1. A multilayer printed wiring board having a plurality of signal wiring layers and at least one ground layer, comprising:
a test coupon for measuring impedance, which is formed on each of the signal wiring layers;
a through hole which serially connects the respective test coupons of the signal wiring layers adjoining each other;
a measuring pad which is connected to one end of the serially connected test coupons; and
a measuring pad which is connected to the ground layer.
2. The multilayer printed wiring board according to claim 1, wherein the test coupon of each of the signal wiring layers is constituted by a plurality of linear parts extending parallel to each other and folded-back parts mutually connecting the plurality of linear parts.
3. The multilayer printed wiring board according to claim 2, wherein the folded-back part is constituted by a plurality of bending parts, and a bending angle of each of the bending parts is 45\xb0 or less.
4. A method of measuring characteristic impedance of a plurality of signal wiring layers of a multilayer printed wiring board having the plurality of signal wiring layers and at least one ground layer, comprising:
forming a test coupon for measuring impedance on each of the signal wiring layers;
serially connecting the test coupons of the respective signal wiring layers;
applying a step pulse between a measuring pad connected to one end of the serially connected test coupons and a measuring pad connected to the ground layer; and
measuring voltages of reflection waves from the serially connected test coupons.
5. The method of measuring characteristic impedance according to claim 4, wherein the test coupon of each of the signal wiring layers is constituted by a plurality of linear parts extending parallel to each other and folded-back parts mutually connecting the plurality of linear parts.
6. The method of measuring characteristic impedance according to claim 5, wherein the folded-back part is constituted by a plurality of bending parts, and a bending angle of each of the bending parts is 45\xb0 or less.
7. A multilayer printed wiring board in which a test coupon is formed in a signal wiring layer,
wherein the test coupon is constituted by a plurality of linear parts extending parallel to each other and folded-back parts mutually connecting the plurality of linear parts.
8. The multilayer printed wiring board according to claim 7, wherein the folded-back part is constituted by a plurality of bending parts, and a bending angle of each of the bending parts is 45\xb0 or less.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A pattern forming method, comprising:
(A) coating a substrate with a positive resist composition of which solubility in a positive developer increases and solubility in a negative developer decreases upon irradiation with actinic rays or radiation, so as to form a resist film;
(B) exposing the resist film; and
(D) developing the resist film with a negative developer.
2. The pattern forming method according to claim 1, which further comprises:
(C) developing the resist film with a positive developer.
3. A pattern forming method, comprising in the following order:
(A) coating a substrate with a positive resist composition of which solubility in a positive developer increases and solubility in a negative developer decreases upon irradiation with actinic rays or radiation, so as to form a resist film;
(B) exposing the resist film;
(D) developing the resist film with a negative developer; and
(C) developing the resist film with a positive developer.
4. The pattern forming method according to claim 1, which further comprises:
(E) heating the resist film after (B) exposing the resist film.
5. The pattern forming method according to claim 1, comprising:
(B) exposing the resist film a plurality of times.
6. The pattern forming method according to claim 4, comprising:
(E) heating the resist film a plurality of times.
7. A pattern forming method, comprising in the following order:
(A) coating a substrate with a positive resist composition for multiple development of which solubility in a positive developer increases and solubility in a negative developer decreases upon irradiation with actinic rays or radiation, so as to form a resist film;
(B-1) exposing the resist film;
(E-1) heating the resist film;
(C) developing the resist film with a positive developer, so as to form a patterned resist film;
(B-2) exposing the patterned resist film;
(E-2) heating the patterned resist film; and
(D) developing the patterned resist film with a negative developer.
8. A pattern forming method, comprising in the following order:
(A) coating a substrate with a positive resist composition for multiple development of which solubility in a positive developer increases and solubility in a negative developer decreases upon irradiation with actinic rays or radiation, so as to form a resist film;
(B-1) exposing the resist film;
(E-1) heating the resist film;
(D) developing the resist film with a negative developer, so as to form a patterned resist film;
(B-2) exposing the patterned resist film;
(E-2) heating the patterned resist film; and
(C) developing the patterned resist film with a positive developer.
9. The pattern forming method according to claim 7,
wherein the positive resist composition for multiple development comprises a resin having an alicyclic hydrocarbon structure and being capable of increasing solubility in an alkali developer and decreasing solubility in an organic solvent under an action of an acid.
10. The pattern forming method according to claim 1,
wherein (D) developing the resist film with a negative developer is performing development with a developer containing at least one kind of a solvent selected from the group consisting of a ketone-based solvent, an ester-based solvent, an alcohol-based solvent, an amide-based solvent and an ether-based solvent.
11. The pattern forming method according to claim 1,
wherein (D) developing the resist film with a negative developer is performing development with a developer containing a solvent represented by formula (1):
wherein R and R\u2032 each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an alkoxyl group, an alkoxycarbonyl group, a carboxyl group, a hydroxyl group, a cyano group or a halogen atom, and R and R\u2032 may combine with each other to form a ring.
12. The pattern forming method according to claim 1,
wherein (D) developing the resist film with a negative developer is performing development with a developer containing a solvent represented by formula (2):
wherein R\u2033 and R\u2033\u2033 each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an alkoxyl group, an alkoxycarbonyl group, a carboxyl group, a hydroxyl group, a cyano group or a halogen atom, and R\u2033 and R\u2033\u2033 may combine with each other to form a ring; and
R\u2032\u2033 represents an alkylene group or a cycloalkylene group.
13. The pattern forming method according to claim 1,
wherein (D) developing the resist film with a negative developer is performing development with a developer containing butyl acetate.
14. The pattern forming method according to claim 2,
wherein (C) developing the resist film with a positive developer is selectively dissolving and removing a film, an exposure dose of which is not less than a threshold value (a), and
(D) developing the resist film with a negative developer is selectively dissolving and removing a film, an exposure dose of which is not more than a threshold value (b).
15. The pattern forming method according to claim 1, which further comprises:
(F) washing the resist film with a rinsing solution containing an organic solvent after (D) developing the resist film with a negative developer.
16. A positive resist composition for multiple development, comprising:
(a) a resin capable of increasing solubility in an alkali developer and decreasing solubility in an organic solvent by decomposition of a side chain;
(b) a photoacid generator; and
(c) a solvent.
17. A developer for negative development, which is used for a positive resist composition, the developer comprising:
at least one kind of a solvent selected from the group consisting of a ketone-based solvent, an ester-based solvent, an alcohol-based solvent, an amide-based solvent and an ether-based solvent.
18. A rinsing solution for negative development, which is used for a positive resist composition, the rinsing solution comprising:
at least one kind of an organic solvent selected from the group consisting of a hydrocarbon-based solvent, a ketone-based solvent, an ester-based solvent, an alcohol-based solvent, an amide-based solvent and an ether-based solvent.