1. An LED light source module, comprising:
a constant-current unit, comprising:
a voltage stabilizing unit having an input end, a first output end, and a second output end, the input end receiving a DC voltage, and the first output end outputting a constant current; and
a resistor parallel-connected between the first output end and the second output end; and
an LED set electrically connected to the first output end.
2. The LED light source module of claim 1, wherein the LED set comprises a single LED.
3. The LED light source module of claim 1, wherein the LED set comprises a plurality of LEDs connected to one another in series.
4. The LED light source module of claim 1, wherein the LED set comprises a plurality of first LED sets connected to one another in parallel, each said first LED set comprising a plurality of LEDs connected to one another in series.
5. LED light source module of claim 1, further comprising an ACDC rectifying unit for converting an AC voltage into the DC voltage.
6. A constant-current unit structure for use with an LED light source module, comprising:
a constant-current unit comprising a voltage stabilizing unit having an input end, a first output end, and a second output end, the input end receiving a DC voltage, and the first output end outputting a constant current; and
a resistor parallel-connected between the first output end and the second output end.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An apparatus, comprising:
a substrate having a plurality of through-holes therethrough; and
an integrated circuit (IC) socket frame to mount to the substrate, the IC socket frame having a plurality of beam features, each extending from a socket frame body and corresponding in arrangement to the plurality of through-holes through the substrate.
2. The apparatus of claim 1, wherein at least one of the plurality of beam features includes an orientation feature to orientate the substrate to the IC socket.
3. The apparatus of claim 1, wherein the plurality of through-holes are shaped and sized to receive the plurality of beam features therethrough.
4. The apparatus of claim 1, wherein the plurality of through-holes and the plurality of beam features have corresponding mating shapes selected from the group of: an \u201cL\u201d shape, a circular shape, a triangular shape, a rectangular shape, and a combination of different shapes.
5. The apparatus of claim 1, wherein the plurality of beam features have a through-hole extending therethrough from a first end of the beam feature, to a second end of the beam feature, and through the socket frame body.
6. The apparatus of claim 1, wherein the plurality of beam features provide a mechanism to facilitate at least one of the following: alignment and support of the substrate, alignment of an IC socket retention mechanism to the apparatus, and alignment of a thermal management mechanism to the apparatus.
7. The apparatus of claim 1, wherein the substrate further comprises at least one orientation feature to correspond to the orientation feature of the at least one of the plurality of beam features.
8. The apparatus of claim 1, further comprising an array of pin contacts on an upper region of the socket frame body to engage with a plurality of pins on the substrate.
9. The apparatus of claim 1, further comprising a plurality of conductive contacts on a lower surface of the socket frame body.
10. An integrated circuit (IC) socket to connect to a substrate, comprising:
a socket frame body; and
a plurality of beam features extending from the socket frame body, each of the plurality of beam features spaced apart from the others of the plurality of beam features and having a first end connected to an upper surface of the socket frame and a second end spaced apart from the socket frame body.
11. The IC socket of claim 10, wherein the plurality of beam features have a through-hole extending therethrough from the first end thereof to the second end thereof.
12. The IC socket of claim 11, wherein through-hole further extends through the socket frame body.
13. The IC socket of claim 10, wherein the plurality of beam features have an exterior shape selected from the group of: an \u201cL\u201d shape, a circular shape, a triangular shape, a rectangular shape, and a combination of different shapes.
14. The IC socket of claim 10, wherein at least one of the plurality of beam features includes an orientation feature.
15. The IC socket of claim 14, wherein the orientation feature is selected from the group of: a shape of the beam feature, a size of the beam feature, and combinations thereof.
16. The IC socket of claim 10, further comprising an array of pin contacts on an upper region of the socket frame body to engage with a plurality of pins of an IC.
17. A substrate to connect to an IC socket frame, comprising:
an substrate material; and
a plurality of through-holes through the substrate material, the plurality of through-holes to receive a corresponding plurality of beam features of an IC socket frame therein.
18. The substrate of claim 17, wherein the plurality of through-holes define an opening having a shape selected from the group of: an \u201cL\u201d shape, a circular shape, a triangular shape, a rectangular shape, and a combination of different shapes.
19. The substrate of claim 17, wherein at least one of the plurality of through-holes includes an orientation feature.
20. The substrate of claim 19, wherein the orientation feature is selected from the group of: a shape of the through-hole, a size of the through-hole, and combinations thereof.
21. A system comprising:
an integrated circuit (IC) substrate having a plurality of through-holes therethrough;
an socket frame to mount to the IC substrate, the socket frame having a plurality of beam features extending from a socket frame body and corresponding to the plurality of through-holes through the IC substrate; and
a double data rate memory electrically coupled to the IC substrate.
22. The system of claim 21, wherein at least one of the plurality of beam features includes an orientation feature.
23. The system of claim 21, further comprising a mechanism to retain the IC substrate in a fixed relationship with the socket frame.