoxy, amino, and fluoro derivatives of alkyl groups having from 1 to 8 carbon atoms, cycloalkyl groups, and aryl groups.
5. The hole-blocking layer according to claim 4, wherein the molar ratio of the organic titanium compound with respect to the diethylamine in the nonaqueous solution for forming the hole-blocking layer (the organic titanium compounddiethylamine) ranges from 0.25 to 1.
6. The hole-blocking layer according to claim 4, wherein a drying temperature in the step of drying the nonaqueous solution located on the member and containing the hydrolysis product of the organic titanium compound is not higher than 100\xb0 C.
7. A photoelectric conversion element, comprising a stack in which there are disposed a first collector electrode layer, the hole-blocking layer described in claim 1, an organic semiconductor layer, and a second collector electrode layer in this order,
wherein at least one of the first collector electrode layer and the second collector electrode layer has light transmissivity.
8. The photoelectric conversion element according to claim 7, wherein the thickness of the hole-blocking layer ranges from 5 nm to 200 nm.
9. The photoelectric conversion element according to claim 7, wherein a hole-transport layer that promotes charge transfer between the organic semiconductor layer and the second collector electrode layer being carried by holes is provided between the organic semiconductor layer and the second collector electrode layer.
10. The photoelectric conversion element according to claim 9,
wherein the organic semiconductor layer includes a conjugated polymer as an electron donor and a fullerene derivative as an electron acceptor, and
the hole-transport layer is produced by a process that has a step of bringing a surface of the organic semiconductor layer included in a member resulting from stacking the first collector electrode layer, the hole-blocking layer, and the organic semiconductor layer, into contact with an aqueous dispersion containing poly-3,4-ethylenedioxythiophene (PEDOT) and polystyrene sulfonate (PSS), and a nonionic surfactant.
11. The photoelectric conversion element according to claim 10, wherein the nonionic surfactant is represented by formula (ii) below:
R(OCH2CH2)nOH\u2003\u2003(ii)
wherein R denotes an alkyl group having from 10 to 15 carbon atoms, and n is an integer ranging from 5 to 15.
12. An organic thin-film solar cell panel, comprising:
a light-transmitting substrate;
the photoelectric conversion element described in claim 7 provided on the light-transmitting substrate in such a manner that the first or second collector electrode layer having light transmissivity is in contact with the light-transmitting substrate; and
a chassis that seals the photoelectric conversion element.
13. A light-emitting device, comprising the photoelectric conversion element described in claim 7, as a light-emitting element.
14. A method for producing a hole-blocking layer disposed between an organic semiconductor layer and an electrode electrically connected to the organic semiconductor in an element comprising the organic semiconductor layer and the electrode, the hole-blocking layer suppressing electrical conduction between the organic semiconductor layer and the electrode from being carried by holes, the method comprising:
a step of bringing an aqueous solution containing hydrogen peroxide and titanium (IV) oxysulfate into contact with the surface of a member on which the hole-blocking layer is to be formed, and holding the contact between the aqueous solution and the surface of the member at 50 to 120\xb0 C., so that an amorphous titanium oxide precursor precipitates on the surface of the member; and
a step of drying the amorphous titanium oxide precursor that has precipitated on the member,
wherein the method does not comprise electroreductive precipitation.
15. The method according to claim 14, wherein the aqueous solution contains 0.005 molL to 1 molL of the titanium (IV) oxysulfate and 0.005 molL to 1 molL of the hydrogen peroxide.
16. The method according to claim 14, wherein the hole-blocking layer has a surface roughness (Ra) equal to or smaller than a surface roughness of the member on which the hole-blocking layer is to be formed.
17. A method for producing a hole-blocking layer disposed between an organic semiconductor layer and an electrode electrically connected to the organic semiconductor in an element comprising the organic semiconductor layer and the electrode, the hole-blocking layer suppressing electrical conduction between the organic semiconductor layer and the electrode from being carried by holes, the method comprising:
a step of bringing a nonaqueous solution containing a diethylamine and an organic titanium compound represented by formula (i) below, into contact with the surface of a member on which the hole-blocking layer is to be formed, to thereby form a liquid layer of the nonaqueous solution on the surface; a step of hydrolyzing the organic titanium compound included in the liquid layer of the nonaqueous solution, to thereby form a hydrolysis product of the organic titanium compound in the liquid layer of the nonaqueous solution; and a step of drying the liquid layer of the nonaqueous solution containing the hydrolysis product of the organic titanium compound:
Ti(OR1)4\u2003\u2003(i)
wherein R1 denotes identical or different substituents selected from the group consisting of alkyl groups having from 1 to 8 carbon atoms, cycloalkyl groups, and aryl groups, as well as hydroxy, alkoxy, amino, and fluoro derivatives of alkyl groups having from 1 to 8 carbon atoms, cycloalkyl groups, and aryl groups.
18. The method according to claim 17, wherein the molar ratio of the organic titanium compound with respect to the diethylamine in the nonaqueous solution for forming the hole-blocking layer (the organic titanium compounddiethylamine) ranges from 0.25 to 1.
19. The method according to claim 17, wherein a drying temperature in the step of drying the nonaqueous solution located on the member and containing the hydrolysis product of the organic titanium compound is not higher than 100\xb0 C.
20. A method for producing a photoelectric conversion element comprising a stack in which there are disposed a first collector electrode layer, an oxide semiconductor layer, an organic semiconductor layer, a hole-transport layer, and a second collector electrode layer in this order,
wherein at least one of the first collector electrode layer and the second collector electrode layer has light transmissivity,
the oxide semiconductor layer comprises a hole-blocking layer produced in accordance with the production method described in claim 14,
the organic semiconductor layer includes a conjugated polymer as an electron donor and a fullerene derivative as an electron acceptor, and
the hole-transport layer is produced by a process that has a step of bringing a surface of the organic semiconductor layer included in a member resulting from stacking the first collector electrode layer, the oxide semiconductor layer, and the organic semiconductor layer, into contact with an aqueous dispersion containing poly-3,4-ethylenedioxythiophene (PEDOT) and polystyrene sulfonate (PSS), and a nonionic surfactant.
21. The method according to claim 20, wherein the nonionic surfactant is represented by formula (ii) below:
R(OCH2CH2)nOH\u2003\u2003(ii)
wherein R denotes an alkyl group having from 10 to 15 carbon atoms, and n is an integer ranging from 5 to 15.
22. A method for producing a photoelectric conversion element comprising a stack in which there are disposed a first collector electrode layer, an oxide semiconductor layer, an organic semiconductor layer, a hole-transport layer, and a second collector electrode layer in this order,
wherein at least one of the first collector electrode layer and the second collector electrode layer has light transmissivity,
the oxide semiconductor layer comprises a hole-blocking layer produced in accordance with the production method described in claim 17,
the organic semiconductor layer includes a conjugated polymer as an electron donor and a fullerene derivative as an electron acceptor, and
the hole-transport layer is produced by a process that has a step of bringing a surface of the organic semiconductor layer included in a member resulting from stacking the first collector electrode layer, the oxide semiconductor layer, and the organic semiconductor layer, into contact with an aqueous dispersion containing poly-3,4-ethylenedioxythiophene (PEDOT) and polystyrene sulfonate (PSS), and a nonionic surfactant.